JPH0383943U - - Google Patents

Info

Publication number
JPH0383943U
JPH0383943U JP1989144086U JP14408689U JPH0383943U JP H0383943 U JPH0383943 U JP H0383943U JP 1989144086 U JP1989144086 U JP 1989144086U JP 14408689 U JP14408689 U JP 14408689U JP H0383943 U JPH0383943 U JP H0383943U
Authority
JP
Japan
Prior art keywords
wire
bonding
wires
guide holes
bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989144086U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989144086U priority Critical patent/JPH0383943U/ja
Publication of JPH0383943U publication Critical patent/JPH0383943U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP1989144086U 1989-12-15 1989-12-15 Pending JPH0383943U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989144086U JPH0383943U (cs) 1989-12-15 1989-12-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989144086U JPH0383943U (cs) 1989-12-15 1989-12-15

Publications (1)

Publication Number Publication Date
JPH0383943U true JPH0383943U (cs) 1991-08-26

Family

ID=31690823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989144086U Pending JPH0383943U (cs) 1989-12-15 1989-12-15

Country Status (1)

Country Link
JP (1) JPH0383943U (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067342A (ja) * 2005-09-02 2007-03-15 Ultrasonic Engineering Co Ltd ワイヤボンディング方法およびワイヤボンディング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62176138A (ja) * 1986-01-29 1987-08-01 Toshiba Corp ワイヤボンデイング装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62176138A (ja) * 1986-01-29 1987-08-01 Toshiba Corp ワイヤボンデイング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067342A (ja) * 2005-09-02 2007-03-15 Ultrasonic Engineering Co Ltd ワイヤボンディング方法およびワイヤボンディング装置

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