JPH0382567U - - Google Patents
Info
- Publication number
- JPH0382567U JPH0382567U JP14378189U JP14378189U JPH0382567U JP H0382567 U JPH0382567 U JP H0382567U JP 14378189 U JP14378189 U JP 14378189U JP 14378189 U JP14378189 U JP 14378189U JP H0382567 U JPH0382567 U JP H0382567U
- Authority
- JP
- Japan
- Prior art keywords
- clip
- mounting lead
- connection failure
- failure prevention
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 230000002265 prevention Effects 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は従来例を示すハトメを使用した半田付
け部の１部縦断面図、第２図〜第８図は本考案の
一実施例を示す接続不良防止クリツプを使用した
半田付け部の１部縦断面図、第９図ａ，ｂ，ｃ，
ｄ、及び第１０図ａ，ｂは本考案の接続不良防止
クリツプを部品取付リードに使用した一実施例を
示すプリント基板の銅箔部の上面図である。
１……プリント基板、２……プリント基板の銅
箔面、３……部品の取付リード、４……ハトメ、
５……半田、６……ハトメのつば、７……ワイヤ
ーの係合手段部、８……ワイヤー、９……銅箔パ
ターン、１０……銅板。
Fig. 1 is a vertical sectional view of a part of a soldering part using a grommet showing a conventional example, and Figs. 2 to 8 show a part of a soldering part using a connection failure prevention clip showing an embodiment of the present invention. Sectional longitudinal sectional view, Fig. 9 a, b, c,
d and FIGS. 10a and 10b are top views of the copper foil portion of a printed circuit board showing an embodiment in which the connection failure prevention clip of the present invention is used as a component mounting lead. 1... Printed circuit board, 2... Copper foil surface of printed circuit board, 3... Parts mounting lead, 4... Eyelet,
5... Solder, 6... Eyelet collar, 7... Wire engagement means, 8... Wire, 9... Copper foil pattern, 10... Copper plate.
Claims (1)
として延長して形成し、プリント基板の銅箔面に
突出させた部品の取付リードに前記係合手段によ
り係合させ、前記の自由端をプリント基板の銅箔
面に近接させて取り付けて半田付けを行うことを
特徴とする接続不良防止クリツプ。 (2) 前記接続不良防止クリツプの材料としてワ
イヤーを使用し、前記係合手段として前記部品の
取付リードの周囲にワイヤーを巻付けて行うこと
を特徴とする請求項(1)記載の接続不良防止クリ
ツプ。 (3) 前記接続不良防止クリツプの材料として銅
板を使用し、前記係合手段として銅板の内部に銅
板の長手方向に平行にして設けた切り込みに前記
部品の取付リードを貫通させて、同取付リード部
分を両側より前記切り込み部分で挟持せしめて行
うことを特徴とする請求項(1)記載の接続不良防
止クリツプ。[Claims for Utility Model Registration] (1) An engaging means is provided in the central portion, both ends are extended as free ends, and the engaging means is attached to a mounting lead of a component protruding from the copper foil surface of a printed circuit board. A clip for preventing poor connection, characterized in that the free end is attached and soldered close to the copper foil surface of a printed circuit board. (2) The connection failure prevention method according to claim 1, wherein a wire is used as the material of the connection failure prevention clip, and the wire is wound around a mounting lead of the component as the engagement means. Clip. (3) A copper plate is used as the material for the connection failure prevention clip, and the mounting lead of the component is passed through a cut parallel to the longitudinal direction of the copper plate inside the copper plate as the engagement means, and the mounting lead is 2. The connection failure prevention clip according to claim 1, wherein the clip is clamped between the cut portions from both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14378189U JPH0382567U (en) | 1989-12-12 | 1989-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14378189U JPH0382567U (en) | 1989-12-12 | 1989-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0382567U true JPH0382567U (en) | 1991-08-22 |
Family
ID=31690536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14378189U Pending JPH0382567U (en) | 1989-12-12 | 1989-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0382567U (en) |
-
1989
- 1989-12-12 JP JP14378189U patent/JPH0382567U/ja active Pending
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