JPH04110708A - Device for measuring surface - Google Patents
Device for measuring surfaceInfo
- Publication number
- JPH04110708A JPH04110708A JP23004590A JP23004590A JPH04110708A JP H04110708 A JPH04110708 A JP H04110708A JP 23004590 A JP23004590 A JP 23004590A JP 23004590 A JP23004590 A JP 23004590A JP H04110708 A JPH04110708 A JP H04110708A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- measured
- projected
- scanning
- scanner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、表面測定装置に係り、とくに鋳物におけるパ
リの検出に好適な表面測定装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a surface measuring device, and particularly to a surface measuring device suitable for detecting pars in castings.
鋳物において、パリは寸法精度に悪影響を及ぼすため、
パリ取りは重要な工程である。In casting, Paris has a negative effect on dimensional accuracy, so
Deburring is an important process.
従来、パリ取りは人手によるものが主流である。Conventionally, paring has been mainly done manually.
自動化においてもパリの検出は行われてなく、切削工具
や研削工具の動作経路を鋳物表面の形状に教示しておき
、しかも切削工具や研削工具と鋳物表面との接触圧力が
一定となるように圧力センサーで監視し、鋳物形状にな
らって切削工具や研削工具を動作させることにより突起
部分を切削あるいは研削し、パリの除去を行っている。Even in automation, Paris detection is not performed, and the operating path of the cutting tool or grinding tool is taught to the shape of the casting surface, and the contact pressure between the cutting tool or grinding tool and the casting surface is kept constant. This is monitored by a pressure sensor, and the protrusions are cut or ground by operating a cutting tool or grinding tool that follows the shape of the casting to remove debris.
しかしながら、上記従来例においては、教示位置からの
工具位置のずれをリアルタイムで検出することができな
いため、工具位置のずれを生じた場合には鋳物を削り込
むことがあるという不都合があった。However, in the conventional example described above, it is not possible to detect the deviation of the tool position from the taught position in real time, so there is a problem that the casting may be ground if the tool position deviation occurs.
さらに、パリが圧力センサーを作動させるのに十分な強
度を持っている場合に、パリの除去が不完全になるとい
う問題点もあった。Furthermore, if the paris is strong enough to activate the pressure sensor, there is also the problem that the removal of the paris is incomplete.
本発明の目的は、かかる従来例の有する不都合を改善し
、とくに非接触で連続的に、しかも正確に表面上の突起
物の高さを測定できる表面測定装置を提供することにあ
る。SUMMARY OF THE INVENTION An object of the present invention is to improve the disadvantages of the conventional method and to provide a surface measuring device that can continuously and accurately measure the height of protrusions on a surface in a non-contact manner.
そこで、本発明では、レーザ光を発射するためのレーザ
光発射手段と、レーザ光発射手段からのレーザ光の方向
を変化させ被測定物の表面を走査するための走査手段と
、被測定物の表面で反射したレーザ光を集光するための
集光手段と、集光されたレーザ光の強さを計測するため
の光量計測手段と、光量計測手段からの情報と走査手段
からの情報により被測定物の表面形状を求めるための情
報処理手段とからなるという構成を採っている。Therefore, in the present invention, a laser beam emitting means for emitting a laser beam, a scanning means for changing the direction of the laser beam from the laser beam emitting means and scanning the surface of the measured object, and a scanning means for scanning the surface of the measured object by changing the direction of the laser beam from the laser beam emitting means, A condensing means for condensing the laser beam reflected on the surface, a light amount measuring means for measuring the intensity of the focused laser beam, and a light receiving means using information from the light amount measuring means and information from the scanning means. The system is configured to include an information processing means for determining the surface shape of the object to be measured.
これによって前述した目的を達成しようとするものであ
る。This aims to achieve the above-mentioned purpose.
[作用]
■、レーザ光発射手段から発射されたレーザ光は一定周
期で回転振動している走査手段で方向を変えられ、被測
定物を走査するように投光される。[Function] (2) The direction of the laser beam emitted from the laser beam emitting means is changed by the scanning means which rotates and oscillates at a constant period, and the laser beam is projected so as to scan the object to be measured.
■、被測定物に投光されたレーザ光は被測定物の表面で
反射される。(2) The laser beam projected onto the object to be measured is reflected by the surface of the object to be measured.
■1反射したレーザ光は集光手段で集光される。(1) The reflected laser beam is focused by a focusing means.
■、集光されたレーザ光は光量計測手段の受光面に投影
される。(2) The focused laser beam is projected onto the light receiving surface of the light amount measuring means.
■、光量計測手段では投影されたレーザ光の強さに比例
した電気信号を出力する。(2) The light amount measuring means outputs an electric signal proportional to the intensity of the projected laser beam.
■、光量計測手段からの電気信号は情報処理手段で信号
変換され、突起物によって反射レーザ光が遮られた場合
はローレベル信号、遮るものがない場合はハイレベル信
号となる。(2) The electric signal from the light amount measuring means is converted into a signal by the information processing means, and when the reflected laser beam is blocked by a protrusion, it becomes a low level signal, and when there is nothing blocking it, it becomes a high level signal.
■、コロ−ベル信号が検出されると、ハイレベル信号か
らローレベル信号に変化した時の走査手段の角度と、逆
にローレベル信号からハイレベル信号に変化した時の走
査手段の角度とが検出される。③ When a corobel signal is detected, the angle of the scanning means when the signal changes from a high level signal to a low level signal, and conversely the angle of the scanning means when a signal changes from a low level signal to a high level signal. Detected.
そして、これらの角度から所定の計算式により突起物の
高さが求められる。Then, the height of the protrusion is determined from these angles using a predetermined calculation formula.
以下、本発明の一実施例を第1図ないし第5図に基づい
て説明する。An embodiment of the present invention will be described below with reference to FIGS. 1 to 5.
第1図の実施例はレーザ光を発射するためのレーザ光発
射手段10と、レーザ光発射手段1oがらのレーザ光の
方向を変化させ被測定物60の表面を走査するための走
査手段20と、被測定物600表面で反射したレーザ光
を集光するための集光手段30と、集光されたレーザ光
の強さを計測するための光量計測手段40と、光量計測
手段40からの情報と走査手段20からの情報により被
測定物600表面形状を求めるための情報処理手段50
とから構成されている。The embodiment shown in FIG. 1 includes a laser beam emitting means 10 for emitting a laser beam, and a scanning means 20 for scanning the surface of an object to be measured 60 by changing the direction of the laser beam from the laser beam emitting means 1o. , a condensing means 30 for condensing the laser beam reflected on the surface of the object to be measured 600, a light amount measuring means 40 for measuring the intensity of the focused laser beam, and information from the light amount measuring means 40. and information processing means 50 for determining the surface shape of the object to be measured 600 based on the information from the scanning means 20.
It is composed of.
ここで、第2図に示されるようにレーザ光発射手段10
としてはレーザ発振器、走査手段20としてはスキャナ
、集光手段30としては集光レンズ、光量計測手段40
としてはフォトダイオードを用いているが、これらに限
定されるものではない
情報処理手段50としては、第3図に示されるように光
量計測手段40からの電気信号をパルス信号に変換する
ためのコンパレータ51と、スキャナ20からの角度信
号をコード化するためのエンコーダ54と、コンパレー
タ51とエンコーダ54とからの情報により所定の信号
処理を行うためのCPU52と、CPU52を動作させ
るための処理プログラムが格納されているROM53と
、データを一時的に記憶させておくためのRAM54と
から構成されている。Here, as shown in FIG. 2, the laser beam emitting means 10
as a laser oscillator, as the scanning means 20, a scanner, as the condensing means 30, a condensing lens, and as the light amount measuring means 40.
Although a photodiode is used as the information processing means 50, the information processing means 50 is not limited to these, but as shown in FIG. 51, an encoder 54 for encoding the angle signal from the scanner 20, a CPU 52 for performing predetermined signal processing based on information from the comparator 51 and the encoder 54, and a processing program for operating the CPU 52. It is composed of a ROM 53, which is stored in the computer, and a RAM 54, which is used to temporarily store data.
次に本実施例の動作について説明する。Next, the operation of this embodiment will be explained.
■レーザ発振器10から発射されたレーザ光は一定周期
で回転振動しているス キャナ20で方向を変えられ、
被測定物60を走査するように投光される。■The direction of the laser beam emitted from the laser oscillator 10 is changed by the scanner 20, which rotates and oscillates at a constant period.
The light is projected so as to scan the object to be measured 60.
■被測定物60に投光されたレーザ光は被測定物60の
表面で反射される。(2) The laser beam projected onto the object to be measured 60 is reflected by the surface of the object to be measured 60.
■反射したレーザ光は集光レンズ30で集光される。(2) The reflected laser beam is condensed by a condensing lens 30.
■集光されたレーザ光はフォトダイオード40の受光面
に投影される。(2) The focused laser beam is projected onto the light receiving surface of the photodiode 40.
■フォトダイオード40では投影されたレーザ光の強さ
に比例した電気信号を出力する。(2) The photodiode 40 outputs an electric signal proportional to the intensity of the projected laser beam.
■フォトダイオード40からの電気信号はコンパレータ
51で信号変換され、第4図に示されるようにパリによ
って反射レーザ光が遮られた場合はローレベル信号、遮
るものがない場合はハイレベル信号となる。■The electrical signal from the photodiode 40 is converted by the comparator 51, and as shown in Figure 4, if the reflected laser light is blocked by Paris, it becomes a low level signal, and if there is nothing blocking it, it becomes a high level signal. .
■CPU52でローレベル信号が検出されると、第5図
に示されるようにハイレベル信号からローレベル信号に
変化した時のスキャナ20の角度α1と、逆にローレベ
ル信号からハイレベル信号に変化した時のスキャナ20
の角度α2とが検出される。ここで、スキャナ20の回
転中心0と集光レンズ30の中心Eとを結ぶ線は被測定
物60の表面と平行であるとする。また、点Oから被測
定物60の表面に下ろした垂線の足をD、線分OD=乙
、ハリの高さをH、レーザ光による被測定物60の表面
でのハリの影の長さをXとすると、ハリの高さHは次の
式で求められる。■When a low level signal is detected by the CPU 52, as shown in FIG. 5, the angle α1 of the scanner 20 changes from a high level signal to a low level signal, and vice versa. Scanner 20 when
angle α2 is detected. Here, it is assumed that a line connecting the rotation center 0 of the scanner 20 and the center E of the condensing lens 30 is parallel to the surface of the object to be measured 60. In addition, the leg of the perpendicular line drawn from point O to the surface of the object to be measured 60 is D, the line segment OD = B, the height of the firmness is H, and the length of the shadow of the firmness on the surface of the object to be measured 60 by the laser beam. Assuming that is X, the height H of the firmness is determined by the following formula.
H; 乙 ・ X /
(X 士 と−jan
(90−θ))
ここで、
jan(90−α1)−j a n (90−α2)
θ =
(α1 + α2)/2
である。H; Otsu・X / (X and -jan (90-θ)) Here, jan (90-α1)-jan (90-α2)
θ = (α1 + α2)/2.
以上のように本発明によると、レーザ光を発射するため
のレーザ光発射手段と、レーザ光発射手段からのレーザ
光の方向を変化させ被測定物の表面を走査するための走
査手段と、被測定物の表面で反射したレーザ光を集光す
るための集光手段と、集光されたレーザ光の強さを計測
するための光量計測手段と、光量計測手段からの情報と
走査手段からの情報により被測定物の表面形状を求める
ための情報処理手段とからなるという構成を採っている
ために非接触で連続的に、しかも正確に表面上の突起物
の高さを測定できる。これがため、鋳物のパリ取りを完
全に自動化でき、しかもパリ取りを正確にそして高い生
産性で行うことができるという従来にない優れた表面測
定装置を提供することができる。As described above, according to the present invention, a laser beam emitting means for emitting a laser beam, a scanning means for changing the direction of the laser beam from the laser beam emitting means and scanning the surface of the object to be measured, and a scanning means for scanning the surface of the object to be measured by changing the direction of the laser beam from the laser beam emitting means. A condensing means for condensing the laser beam reflected on the surface of the object to be measured, a light amount measuring means for measuring the intensity of the focused laser beam, and information from the light amount measuring means and the scanning means. Since it is configured to include an information processing means for determining the surface shape of the object to be measured from the information, it is possible to continuously and accurately measure the height of protrusions on the surface without contact. Therefore, it is possible to provide an unprecedented and excellent surface measuring device that can completely automate deburring of castings and can perform deburring accurately and with high productivity.
50・・・・・情報処理手段、60・・・・・被測定物
。50... Information processing means, 60... Measured object.
Claims (1)
、レーザ光発射手段からのレーザ光の方向を変化させ被
測定物の表面を走査するための走査手段と、被測定物の
表面で反射したレーザ光を集光するための集光手段と、
集光されたレーザ光の強さを計測するための光量計測手
段と、光量計測手段からの情報と走査手段からの情報に
より被測定物の表面形状を求めるための情報処理手段と
からなることを特徴とする表面測定装置。(1) a laser beam emitting means for emitting a laser beam; a scanning means for scanning the surface of the object to be measured by changing the direction of the laser beam from the laser beam emitting means; a condensing means for condensing the reflected laser beam;
It consists of a light amount measuring means for measuring the intensity of the focused laser beam, and an information processing means for determining the surface shape of the object to be measured using information from the light amount measuring means and information from the scanning means. Characteristic surface measuring device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23004590A JPH04110708A (en) | 1990-08-31 | 1990-08-31 | Device for measuring surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23004590A JPH04110708A (en) | 1990-08-31 | 1990-08-31 | Device for measuring surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04110708A true JPH04110708A (en) | 1992-04-13 |
Family
ID=16901701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23004590A Pending JPH04110708A (en) | 1990-08-31 | 1990-08-31 | Device for measuring surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04110708A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2258906A1 (en) * | 2004-09-27 | 2006-09-01 | Fundacion Fatronik | METHOD OF MONITORING THE FORMATION OF BURBS IN THE PROCESSES OF DRILLING OF PARTS. |
| WO2007065959A1 (en) * | 2005-12-07 | 2007-06-14 | Asociación Centro De Investigación De Fabricación De Alto Rendimiento | Method for monitoring burr formation in processes involving the drilling of parts |
-
1990
- 1990-08-31 JP JP23004590A patent/JPH04110708A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2258906A1 (en) * | 2004-09-27 | 2006-09-01 | Fundacion Fatronik | METHOD OF MONITORING THE FORMATION OF BURBS IN THE PROCESSES OF DRILLING OF PARTS. |
| WO2007065959A1 (en) * | 2005-12-07 | 2007-06-14 | Asociación Centro De Investigación De Fabricación De Alto Rendimiento | Method for monitoring burr formation in processes involving the drilling of parts |
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