JPH0410496U

JPH0410496U -

Info

Publication number: JPH0410496U
Application number: JP5125990U
Authority: JP
Priority date: 1990-05-18
Filing date: 1990-05-18
Publication date: 1992-01-29

Description

[Brief explanation of the drawing]

第１図乃至第３図はこの考案に係る導電ダンパ
の構造の実施例を示し、第１図は錦糸線を縫い付
けた箇所に２列の穴を設けたダンパ材の平面図、
第２図は導電ダンパ成形時の平面図、第３図はダ
ンパ材を切断して形成した導電ダンパの平面図で
ある。第４図乃至第６図は従来例を示し、第４図
は錦糸線を縫い付けたダンパ材の平面図、第５図
は導電ダンパ成形時の平面図、第６図はダンパ材
を切断して形成した導電ダンパの平面図である。主な符号の説明、１……ダンパ材、２……錦糸
線、２ａ……錦糸線の引出部、３……ダンパ材に
設けた穴、４……金型成形切断した導電ダンパ。 1 to 3 show an example of the structure of a conductive damper according to this invention, and FIG. 1 is a plan view of a damper material in which two rows of holes are provided at the locations where tinsel wire is sewn;
FIG. 2 is a plan view of the conductive damper when it is formed, and FIG. 3 is a plan view of the conductive damper formed by cutting the damper material. Figures 4 to 6 show conventional examples. Figure 4 is a plan view of the damper material with tinsel wire sewn on, Figure 5 is a plan view of the conductive damper being molded, and Figure 6 is the cut of the damper material. FIG. Explanation of main symbols: 1... Damper material, 2... Tinsel wire, 2a... Pull-out portion of tinsel wire, 3... Hole provided in damper material, 4... Conductive damper molded and cut.

Claims

[Scope of Claim for Utility Model Registration] In the structure of a conductive damper for a speaker unit formed by molding and cutting a damper material with tinsel wire sewn on, a hole provided in the damper material and a tinsel sewn on the hole. A structure of a conductive damper, characterized in that the damper material is formed and cut to form a lead-out portion of the tinsel wire.