JPH04102341A - Manufacture of tab tape - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing a TAB tape, and more specifically, the present invention relates to a method for manufacturing a TAB tape, and more specifically, a TAB tape forming a part of a conductive pattern formed of a metal with good conductivity such as copper. The present invention relates to a method for manufacturing a TAB tape, in which a first metal layer and a second metal layer are formed on each connection surface of an inner lead and an outer lead by plating.

(Prior art) In recent years, semiconductor devices have become smaller, thinner, have more bins, finer pitches, etc. in semiconductor devices.
(Tape Autoa+a[ed Bonding
) -r-7 is being used.

Such a TAB tape has a conductive pattern made of a highly conductive metal such as copper formed on one side of a film made of electrically insulating resin such as polyimide resin.

The inner leads that form part of the conductor pattern of such TAB tape are connected to the semiconductor chip (honding).
The outer lead is connected to an external circuit provided on a board or the like.

By the way, in the connection portion, in order to improve the connection, both surfaces of the inner lead and the outer lead are normally plated with tin to a strength fjffl.

However, in terms of -a, the outer lead, which is connected after the inner lead, is not good due to the diffusion of the constituent metals of the outer lead to the outside due to the heat history received before the connection of the outer lead. It may be difficult to connect to.

For this reason, TAB tapes are being developed in which metal layers are formed on each connection surface of the inner lead and the outer lead by laminating a metal layer of a type and/or thickness suitable for the connection on each connection surface.

(Problems to be Solved by the Invention) According to the TAB tape, inner leads and outer leads can be easily connected, and connection workability can be improved.

However, in the process of forming metal layers of different types and/or thicknesses on the connecting surfaces of inner leads and outer leads by plating, conventionally, a masking agent such as photoresist is applied alternately to one side of the obtained TAB tape. It was necessary to apply plating to predetermined positions.

For this reason, the TAB tape manufacturing process becomes complicated, and the resulting TAB tape also becomes expensive.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to easily form a first metal layer and a second metal layer on each connection surface of an inner lead and an outer lead by plating separately during a normal TAB tape manufacturing process. The purpose of the present invention is to propose a method for manufacturing TAB tape that can be used in various ways.

(Means for Solving the Problems) As a result of studies to achieve the above-mentioned object, the inventors of the present invention have found that by plating before and after forming holes such as Tivis holes in the film, or by applying photoresist, etc. The first metal layer and the second metal layer can be easily formed on both sides of the REET by separate plating by changing the thickness of the masking agent layer formed by changing the thickness of the masking agent layer and utilizing the difference in removal time of the masking agent layer. We discovered what we could do and arrived at the present invention.

That is, the present invention provides a first metal layer and a first metal layer on each connection surface of the second lead and the outer lead, which constitute a part of the conductor pattern formed of a metal with good conductivity such as copper in the TAB tape. When forming the second metal layer by plating, photoresist or the like is applied to both sides of the film, which is made of electrically insulating resin such as polyimide resin and has a conductive layer made of metal such as copper on one side. After coating to form a masking agent layer and patterning, a conductor pattern made of a metal with good conductivity such as copper is obtained by plating on one side of the conductor layer side of the film, and then a film on which the conductor pattern is formed. plating one side of the circuit pattern to form a first metal layer only on the circuit pattern;
After that, a hole such as a device hole or a wind hole is formed in the film on the back side of the film surface on which the conductor pattern is formed, and the reed end protrudes inward.
The method for manufacturing a TAB tape is characterized in that a second metal layer is formed by plating on a portion of the lead end projecting into the hole where the metal forming the conductor pattern body is exposed.

Further, the present invention provides a first metal layer and a second metal layer on each connection surface of the inner lead and the outer lead, which constitute a part of the conductor pattern formed of a metal with good conductivity such as copper in the TAB tape. When forming the TAB layer by plating, a layer such as copper foil is placed on one side of the film made of electrically insulating resin such as polyimide resin, which constitutes the TAB tape and has holes such as device holes and wind holes formed in advance. A thin metal plate with good conductivity is bonded with an adhesive, and a photoresist or the like is applied to the surface of the thin metal plate to form a masking agent layer and patterned, and then the masking agent layer is thicker than the thickness of the masking agent layer applied to the surface of the thin metal plate. After forming a masking agent layer on the back side of the film against the adhesive surface of the thin metal plate,
A conductor pattern with a predetermined shape is obtained on a thin metal plate, and then the masking agent layer remaining on the obtained conductor pattern is removed along with a part of the masking agent layer on the back side, and then plating is applied to the conductor pattern. After that, after removing the masking agent layer on the back side, the first metal layer is formed only on the part where the metal forming the conductor pattern body is exposed at the end of the lead that protrudes into the hole such as the device hole. A method of manufacturing a TAB tape is characterized in that the second metal layer is formed by plating.

The present invention having such a configuration is suitably applied when the first metal layer and the second metal layer are made of different metal types and/or have different thicknesses.

(Function) According to the present invention, the first metal layer and the second metal layer can be formed separately by plating before and after forming holes such as device holes in the film.

In addition, by setting a difference in the thickness of the masking agent layer applied above and below a thin metal plate such as copper foil, and utilizing the difference in removal time when removing the masking agent layer, the masking agent layer can be removed during and after removal.
The first metal layer and the second metal layer can be formed separately by plating.

Therefore, in the TAB tape manufacturing process, for example, a first metal layer and a second metal layer of different types and/or thicknesses are easily formed on each connection surface of the outer lead and the inner lead. It is possible.

(Structure of the invention) The present invention will be explained in more detail using the drawings.

FIG. 1 shows an explanatory diagram illustrating a manufacturing method of a so-called two-layer type TAB tape in which a conductor pattern is formed by plating.

In FIG. 1, a conductive layer 12 made of a metal such as copper is formed on one side of a film 100 made of an electrically insulating resin such as a polyimide resin by electroless plating, vapor deposition, sputtering, etc. [FIG. 1(a)] A masking agent such as a photoresist is applied to both sides of the film 10 shown in FIG. 1 [ ] (b) L where, Fig. 1 (b)
The masking agent layer 14.20 shown in FIG. Reference numeral 24 indicates a residual portion that remains during the development and the like.

The conductor layer 12 of the film 10 shown in FIG. 1(b) like this
Only the removed portion 18 of the masking agent layer 14 formed above is removed by development or the like, and a conductive pattern 26 made of a highly conductive metal such as copper is formed by plating on the conductive layer 12 that appears after the removal. Figure 1 (c)].

Furthermore, the remaining portion 16 of the masking agent layer 14 is removed by dissolving or the like with a stripping solution, and then the conductor layer 12 that appears after the removal is removed by etching or the like, thereby completing the conductor pattern 26 on the film 10 [first Figure (d)].

In the present invention, the conductor pattern 2 formed in this way
A first metal layer 28 is formed by plating only on 6 [FIG. 1(e)].

For this plating, it is possible to easily form the metal layer 28 only on the conductor pattern 26 by employing electrolytic plating using the conductor pattern 26 as one of the electrodes.

Next, after removing the removed portion 22 of the masking agent layer 20 formed on the opposite side (back surface) of the film 10 to the surface (front surface) on which the conductive pattern 26 is formed, by development or the like, the removed portion 22 is removed. The film 10 portion is etched to form holes such as device holes and window holes [Eleventh] (f)].

The lead ends forming the conductor pattern 26 protrude from inside this bill, and an exposed portion where the metal forming the main body of the conductor pattern 26 is exposed appears.

In the present invention, the second metal layer 30 is formed on the exposed portion of the conductive pattern 26 by plating [Fig.
g) Ko.

The second metal layer 30 may be a metal layer made of a different type of metal from the metal forming the first metal layer 28, or a metal layer made of the same type of metal as the first metal layer 28 and having a different thickness. or a metal layer having a different metal type and thickness from the first metal layer 28.

As the plating at this time, electroless plating is preferable because the second metal layer 30 is formed only on the exposed portion of the conductor pattern 26.

When manufacturing the two-layer type TAB tab shown in FIG. 1, after forming the conductor pattern 26 on the film 10 by plating as shown in FIG. 2 [FIG. 2 (I>)]
, before removing the residual masking agent layer 16 on the surface [Figure 2 (■
)], the first metal layer 28 may be formed by plating [
Figure 2 (II)].

Thereafter, device holes etc. are formed in the same manner as in the method shown in 1 [2], and a second metal layer 30 is further formed on the exposed portion of the conductor pattern 26 (FIG. 2 (IV)). (V)].

In addition, in Fig. 1, holes such as device holes are
However, after forming the conductive pattern 16 [FIG. 1(C)], the conductive pattern 16
Alternatively, after forming the first metal layer 28 thereon, holes such as Tivis holes are formed, and then the resists 46 and 24 on both sides of the film 10 are removed to form the second metal layer 30. good.

Next, a method for manufacturing a so-called three-layer type TAB tape in which a film and a conductor pattern are bonded together with an adhesive will be explained using FIG.

First, a film 50 made of an electrically insulating resin such as a polyimide resin, in which holes such as device holes are formed in advance.
Then, a thin metal plate 52' such as copper foil with good conductivity is bonded with an adhesive 54 [3rd V (a)], and this thin metal plate 5
Mask agent layer 5G such as photoresist formed on 2′
Patterning is applied to [Figure 3 (b)].

Note that the hatched portion 58 of the masking agent layer 56 is a removed portion that is removed before etching the thin metal plate 52' to form the conductor pattern 52, and the white portion 60 is the removed portion that is removed before etching the thin metal plate 52' to form the conductive pattern 52. When etching etc., the thin metal plate 52
′ is the residual portion remaining on top.

Thereafter, the thin metal plate 52' is etched to form the conductive pattern 52.
A thin metal plate 52' is placed on the film surface (back side) opposite to 2'.
A masking agent layer 62 is formed which is thicker than the masking agent layer 56 formed on the upper side (on the surface side of the film 50) [FIG.
c)].

By setting the thickness of the masking agent layer 62 to about 20 to 30 microns, it also serves as a blocking layer when the conductor pattern 52 is formed by etching the thin metal plate 52'.

Note that the thickness of the masking agent layer 56 on the thin metal plate 52' is usually about 2 to 3 μm.

Therefore, after forming the conductive pattern 52, the remaining portion 60 of the masking agent layer 56 remaining on the conductive pattern 52
Even if the masking agent layer 62 is removed, only a part of the thick masking agent layer 62 is removed.
2 [Figure 3 (e)].

A first metal layer 64 is formed by plating on the conductor pattern 52 in such a state [FIG. 3(f)], and the masking agent layer 62 is completely removed to form a film '50 in advance. The lead ends are made to protrude into holes such as device holes [Figure 3 (G)].

In the present invention, the second metal layer 66 is formed by plating on the exposed portion where the metal forming the main body of the conductor pattern 52 is exposed at the end of the lead protruding into the hole such as the device hole (see FIG. 3). blood)].

This plating is applied only to the exposed portion of the conductor pattern 52.
In order to form the metal layer 6G, electroless plating is preferable.

The second metal layer 66 may be a metal layer made of a different type of metal from the metal forming the first metal layer 64, or may be made of the same type of metal as the first metal layer 64 and have a different thickness. It may be a metal layer or a metal layer having a different metal type and thickness from the first metal layer 64.

In the manufacturing method shown in FIGS. 1 to 3 described above,
As the metal forming the first metal layer, any metal can be used as long as it can be attached onto the conductor pattern by plating.

Further, as the metal forming the second metal layer, any metal can be used as long as it can be attached by plating only to the exposed portion of the metal forming the conductor pattern body.

However, the type of metal and/or the thickness of the metal layer forming the first metal layer and the second metal layer is determined depending on whether the bonding surface of the outer layer or the bonding surface of the inner layer will be used.

In other words, the bonding surface of the outer lead is coated with alloys such as solder, nickel (Ni), gold (Au), etc.
) etc. are preferably used.

On the other hand, metal such as tin (Sn) is preferably used for the surface of the inner lead that becomes the real surface.

The first or second metal layer made of these metals may be a single layer made of a single metal, or may be two or more layers made of different types of metals.

Note that the thickness of the metal layer formed on the bonding surface of the outer lead is usually about 15 to 3 μm, and the thickness of the metal layer formed on the bonding surface of the inner lead is about 0.5 to 1 μm. .

(Example) Example 1 First, a conductor layer 12 was formed on one side of a polyimide resin film 10 by electroless plating, and then photoresist was applied to both sides to form a masking agent layer 14 and 20, and patterned. 1 (a) (b)].

Further, after removing the removed portion 18 of the masking agent layer 14 on the conductor layer 12 by development or the like and applying copper additive plating to the pattern formed, the remaining portion 16 of the masking agent layer 14 is dissolved with a stripping solution. At the same time, the conductor layer 12 where the remaining portion 16 is located is also removed by etching, and the film 10 is removed.
A conductive pattern 26 was formed thereon [Fig. 1(c)(d)
3. On the conductor pattern 2G formed in this way, a solder plating layer with a thickness of about 3 μm as the first metal layer 28 was formed by electrolytic plating using the conductor pattern 26 as an electrode, and the first IZ(e) ].

Next, the film on which the conductor pattern 26 is formed)
Mask agent layer 2 applied on the opposite side (back side) of surface 0
A hole such as a device hole is formed in the film 10 by removing the removed portion 22 of the film 10, and the end of the reed is made to protrude into the hole [FIG. 1(f)].

Thereafter, at the end of the reed, the conductor pattern 26
A tin plating layer 30 with a thickness of about 05 μm is formed by electroless plating on the exposed portion where the copper forming the main body is exposed [
Figure 1 (g>].

In the TAB tape obtained in this manner, the first metal layer 28 on which the solder plating layer is formed is used as the font surface of the outer lead, and the second metal layer 30 on which the tin plating layer is formed is placed on the inch-plated surface. It was used as the bonding surface of the lead.

The connection between the TAB tape, the semiconductor chip, and the lead frame was good, and no problems occurred during the connection work.

Example 2 In Example 1, the first metal layer 28 serving as the bonding surface of the outer lead of the TAB tape is electrolytically plated using the conductor pattern 26 as an electrode.
The same procedure as in Example 1 was carried out, except that a nickel plating layer with a thickness of about 05 μm was formed on the upper surface of each plate, and a gold plating layer with a thickness of about 10 μm was further formed.

The connection workability of the obtained TAB tape was as good as in Example 1.

(Effects of the Invention) According to the present invention, during the TAB tape manufacturing process,
Since a metal layer made of metals of different types and/or thicknesses can be easily formed on the bonding surfaces of the outer lead and inner lead by plating, TA
Compared to the case where plating is applied after manufacturing the B tape,
It is possible to significantly simplify the manufacturing process of TAB tapes.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram explaining one embodiment of the present invention, Fig. 2-3
The figures each show explanatory diagrams for explaining other embodiments. In the figure, 10.50--Film, 14.20.56-Mask agent layer, 26--Conductor pattern, 28.64--First metal layer, 30.66--Second metal layer.

Claims (1)

[Claims] 1. A first metal layer and a second metal layer are formed on each connection surface of the inner lead and the outer lead, which constitute a part of the conductor pattern formed of a metal with good conductivity such as copper in the TAB tape. When forming the TAB tape by plating, photoresist or the like is applied to both sides of the film, which is made of electrically insulating resin such as polyimide resin and has a conductive layer made of metal such as copper on one side. After forming and patterning a masking agent layer, a conductor pattern made of a metal with good conductivity such as copper is obtained by plating on one side of the conductor layer side of the film, and then the film on which the conductor pattern is formed is plated. Plating is applied to one side to form the first metal layer only on the circuit pattern, and then a device hole or window is formed on the back side of the film where the conductor pattern is formed so that the lead end protrudes inward. A hole such as a hole is formed in the film, and at the end of the lead protruding into the hole, a second conductor pattern is formed in the part where the metal forming the conductor pattern body is exposed.
T characterized in that the metal layer is formed by plating.
AB tape manufacturing method. 2. Plating a first metal layer and a second metal layer on each connection surface of the inner lead and outer lead, which constitute a part of the conductor pattern formed of a metal with good conductivity such as copper in the TAB tape. When forming the TAB tape, one side of the film made of electrically insulating resin such as polyimide resin, which constitutes the TAB tape and has holes such as device holes and window holes formed in advance, is coated with a conductive material such as copper foil. A thin metal plate is bonded with an adhesive, and a photoresist or the like is applied to the surface of the thin metal plate to form a masking agent layer and patterned, and then a masking agent layer that is thicker than the thickness of the masking agent layer applied to the surface of the thin metal plate is formed. A conductor pattern of a predetermined shape is obtained on the back side of the film on the adhesive side of the thin metal plate, and then the masking agent layer remaining on the obtained conductor pattern is removed together with a part of the masking agent layer on the back side. , plating is applied to form the first metal layer only on the conductor pattern, and then, after removing the masking agent layer on the back side, the conductor pattern body is attached to the lead end protruding into the hole such as the device hole. A method for manufacturing a TAB tape, which comprises forming a second metal layer by plating on a portion where the metal to be formed is exposed. 3. The first metal layer and the second metal layer are different in type of metal and/or
or the TA according to claim 1 or 2 having different thicknesses.
B-tape manufacturing method.