JPH0396039U - - Google Patents

Info

Publication number
JPH0396039U
JPH0396039U JP1990004122U JP412290U JPH0396039U JP H0396039 U JPH0396039 U JP H0396039U JP 1990004122 U JP1990004122 U JP 1990004122U JP 412290 U JP412290 U JP 412290U JP H0396039 U JPH0396039 U JP H0396039U
Authority
JP
Japan
Prior art keywords
signal pattern
semiconductor element
land
package structure
line width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990004122U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990004122U priority Critical patent/JPH0396039U/ja
Publication of JPH0396039U publication Critical patent/JPH0396039U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68Shapes or dispositions thereof
    • H10W70/682Shapes or dispositions thereof comprising holes having chips therein
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP1990004122U 1990-01-19 1990-01-19 Pending JPH0396039U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990004122U JPH0396039U (2) 1990-01-19 1990-01-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990004122U JPH0396039U (2) 1990-01-19 1990-01-19

Publications (1)

Publication Number Publication Date
JPH0396039U true JPH0396039U (2) 1991-10-01

Family

ID=31507885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990004122U Pending JPH0396039U (2) 1990-01-19 1990-01-19

Country Status (1)

Country Link
JP (1) JPH0396039U (2)

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