JPH0392007U - - Google Patents
Info
- Publication number
- JPH0392007U JPH0392007U JP15103289U JP15103289U JPH0392007U JP H0392007 U JPH0392007 U JP H0392007U JP 15103289 U JP15103289 U JP 15103289U JP 15103289 U JP15103289 U JP 15103289U JP H0392007 U JPH0392007 U JP H0392007U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- terminal electrodes
- chip
- network
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
第１図は本考案の実施例に係るチツプＲネツト
ワークの平面図、第２図および第３図は本考案の
他の実施例に係るチツプＲネツトワークの平面図
、第４図は従来例のチツプＲネツトワークの平面
図、第５図は第４図のＡ−Ａ線に沿う断面図であ
る。
１……チツプＲネツトワーク、２……絶縁基板
、３，４……端子電極、５……抵抗膜、６，７…
…凹溝、８……保護膜、９，１０……取り付け電
極。
FIG. 1 is a plan view of a Chip R network according to an embodiment of the present invention, FIGS. 2 and 3 are plan views of a Chip R network according to other embodiments of the present invention, and FIG. 4 is a conventional example. FIG. 5 is a sectional view taken along line A--A in FIG. 4. 1... Chip R network, 2... Insulating substrate, 3, 4... Terminal electrode, 5... Resistive film, 6, 7...
...Concave groove, 8...Protective film, 9, 10... Mounting electrode.
Claims (1)
れ複数個の端子電極が形成され、その絶縁基板の
一方の主面にそれらの端子電極に接続された複数
個の抵抗膜が形成されてなるチツプＲネツトワー
クにおいて、 その絶縁基板の他方の対向する端縁の少なくと
もいずれか一方に、またはその絶縁基板の他方の
主面に、前記抵抗膜には接続されない取り付け電
極が形成されたことを特徴とするチツプＲネツト
ワーク。[Claims for Utility Model Registration] A plurality of terminal electrodes are formed on one opposing edge of a rectangular insulating substrate, and a plurality of terminal electrodes are formed on one main surface of the insulating substrate and connected to the terminal electrodes. In a chip R network in which a resistive film is formed, an attachment electrode that is not connected to the resistive film is attached to at least one of the other opposing edges of the insulating substrate or to the other main surface of the insulating substrate. Chip R network is characterized by the formation of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15103289U JPH0392007U (en) | 1989-12-29 | 1989-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15103289U JPH0392007U (en) | 1989-12-29 | 1989-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392007U true JPH0392007U (en) | 1991-09-19 |
Family
ID=31697350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15103289U Pending JPH0392007U (en) | 1989-12-29 | 1989-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392007U (en) |
-
1989
- 1989-12-29 JP JP15103289U patent/JPH0392007U/ja active Pending
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