JPH04107944A - Inspection socket of electronic device and inspection method using said socket - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a socket for testing electronic devices and a testing method, and particularly relates to a technique that is effective when applied to devices such as semiconductor devices that have leads leading to the outside. It is something.

[Conventional technology]

Various inspections are performed in the manufacturing process of electronic devices. Among these, electronic devices that have external leads, such as semiconductor devices, are used by mounting them on printed circuit boards, etc. However, if they are mounted on printed circuit boards during inspection, the work efficiency will be greatly reduced, so sockets are used to secure them to the specified location. We are trying to carry out inspections. Furthermore, since there are a large number of electronic devices to be inspected, the attachment and detachment of electronic devices to and from sockets is often automated. Furthermore, automation will be essential in the future. In such a case, if a relative misalignment occurs between the socket and the electronic device, it is desirable that the lead does not suffer from visual defects or the like due to contact with the terminals of the socket.

Furthermore, since the properties of socket terminals and the like may have an effect compared to when an electronic device is actually mounted on a printed circuit board, etc., it goes without saying that the smaller the difference between the two, the better.

Under these circumstances, various measurement sockets have been proposed. For example, there is one in which the lower part of a contact pin that contacts an electronic device board is formed into a U-shape. Japanese Unexamined Patent Application Publication No. 1989-1980 shows such a test socket.
There is No.-152099.

[Problem to be solved by the invention]

In the above-described conventional technology, it is desirable that the leads of the electronic device and the contact pins always match in position; however, in rare cases, misalignment may occur. In such a case, the lead of the electronic device may be pinched between the contact pins, or the load may be concentrated when pressing the electronic device against one point of the lead, resulting in poor appearance (defective deformation) of the lead. In addition, in many cases, such contact pins are made of iron plated with gold, so the properties of the contact pins may not be reflected to some extent in the test results, and may not actually be used for electronics on printed circuit boards. There were two cases where the test results were slightly different from those obtained when the device was installed.

An object of the present invention is to provide a socket that does not cause lead bending even if there is a misalignment in the positional relationship between the socket and the electronic device, and an inspection socket that can obtain extremely similar results when the electronic device is mounted on a printed circuit board. and to provide testing methods.

[Means to solve the problem]

Representative means of the invention disclosed in this application will be described below. That is,
An electronic device characterized by an insulating film having a conductive pattern formed thereon, an elastic body disposed below the insulating film, a base supporting the elastic body, and a contact portion connecting the conductive pattern to an external circuit. This is a socket for testing the device. In addition, there is a method for testing an electronic device having an external lead, in which a conductive pattern of an insulating film on which a conductive pattern is formed is brought into contact with a piece of the electronic device to be tested. An elastic body is placed to inspect electronic devices.

[Effect]

According to the above-described means, even if misalignment occurs between the socket and the electronic device, uniform pressure is applied to all contact surfaces, so that deformation of the leads does not occur and the yield is significantly improved.

Furthermore, since it is possible to use a conductive pattern formed on an insulating film used for printed circuit boards and the like, it is possible to perform inspection in a state closer to actual mounting, and more accurate inspection results can be obtained.

〔Example〕

FIG. 1 is a perspective view of a test socket according to an embodiment of the present invention, and FIG. 2 is a side view of the test socket shown in FIG.

In FIG. 1, an electronic device 1 to be inspected is a semiconductor device having a gull wing type external lead 2. As shown in FIG. The socket of the present invention includes an insulating film 3 having a conductive pattern 4 formed on its surface, a sponge 5 which is an elastic material placed under the film 3, a base 6 supporting the sponge 5, and the conductive pattern. 4 and a contact portion 7 for connection with an external measuring device.

The insulating film is made of polyimide resin or the like, and the conductive pattern 4 formed on the surface of the conductive pattern 4 is formed on the target semiconductor device 1 by pasting a material such as copper on the film 3 and using a technique such as etching. It is formed to correspond to the external lead 2 and then plated with silver or the like.

Therefore, even if the conductive pattern 4 is formed on the film 3, it will be on substantially the same plane. A sponge 5 as an elastic material is fixed and arranged under this film with an adhesive. Also, a conductive pattern 4 formed on the film 3
is electrically connected to a contact portion 7 connected to an external measuring device (not shown) near the base 6 on which the sponge 5 is placed. This contact portion 7 is fixed to the heath 6 and indirectly fixes the sponge 5.

Next, the inspection process will be explained.

First, the semiconductor device 1 and the conductive pattern 4 of the socket are positioned. This positioning can be performed using known techniques. After positioning, the semiconductor device 1 is lowered to come into contact with the conductive pattern 4 formed on the insulating film. In this way, the semiconductor device 1 descends and contacts the conductive pattern 4, and at the same time is pressed and fixed. Known techniques can be used for this conveying means and fixing means. As a result, the sponge 5 disposed under the film 3 is elastically deformed, and the seed 2 and the conductive pattern 4 are brought into sufficient contact with each other, and at the same time, the pressure applied to the lead 2 is dispersed over the entire contact surface. Therefore, even if positional deviation occurs, pressure is prevented from being applied to one point. In this state, a desired inspection is carried out and the semiconductor device 1 is selected as to whether it is good or defective by an external inspection device (not shown). Thereafter, the semiconductor device 1 is removed from the socket and transported. Further, by using the conductive patterns as the sense line 4a and the Faune line 4b, it is possible to always grasp the applied load, making it possible to apply accurate conditions in the inspection process.

[Embodiment 2] In FIG. 3, the electronic device to be inspected is generally a Q-type device having a J-bent type external lead 9.

F, J, (Quad Flat J-le
This is called a ``added Package''. In this embodiment, a conductive pattern 11 is provided on the surface of the Q
, F, and J are formed in four directions so as to correspond to the external leads 9. For the rest, the same ones as shown in the first embodiment can be used.

According to this embodiment, it is also possible to use the electronic device having external leads extending in four directions.

〔Effect of the invention〕

The following describes what can be obtained by typical inventions disclosed in this application.

(1) The contact and non-contact surfaces between the socket and the lead of the electronic device are almost flat, so even if the socket and the electronic device are not positioned accurately, the pressure when pressing against one point of the lead is reduced. Since there is no concentration, defects such as lead bending do not occur.

(2) Due to (1) above, automation of electronic devices can be performed more efficiently.

(3) By using an elastic material suitable for the strength of the lead of the electronic device, it is possible to test many types of electronic devices.

(4) Use of conductive patterns allows for more accurate testing than conventional sockets. Although the present invention has been described above with respect to a semiconductor device which is the background of the invention, it goes without saying that the present invention is not limited to the above embodiments and can be modified in various ways without departing from the gist thereof.

For example, in addition to the sense and force lines of the above embodiments, the conductive patterns can also be used as guard lines to form ground lines between the conductive patterns to prevent signal interference.

Further, as the elastic material, other elastic materials such as rubber may be used. Alternatively, a socket with a positioning guide added to the socket itself may be used. Furthermore, if it is particularly necessary, it is possible to realize various circuit technologies on the conductive film and obtain test results that are closer to the actual mounting state, and by forming a conductive pattern on the back of the film as a ground line, It is possible to achieve even better impedance matching.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a test socket according to an embodiment of the present invention, FIG. 2 is a side O film of the test socket shown in FIG. 1, 4, 11 conductive pattern, 4a force line,
4b sense line, 5゜12-sponge, 6,13・
Base, 7, 14 connection pins. Figure 1 Figure 2

Claims (1)

[Claims] 1. An insulating film on which a conductive pattern is formed, an elastic body disposed below the insulating film, a base supporting the elastic body, and a contact connected to the conductive pattern. 1. A socket for testing an electronic device, comprising: a socket for testing an electronic device; 2. A method for testing an electronic device having external leads, in which the lead of the electronic device to be tested is brought into contact with a conductive pattern of an insulating film on which a conductive pattern is formed, the step of testing the insulating film. A method for inspecting an electronic device, comprising placing an elastic body underneath and bringing the leads of the electronic device into contact with the elastic body.