JPH0410066U - - Google Patents
Info
- Publication number
- JPH0410066U JPH0410066U JP5182690U JP5182690U JPH0410066U JP H0410066 U JPH0410066 U JP H0410066U JP 5182690 U JP5182690 U JP 5182690U JP 5182690 U JP5182690 U JP 5182690U JP H0410066 U JPH0410066 U JP H0410066U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- electronic parts
- base tape
- slit
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004080 punching Methods 0.000 claims 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
図は本考案の実施例を示すものであつて、第１
図は供給テープの斜視図、第２図はテイクアツプ
中の側面図、第３図は全体側面図、第４図は他の
実施例の斜視図、第５図は従来手段の断面図であ
る。
１……供給テープ、２……ベーステープ、４…
…ポケツト、６，１９……カバーテープ、８，９
……スリツト、Ｃ……電子部品。
The figure shows an embodiment of the present invention.
2 is a side view of the supply tape during take-up, FIG. 3 is an overall side view, FIG. 4 is a perspective view of another embodiment, and FIG. 5 is a sectional view of the conventional means. 1...supply tape, 2...base tape, 4...
...Pocket, 6,19...Cover tape, 8,9
...Slit, C...Electronic parts.
Claims (1)
ツトに電子部品を収納して成り、このベーステー
プの上面に装着されるカバーテープに、スリツト
を形成したことを特徴とする電子部品の供給テー
プ。 A supply tape for electronic parts, characterized in that electronic parts are stored in pockets formed by punching a base tape, and a slit is formed in a cover tape attached to the upper surface of the base tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5182690U JPH0410066U (en) | 1990-05-17 | 1990-05-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5182690U JPH0410066U (en) | 1990-05-17 | 1990-05-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410066U true JPH0410066U (en) | 1992-01-28 |
Family
ID=31571602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5182690U Pending JPH0410066U (en) | 1990-05-17 | 1990-05-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410066U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100492666B1 (en) * | 2001-01-23 | 2005-06-03 | 가부시키가이샤 도쿄 웰드 | Paper carrier tape manufacturing method |
| JP2016037321A (en) * | 2014-08-11 | 2016-03-22 | 住友ベークライト株式会社 | Electronic component packaging material, electronic component package, manufacturing method of electronic component package, and method for taking out electronic component |
-
1990
- 1990-05-17 JP JP5182690U patent/JPH0410066U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100492666B1 (en) * | 2001-01-23 | 2005-06-03 | 가부시키가이샤 도쿄 웰드 | Paper carrier tape manufacturing method |
| JP2016037321A (en) * | 2014-08-11 | 2016-03-22 | 住友ベークライト株式会社 | Electronic component packaging material, electronic component package, manufacturing method of electronic component package, and method for taking out electronic component |
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