JPH0377476U - - Google Patents
Info
- Publication number
- JPH0377476U JPH0377476U JP13919689U JP13919689U JPH0377476U JP H0377476 U JPH0377476 U JP H0377476U JP 13919689 U JP13919689 U JP 13919689U JP 13919689 U JP13919689 U JP 13919689U JP H0377476 U JPH0377476 U JP H0377476U
- Authority
- JP
- Japan
- Prior art keywords
- conductive foil
- straight conductive
- printed wiring
- wiring
- straddled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 10
- 239000011247 coating layer Substances 0.000 claims description 2
- 229910000833 kovar Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Description
第１図は本考案に係る部分多層プリント配線板
の一実施例を示した略示平面図、第２図のａ，ｂ
は第１図の関所Ａにおける夫々拡大平面図と縦断
側面図、第３図のａ，ｂは第１図の関所Ｂにおけ
る夫々拡大平面図と縦断側面図、第４図は電気溶
接手段の一例を示す側面説明図、第５図は本考案
の一部材である直状導電性箔体の用意された１セ
ツトを示す平面図、第６図は同上直状導電性箔体
の拡大横断面図、第７図は関所Ｃにおける他実施
例による直状導電性箔体の結線状態を示した平面
図である。
１……基板、２……プリント配線、３ａ，３ｂ
……プリント配線のランド、４……直状導電性箔
体、４ａ，４ｂ……直状導電性箔体の端子、４ｃ
……直状導電性箔体の電気絶縁被覆層。
FIG. 1 is a schematic plan view showing an embodiment of a partially multilayer printed wiring board according to the present invention, and a and b in FIG.
1 is an enlarged plan view and a vertical side view of checkpoint A in FIG. 1, a and b in FIG. 3 are an enlarged plan view and a vertical side view of checkpoint B in FIG. 5 is a plan view showing one prepared set of the straight conductive foil which is a part of the present invention, and FIG. 6 is an enlarged cross-sectional view of the same straight conductive foil. , FIG. 7 is a plan view showing the connection state of a straight conductive foil body according to another embodiment at checkpoint C. 1... Board, 2... Printed wiring, 3a, 3b
...Land of printed wiring, 4...Straight conductive foil body, 4a, 4b...Terminal of straight conductive foil body, 4c
...An electrically insulating coating layer of a straight conductive foil body.
Claims (1)
ーンによる多数のプリント配線が施され、当該プ
リント配線のうち、その所要一対のランド間にあ
つて、他のプリント配線上に接着させた直状導電
性箔体を跨装すると共に、当該直状導電性箔体の
両端子を電気溶接手段により上記各ランドに接続
し、当該直状導電性箔体の少なくともプリント配
線側には電気絶縁被覆層が形成されていることを
特徴とする部分多層プリント配線板。 (2) プリント配線のランド間を接続する直状導
電性箔体の巾員が１mm以下、その材質がＣｕ，Ａ
ｌまたはコバールで、厚さが０．０３〜０．１mm
である請求項(1)記載の部分多層プリント配線板
。[Claims for Utility Model Registration] (1) A large number of printed wirings each having a predetermined pattern are formed on one or both sides of a board, and among the printed wirings, between the required pair of lands, other printed wiring A straight conductive foil adhered to the wiring is straddled, and both terminals of the straight conductive foil are connected to each land by electric welding, and at least the print of the straight conductive foil is straddled. A partially multilayer printed wiring board characterized by having an electrically insulating coating layer formed on the wiring side. (2) The width of the straight conductive foil connecting between the lands of the printed wiring is 1 mm or less, and the material is Cu or A.
l or Kovar, thickness 0.03-0.1mm
The partially multilayer printed wiring board according to claim (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13919689U JPH0377476U (en) | 1989-11-30 | 1989-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13919689U JPH0377476U (en) | 1989-11-30 | 1989-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377476U true JPH0377476U (en) | 1991-08-05 |
Family
ID=31686257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13919689U Pending JPH0377476U (en) | 1989-11-30 | 1989-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377476U (en) |
-
1989
- 1989-11-30 JP JP13919689U patent/JPH0377476U/ja active Pending