JPH0393191A - Electroluminescence element - Google Patents
Electroluminescence elementInfo
- Publication number
- JPH0393191A JPH0393191A JP1228944A JP22894489A JPH0393191A JP H0393191 A JPH0393191 A JP H0393191A JP 1228944 A JP1228944 A JP 1228944A JP 22894489 A JP22894489 A JP 22894489A JP H0393191 A JPH0393191 A JP H0393191A
- Authority
- JP
- Japan
- Prior art keywords
- current limiting
- carbon black
- fine powder
- limiting layer
- binder resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005401 electroluminescence Methods 0.000 title abstract description 3
- 239000000843 powder Substances 0.000 claims abstract description 34
- 239000011230 binding agent Substances 0.000 claims abstract description 22
- 239000006229 carbon black Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 9
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 12
- 229910002113 barium titanate Inorganic materials 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000003973 paint Substances 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 7
- 239000007822 coupling agent Substances 0.000 abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 5
- 239000012046 mixed solvent Substances 0.000 abstract description 4
- 238000005507 spraying Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 238000007711 solidification Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 239000004809 Teflon Substances 0.000 description 8
- 229920006362 Teflon® Polymers 0.000 description 8
- 239000012528 membrane Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 6
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- -1 Mn and Cu Chemical class 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- VYGUBTIWNBFFMQ-UHFFFAOYSA-N [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O Chemical compound [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O VYGUBTIWNBFFMQ-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 229910052454 barium strontium titanate Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
本発明は、混成型エレクトロルミネッセンス(以下EL
と略する)素子の改良に閲し、特にその電流制限層の導
電性微粉末の材質の改質に間するものである.The present invention relates to hybrid electroluminescence (hereinafter referred to as EL).
The purpose is to improve the device (hereinafter referred to as "abbreviation"), and in particular to modify the material of the conductive fine powder of the current limiting layer.
EL素子を応用したELディスプレイは、近年ポータブ
ルタイプのコンピュータの端末などに急速に普及しつつ
ある有望なフラットディスプレイの1つである.
EL素子には、薄瞑!IIEL素子とパウダー型EL素
子の2つのタイプが知られているが、最近ではiIM層
とパウダー層とを組み合わせた混成ff!EL.IIl
子(Hybrid EL素子あるいはConpos1
t EL素子とも呼ばれる〉も、有力なEL素子の1
種として注目されるようになってきた, (例えばGB
2176340,QB2176−341)
第1図は、混成盟EL素子の構成を示した図である.こ
の図を用いて混成型EL4子の構造および製造方法を説
明する.
ガラス基板l上に、透明電極2としてITOなどの透明
電極材料をスパッタ、真空蒸着法などの方法により成膜
する.その上に発光層3を真空蒸着法、スバッタ法、M
OCVD法などの方法を用いて形成する.発光層の材質
としては、Z n S,Z n S e, C d
Sなどの■一■族化合物にMn,Cuなとの遷移金属や
Tb,Sm.Dyなどの希土類あるいはそれらのフッ化
物、塩化物などを発光中心としてドープしたものがよく
用いられる.モの上に、電流制限層4として導電性の微
粉末を有機バインダーで固めた数十μm程度の粉末層を
スプレー法などの方法によって成膜する.最後に、上部
電極5としてA1などの金属を真空蒸着あるいはスバッ
タ法で成膜することによりEL素子が完成する.
ドットマトリックス型のディスプレイパネルを製造する
場合は、その後、ダイアモンド針等を用いて機械的に引
っかくなどしてパターニングを行う.そのため、電流制
限層4の膜厚としては、5Bmから30μmの範囲が好
ましい.
前記電流制限層4は、発光の際、発光層の抵抗率が低下
し、EL素子に過剰な電流が流れて素子が熱破壊するの
を防ぐ役割を果たす.
しかしながら、電流制限層の抵抗は、大きければ大きい
ほど破壊に対しては安定になるが、あまり大きくすると
電流制限層での電圧降下が大きくなり、それがEL素子
の駆動電圧の上昇につながるので、おのづから限界があ
り、上記5μmから30μmの膜厚の範囲において 膜
厚方向に対し、単位薦積(jam’)当り10Ωから2
000Ωの抵抗罐、つまり、IXIO’Ω”cmから2
×106Ω●Cm程度の抵抗率のものがよい.前記導電
性微粉末の材質としては、バインダーで固めた後に前述
の抵抗率を持つ必要があるため、やはりI X 1 0
’Ω●Cmから2X10”Ωscm程度の抵抗率を持つ
ことが求められる.当初上記混成盟EL素子においては
、導電性微粉末の材質として、粉末型EL素子で従来用
いられていた、CuをコートしたZnS粉末がよく使わ
れていたが、最近では、黒色のため表示のコントラスト
が上がり、Cuの移動等によって経時的に抵抗罐の変化
しないM n O 2が用いられるようになってきた.EL displays, which utilize EL elements, are one of the promising flat displays that are rapidly becoming popular in portable computer terminals and the like. For EL elements, light meditation! Two types of EL devices are known: IIEL devices and powder-type EL devices, but recently hybrid FF! EL. IIl
Child (Hybrid EL element or Compos1
t (also called EL element) is one of the leading EL elements.
It has started to attract attention as a species (for example, GB
2176340, QB2176-341) Figure 1 is a diagram showing the configuration of a hybrid EL element. The structure and manufacturing method of the hybrid EL4 child will be explained using this figure. A transparent electrode material such as ITO is formed into a film as a transparent electrode 2 on a glass substrate l by a method such as sputtering or vacuum evaporation. A light emitting layer 3 is formed thereon by vacuum evaporation method, spatter method, M
Formed using a method such as OCVD. Examples of materials for the light emitting layer include ZnS, ZnSe, and Cd.
Group 1 compounds such as S, transition metals such as Mn and Cu, Tb, Sm. Those doped with rare earth elements such as Dy or their fluorides, chlorides, etc. as luminescent centers are often used. On top of the current limiting layer 4, a powder layer of about several tens of micrometers made of conductive fine powder hardened with an organic binder is formed by a method such as a spray method. Finally, the EL element is completed by depositing a metal such as A1 as the upper electrode 5 by vacuum evaporation or sputtering. When manufacturing a dot matrix type display panel, patterning is then performed by mechanical scratching using a diamond needle or the like. Therefore, the thickness of the current limiting layer 4 is preferably in the range of 5 Bm to 30 μm. The current limiting layer 4 serves to prevent the resistivity of the light-emitting layer from decreasing during light emission and excessive current flowing through the EL element, thereby preventing the element from being thermally destroyed. However, the larger the resistance of the current limiting layer, the more stable it becomes against destruction, but if it is too large, the voltage drop in the current limiting layer becomes large, which leads to an increase in the driving voltage of the EL element. There is a limit naturally, and in the film thickness range of 5 μm to 30 μm mentioned above, 10 Ω to 2 Ω per unit recommended area (jam') in the film thickness direction.
000Ω resistance box, that is, IXIO'Ω”cm to 2
A resistivity of approximately ×106Ω●Cm is preferable. The material of the conductive fine powder needs to have the above-mentioned resistivity after being hardened with a binder, so I
It is required to have a resistivity of about 'Ω●Cm to 2X10''Ωscm.Initially, the above hybrid EL element was coated with Cu, which was conventionally used in powder type EL elements, as the material for the conductive fine powder. ZnS powder was often used, but recently MnO2 has been used because its black color increases display contrast and its resistance does not change over time due to the movement of Cu.
しかしながら、上記従来の混成!!!EL素子において
は、使用中に輝度むらや寿命短縮が起こると7fう重大
な間履点があった.However, the above conventional hybrid! ! ! In the case of EL elements, there was a serious problem of 7f when uneven brightness and shortened lifespan occurred during use.
本発明は、前期従来の問題点を解決するためになされた
ものであって、
透明な絶縁性基板上に透明電極、発光層、導電性微粉末
をバインダー樹脂で固定した電流制限層と背面電極を、
順次積層したエレクトロルミネッセンス素子において、
前記電流制限層の導電性微粉末に、カーボンブラックを
主成分にした導電性微粉末を用いている.
まず、カーボンブラックは、チャンネルブラック、ファ
ーネスブラック、アセチレンブラックなと、製法に応じ
て名付けられた、種々の物があり、それらの物性もかな
り異なっているが、粒径3μm以下であれば、これらの
いずれを用いても構わない.
カーポンプラックを主成分にした導電性lll粉末とし
ては、カーボンブラックのみよりなる導電性微粉末、カ
ーボンブラックにカーボンブラック以外の導電性微粉末
を混ぜた粉末等が例示できる.中でもカーボンブラック
とチタン酸バリウム系半導体の混合物が混合物の電ス抵
抗の温度係数が0以上となりやすいので好ましい.
この、チタン酸バリウム系半導体であるが、これは強誘
電体であるチタン酸バリウム、チタン酸ストロンチウム
、チタン酸鉛などにイットリウムやセリウム等を小量添
加して導電性が付与されているものである.これも、粒
径が3μm以下であることが好ましい.
これら二種類の物質の、微粉体状での抵抗率は、例えば
黄銅電極で挟んで8kgの加重をかけて測定した場合、
カーボンブラックでlO−2〜10’Ω◆C ms
チタン酸バリウム系半導体で10’〜10eΩ・cm程
度の値を示す.前期電流制限層にとって好ましい導電性
微粉末の抵抗率は104〜106Ω・amなので、これ
らを混合することによってこの範囲の抵抗率とすること
が出来る.
これらの粉体の混合物は、いずれも通常の粉体状または
溶剤分散性ゾル状で使用され、これらはバインダー樹脂
を用いて固定される.バインダー樹脂溶液に分散させる
前に、分散性を改善させるためにカップリング剤によっ
て処理することもでき、この場合には、アルミニウム系
カップリング剤が最も好ましい効果を与える.
バインダー樹脂には例えば、ビニル系樹脂、ポリエステ
ル系樹脂、ボリアミド系樹脂、セルロース系樹脂、ポリ
ウレタン系樹脂、尿素系樹脂、エボキシ系樹脂、メラミ
ン系樹脂、シリコーン系樹脂等が挙げられるが、特に、
水酸基、カルボキシル基、スルホニル基、ニトロ基等の
極性基や、エボキシ基、イソシアヌル基、シラノール基
等の反応性基を有した高分子材料が好適に用いられる.
また、前記バインダー樹脂、カーボンブラック微粉末、
及びチタン酸バリウム系半導体微粉末それぞれの体積混
合比率は、下記式Φ〜■をすべて満たすことが好ましい
.
C
a 1. 5 ■A
B 150% ■C
15% ■(た
だし、Aはチタン酸バリウムの実体積の電流制限層体積
に対する比率,Bはバインダー樹脂の実体積の電流制限
層体積に対する比率,Cはカ一ボンブラックの実体積の
電流制限層体積に対する比率)
上記実体積とは、粉末材料の場合はみかけではない真の
体積、樹脂材料の場合は溶媒等のぬけた固化状態の体積
を示す.
上記式■及び■を満たさない場合には電流制限層の抵抗
が大きくなりやすい.式■を満たさない場合には、電流
制限層に亀裂が生ずるなどの成膜性の低下を来す.
また、電流制限層の内部構造に於で最も重要なのは、電
気抵抗の場所的な均一さてあるが、本発明においては、
カーボンブラックのクラスターが生成しやすく、これが
発生しないような分散法を用いるか、またはこれを除去
することが必要である.カーポンブラックの巨大粒子の
除去は、バインダー樹脂溶液に分散させた後に孔径5μ
m以下のフィルターで濾過することによって達成される
.The present invention was made to solve the problems of the previous generation, and includes a current limiting layer and a back electrode in which a transparent electrode, a light emitting layer, and a conductive fine powder are fixed with a binder resin on a transparent insulating substrate. of,
In sequentially laminated electroluminescent elements,
The conductive fine powder of the current limiting layer is a conductive fine powder whose main component is carbon black. First of all, there are various types of carbon black, such as channel black, furnace black, and acetylene black, which are named according to the manufacturing method, and their physical properties are quite different, but if the particle size is 3 μm or less, these It doesn't matter which one you use. Examples of conductive powder containing carpon black as a main component include conductive fine powder consisting only of carbon black, and powder containing carbon black mixed with conductive fine powder other than carbon black. Among these, a mixture of carbon black and barium titanate semiconductor is preferred because the temperature coefficient of electrical resistance of the mixture tends to be 0 or more. This barium titanate-based semiconductor is made by adding small amounts of yttrium, cerium, etc. to ferroelectric materials such as barium titanate, strontium titanate, and lead titanate to give it conductivity. be. It is also preferable that the particle size is 3 μm or less. The resistivity of these two types of substances in fine powder form is measured, for example, when they are sandwiched between brass electrodes and a load of 8 kg is applied.
lO-2~10'Ω◆C ms with carbon black
It shows a value of about 10' to 10 eΩ·cm for barium titanate-based semiconductors. Since the resistivity of the conductive fine powder preferable for the current limiting layer is 104 to 106 Ω·am, the resistivity within this range can be obtained by mixing these powders. Mixtures of these powders are used in the form of ordinary powder or solvent-dispersible sol, and these are fixed using a binder resin. It can also be treated with a coupling agent to improve dispersibility before being dispersed in the binder resin solution, and in this case, an aluminum-based coupling agent provides the most favorable effect. Examples of binder resins include vinyl resins, polyester resins, polyamide resins, cellulose resins, polyurethane resins, urea resins, epoxy resins, melamine resins, silicone resins, etc.
Polymer materials having polar groups such as hydroxyl, carboxyl, sulfonyl, and nitro groups, and reactive groups such as epoxy, isocyanuric, and silanol groups are preferably used.
Further, the binder resin, carbon black fine powder,
It is preferable that the volume mixing ratio of each of the barium titanate-based semiconductor fine powder satisfies all of the following formulas Φ to ■. C a 1. 5 ■A B 150% ■C
15% (However, A is the ratio of the actual volume of barium titanate to the volume of the current limiting layer, B is the ratio of the actual volume of the binder resin to the volume of the current limiting layer, and C is the ratio of the actual volume of carbon black to the current limiting layer volume. (ratio to volume) The above actual volume refers to the true volume, which is not an apparent volume, in the case of powder materials, and the volume in the solidified state excluding solvent, etc., in the case of resin materials. If the above formulas (■) and (■) are not satisfied, the resistance of the current limiting layer tends to increase. If the formula (■) is not satisfied, the film forming properties will deteriorate, such as cracks appearing in the current limiting layer. Furthermore, the most important thing in the internal structure of the current limiting layer is the local uniformity of electrical resistance, and in the present invention,
Carbon black clusters tend to form, and it is necessary to use a dispersion method that prevents this from occurring, or to remove it. Removal of large particles of carpon black is possible after dispersing it in a binder resin solution.
This is achieved by filtration with a filter of less than m.
本発明は、従来の混成型EL素子が使用中に輝度むらや
寿命短綿をおこす原因が、 「電流制限層の電気抵抗が
発光による温度上昇で低下し、より大きな電流が流れる
ことによってさらに温度上昇が進む」という悪循環によ
って引き起こされるものであることに鑑みなされたもの
であって、本発明によれば、温度上昇に対する電気抵抗
の変化が正または非常に小さい、カーボンブラックとチ
タン酸バリウム系半導体の混合物またはカーボンブラッ
クを電流制限層として使用しているため、従来のM n
O 2を用いた場合の発熱によるブレークダウンが防
止される.The present invention solves the problem of uneven brightness and short lifespan of conventional hybrid EL elements during use. This invention was developed in view of the fact that the temperature rise is caused by a vicious cycle of "progressive temperature rise", and according to the present invention, carbon black and barium titanate based semiconductors have a positive or very small change in electrical resistance with respect to temperature rise. or carbon black as the current limiting layer, compared to the conventional M n
Breakdown due to heat generation when using O 2 is prevented.
以下、本発明の実施例をいくつか紹介する.実施例−1
ガラス基板1上に、透明電極2としてITOを反応性ス
バッタ法を用いて約500nmの厚さ成膜した後、フォ
トリソグラフィ法により所定の形状にパターニングした
.続いて、発光層3としてMnを0.3ffi量%ドー
ブしたZnSを約1 9 ms電子ビーム蒸着法を用い
て成膜した.
次に、カーボンブラック(商品名SEAST 9H :
東海h−1ン)をアルミニウム系カップリング剤(商品
名^L−M : 味の素)の混合溶剤溶液に分散させ
、カーボンブラックとバインダー樹脂(商品名阿トHO
: 日本を゛Iン)の同化後の体積比率が2対8になる
ようにバインダー樹脂とシンナーとの混合液を加えてか
らlOμmテフロンメンプランフィルターで謔遇し、次
に5μmテフロンメンプランフィルターで濾過した塗料
をスプレー法で塗装、乾燥させ、抵抗率が4X10’Ω
●cmで膜厚が16μmの電流制限714を形成した.
作11された電流制限層4は、空隙の見られない、樹H
によって固定化された、ほぼ均一厚みの黒色の層となっ
ていた.
次に、背爾電極5として、AIを真空蒸着法でlμm程
度成膜し、その後、前記の電流制限層4とAI11f5
を、ダイヤモンド針を用いて日時にスクライプすること
により、所定の背画電極パターンを形成した.
このように作製されたEL素子を駆動回路に接続して発
光させたところ、全面均一に発光しており、輝度むらも
観測されなかった.
実施例−2
カーボンブラック(商品名SEAST 98 :束11
1h−参゛ン〉とチタン酸バリウム系半導体(商品名P
TC−SN: 共立窯票原料)の6:l(体積比〉の混
合物をアルミニウム系カップリング剤(商品名AL−M
:味の素)の混合溶剤溶液に分散させ、粉体の体積の合
計とバインダー樹脂(商品名MR−110 : 日本
1オン)の体積の比率が1.75対8.25になるよう
にバインダー樹脂とシンナーとの混合液を加えてから実
施例−1同様lOμmテフロンメンブランフィルターで
濾過し、次に5μmテフロンメンプランフィルターで濾
過して塗料を作製した.該塗料を、実施例−1と同様に
作製した発光層3.透明電極2つきガラス基板1上にス
プレー法で塗装、乾燥させ、抵抗率が1x1oaΩ・c
mでMWが15μmの電流制限層4を形成し1:!.次
に、実施例−1同様背面電極5を形成し、ダイヤモンド
針を用いてスクライブすることにより、所定の背面電極
パターンを形成した.
このように作製されたEL素子を駆動回路に接続して発
光させたところ、全面均一に発光しており、輝度むらも
amされなかった.
実施例−3
カーポンプラック(商品名SEAST 9H :東海カ
ー本゛シ)とチタン酸バリウム系半導体(商品名PTC
−SN:共立窯業原料)の11:5(体積比)の混合物
をアルミニウム系カップリング剤〈商品名AL−M:味
の素〉の混合溶剤溶液に分散させ、粉体の体積の合計と
バインダー樹脂(商品名MR−110 :日本1Iン〉
の体積の比率が4対6になるようにバインダー樹脂とシ
ンナーとの混合液を加えてから、実施例−1同1110
μmテフロンメンプランフィルターで濾過し、次に6μ
mテフロンメンプランフィルターで濾過して塗料を作製
した.該塗料を、実施例−1と同様に作製した発光層3
,透明電極2つきガラス基板1上にスプレー法で塗装、
乾燥させ、抵抗率がaxio’Ω・amで膜厚が15μ
mの電流制限層4を形成した.次に、実施例一l同様背
面電極6を形成し、ダイヤモンド針を用いてスクライプ
することにより、所定の背面電極パターンを形成した.
このように作製されたEL素子を駆動回路に接続して発
光させたところ、全面均一に発光しており、輝度むらも
観測されなかった.
ここで、上記実施例−3で作製した電流制限層の、温度
による抵抗率の変化を測定した.測定結果を第2図に示
す.第2図から明らかなように、本実施例の電流制限層
の抵抗率は温度によらず、ほぼ一定の値を示していた.
比較例
電解法にて作製したM n O 2粉末をボールミルで
粉砕して平均粒径0.3μmとし、これをMnO2粉末
の体積とバインダー樹脂(商品名MR−110 :日本
セ゛オン〉の体積の比率が3対7になるようにバインダ
ー樹脂とシンナーとの混合液を加えてから、実施例−1
同様10μmテフロンメンブランフィルターで濾過し、
次に5μmテフロンメンブランフィルターで濾過して塗
料を作製した.該塗料を、実施例−1と同様に作製した
発光層3,透明電極2つきガラス基板l上にスプレー法
で塗装、乾燥させ、抵抗率が5X10’Ω●cmで膜厚
が20μmの電流制限層4を形成した.次に、実施例−
1同様背面電極5を形成し、ダイヤモンド針を用いてス
クライブすることにより、所定の背面電極パターンを形
成した.
このように作製されたEL素子を駆動回路に接続して発
光させたところ、輝度を上げるに従い、パネルの温度が
上昇し、パネル内の最も明るい部分の素子から順次プレ
ークダウンが生じた.電流制限層の、温度による抵抗率
の変化を実施例−3と同様に測定し、その結果を第2図
に示す.第2図から、上記実施例−3の電流制限層の抵
抗率が温度によらず一定であったことがわかる.Below, some examples of the present invention will be introduced. Example 1 ITO was formed as a transparent electrode 2 on a glass substrate 1 to a thickness of about 500 nm using a reactive sputtering method, and then patterned into a predetermined shape using a photolithography method. Subsequently, as a light-emitting layer 3, a film of ZnS doped with 0.3ffi of Mn was formed using an electron beam evaporation method for about 19 ms. Next, carbon black (product name SEAST 9H:
Tokai h-1) was dispersed in a mixed solvent solution of an aluminum coupling agent (product name: L-M: Ajinomoto), carbon black and a binder resin (product name: ATO HO).
: Add a mixture of binder resin and thinner so that the volume ratio after assimilation is 2:8, and then pass through a 10μm Teflon membrane filter, and then pass through a 5μm Teflon membrane filter. The filtered paint was applied by spraying and dried, and the resistivity was 4X10'Ω.
●A current limiter 714 with a film thickness of 16 μm was formed in cm.
The current limiting layer 4 made in the fabricated layer 11 is made of wood H with no visible voids.
It was fixed as a black layer of almost uniform thickness. Next, as the back electrode 5, an AI film of about 1 μm is formed by vacuum evaporation, and then the current limiting layer 4 and the AI film 11f5 are formed.
A predetermined background electrode pattern was formed by scribing the time and date using a diamond needle. When the EL element prepared in this way was connected to a drive circuit and emitted light, it emitted light uniformly over the entire surface, and no unevenness in brightness was observed. Example-2 Carbon black (product name SEAST 98: bundle 11
1h-reference and barium titanate semiconductor (product name P
TC-SN: A mixture of 6:l (volume ratio) of Kyoritsu kiln slip raw material) was mixed with an aluminum-based coupling agent (trade name AL-M).
: Ajinomoto) in a mixed solvent solution, and mix with the binder resin so that the ratio of the total volume of the powder to the volume of the binder resin (trade name MR-110: Japan 1-on) is 1.75:8.25. After adding the mixture with thinner, it was filtered with a 10 μm Teflon membrane filter as in Example 1, and then filtered with a 5 μm Teflon membrane filter to prepare a paint. A light-emitting layer 3 was prepared using the paint in the same manner as in Example-1. Painted on glass substrate 1 with 2 transparent electrodes by spray method, dried, and resistivity was 1 x 1 oaΩ・c.
A current limiting layer 4 with a MW of 15 μm is formed at 1:! .. Next, a back electrode 5 was formed as in Example 1, and a predetermined back electrode pattern was formed by scribing with a diamond needle. When the EL element thus prepared was connected to a drive circuit and emitted light, it emitted light uniformly over the entire surface, and there was no unevenness in brightness. Example-3 Carpon rack (product name SEAST 9H: Tokai Car Honshi) and barium titanate semiconductor (product name PTC)
-SN: Kyoritsu Ceramic Raw Materials) at a ratio of 11:5 (volume ratio) is dispersed in a mixed solvent solution of an aluminum coupling agent (trade name AL-M: Ajinomoto), and the total volume of the powder and the binder resin ( Product name MR-110: Japan 1Iin>
After adding a mixture of binder resin and thinner so that the volume ratio of
Filter with a μm Teflon membrane filter, then 6 μm
A paint was prepared by filtering with a Teflon membrane filter. The luminescent layer 3 was prepared using the paint in the same manner as in Example-1.
, painted by spray method on glass substrate 1 with 2 transparent electrodes,
After drying, the resistivity is axio'Ω・am and the film thickness is 15μ.
A current limiting layer 4 of m was formed. Next, a back electrode 6 was formed as in Example 1l, and a predetermined back electrode pattern was formed by scribing with a diamond needle. When the EL element prepared in this way was connected to a drive circuit and emitted light, it emitted light uniformly over the entire surface, and no unevenness in brightness was observed. Here, changes in resistivity due to temperature of the current limiting layer produced in Example 3 above were measured. The measurement results are shown in Figure 2. As is clear from FIG. 2, the resistivity of the current limiting layer of this example exhibited a nearly constant value regardless of temperature. Comparative Example MnO2 powder produced by electrolytic method was pulverized with a ball mill to give an average particle size of 0.3 μm, and the ratio of the volume of MnO2 powder to the volume of binder resin (trade name MR-110: Nippon Seon) was calculated. After adding a mixture of binder resin and thinner in a ratio of 3:7, Example-1
Filtered with the same 10μm Teflon membrane filter,
Next, a paint was prepared by filtering through a 5 μm Teflon membrane filter. The paint was applied by spraying onto a glass substrate l with a light-emitting layer 3 and transparent electrodes 2 prepared in the same manner as in Example-1, dried, and current-limited with a resistivity of 5 x 10' Ω cm and a film thickness of 20 μm. Layer 4 was formed. Next, Example-
A back electrode 5 was formed in the same manner as in Example 1, and a predetermined back electrode pattern was formed by scribing using a diamond needle. When the EL elements fabricated in this way were connected to a drive circuit and emitted light, as the brightness increased, the temperature of the panel rose, and breakdown occurred sequentially starting from the brightest elements in the panel. The change in resistivity of the current limiting layer due to temperature was measured in the same manner as in Example 3, and the results are shown in Figure 2. From FIG. 2, it can be seen that the resistivity of the current limiting layer of Example 3 was constant regardless of temperature.
本発明によれば、電流制限層を用いたEL素子の輝度む
らを改善し、ブレークダウンを防止し、EL素子の信頼
性を向上することが出来る.また、本発明のEL素子は
、電流制限層の抵抗率が温度によらず一定であるため、
所要電力の時間変動が少なく、かつ輝度の時間変動も少
ない.According to the present invention, it is possible to improve the brightness unevenness of an EL element using a current limiting layer, prevent breakdown, and improve the reliability of the EL element. Further, in the EL element of the present invention, since the resistivity of the current limiting layer is constant regardless of temperature,
There is little temporal variation in the required power, and there is also little temporal variation in brightness.
第1図は、本発明に係る混成型エレクトロルミネッセン
ス素子の概略断面図、第2図は実施例一3および比較例
において作製した電流制限層の抵抗率の温度変化を示す
図である.
1.ガラス基板 2.透明電極
3.発光層 4.電流制限層
5.背面電極
第
1
図
2.25
2,50 2.75
1l絶対温度
2.59
(κ) / 10000
324
第
2
図FIG. 1 is a schematic cross-sectional view of a hybrid electroluminescent device according to the present invention, and FIG. 2 is a diagram showing temperature changes in resistivity of current limiting layers fabricated in Example 13 and Comparative Example. 1. Glass substrate 2. Transparent electrode 3. Light emitting layer 4. Current limiting layer 5. Back electrode 1st Figure 2.25 2,50 2.75 1l Absolute temperature 2.59 (κ) / 10000 324 Figure 2
Claims (3)
微粉末をバインダー樹脂で固定した電流制限層と背面電
極を、順次積層したエレクトロルミネッセンス素子にお
いて、前記電流制限層の導電性微粉末に、カーボンブラ
ックを主成分にした導電性微粉末を用いたことを特徴と
するエレクトロルミネッセンス素子。(1) In an electroluminescent element in which a transparent electrode, a light-emitting layer, a current-limiting layer in which conductive fine powder is fixed with a binder resin, and a back electrode are sequentially laminated on a transparent insulating substrate, the conductive fine powder in the current-limiting layer An electroluminescent element characterized by using conductive fine powder whose main component is carbon black.
バリウム系半導体の混合物である請求項1記載のエレク
トロルミネッセンス素子。(2) The electroluminescent device according to claim 1, wherein the conductive fine powder is a mixture of carbon black and a barium titanate semiconductor.
ての条件を満たすバインダー樹脂、カーボンブラック微
粉末、及びチタン酸バリウム系半導体微粉末の混合物で
構成されている請求項2記載のエレクトロルミネッセン
ス素子。 C/A≧1.5(1) B≧50% (2) C≧5% (3) (ただし、Aはチタン酸バリウムの実体積の電流制限層
体積に対する比率、Bはバインダー樹脂の実体積の電流
制限層体積に対する比率、Cはカーボンブラックの実体
積の電流制限層体積に対する比率)(3) The current limiting layer is composed of a mixture of a binder resin, a carbon black fine powder, and a barium titanate semiconductor fine powder that satisfy all the conditions of formulas (1) to (3) below. The electroluminescent device described. C/A≧1.5 (1) B≧50% (2) C≧5% (3) (However, A is the ratio of the actual volume of barium titanate to the current limiting layer volume, and B is the actual volume of the binder resin. (C is the ratio of the actual volume of carbon black to the volume of the current limiting layer)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1228944A JPH0393191A (en) | 1989-09-04 | 1989-09-04 | Electroluminescence element |
| US07/559,328 US5229628A (en) | 1989-08-02 | 1990-07-26 | Electroluminescent device having sub-interlayers for high luminous efficiency with device life |
| GB9017001A GB2235580B (en) | 1989-08-02 | 1990-08-02 | Electroluminescence device |
| KR1019900011852A KR910005494A (en) | 1989-08-02 | 1990-08-02 | Electroluminescence device |
| DE4024602A DE4024602A1 (en) | 1989-08-02 | 1990-08-02 | ELECTROLUMINESCENCE DEVICE |
| FR9009913A FR2650688A1 (en) | 1989-08-02 | 1990-08-02 | ELECTROLUMINESCENCE DEVICE |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1228944A JPH0393191A (en) | 1989-09-04 | 1989-09-04 | Electroluminescence element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0393191A true JPH0393191A (en) | 1991-04-18 |
Family
ID=16884300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1228944A Pending JPH0393191A (en) | 1989-08-02 | 1989-09-04 | Electroluminescence element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0393191A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999038362A1 (en) * | 1998-01-23 | 1999-07-29 | Central Research Laboratories Limited | A device for emitting light |
-
1989
- 1989-09-04 JP JP1228944A patent/JPH0393191A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999038362A1 (en) * | 1998-01-23 | 1999-07-29 | Central Research Laboratories Limited | A device for emitting light |
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