JPH04113498U - Template for chip-shaped circuit component mounting equipment - Google Patents

Abstract

(57) [Summary] (with amendments) [Purpose] To securely receive a chip-shaped circuit component partially made of magnetic material into a guide case 61 on a template 6. [Structure] A guide case 61 is attached to a baseboard 60 of a template 6, and a through hole 63 for air suction is provided at the bottom of the guide case 61. Further, permanent magnets 62, 62 are provided at positions corresponding to the guide case 61 on the back side of the baseboard 60 to which the guide case 61 is attached. These magnets 62, 62 are
When a chip-shaped circuit component a containing a magnetic material falls from the guide tube 21 with the template 6 inserted directly under the distributor 2, the chip-shaped circuit component a is magnetically attracted and the guide case 61 is Place it on the bottom.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention provides an apparatus for mounting chip-shaped circuit components on a circuit board. The present invention relates to a template provided with a recess for receiving a loop-shaped circuit component.

0002

[Conventional technology]

Conventionally, when mounting chip-shaped circuit components on a predetermined position on a circuit board, automatic This was done using a dynamic mounting device as follows. i.e. multiple containers The chip-shaped circuit components stored in bulk inside are piped to the distributor. Take out the guide tubes one by one and place them in the designated position on the template. They are each sent to a storage recess formed in and received there. This storage recess is for each It is arranged to match the position where the top-shaped circuit components are mounted on the circuit board. and, A chip-shaped component stored in the storage recess is removed by a component moving means having a suction unit. The circuit components are moved to the circuit board while retaining their relative positions when installed. It will be posted. As a result, each of the chip-shaped circuit components is placed at a predetermined position on the circuit board. will be installed. Adhesive is applied to the circuit board in advance at the locations where chip-shaped circuit components are to be mounted. Then, solder the mounted circuit components while temporarily fixing them with this adhesive. cormorant.

0003 In the template, a recess is formed to receive the chip-shaped circuit component. 3, the guide case 6 is placed on the baseboard 60 of the template 6. 1 is attached, and a through hole 63 is opened at the bottom. Template 6 is multi-ma Template 6 when inserted directly under the distributor of the counter device. A vacuum case 4 is placed underneath, and a vacuum valve is connected through an exhaust duct 5. By operating a lower (not shown), the lower surface side of the template 6 is maintained at negative pressure. . In this state, it falls through the guide tube 21 of the distributor 2. The coming chip-shaped circuit component a is received in the guide case 61. At this time, the guide The template is inserted from the guide case 61 through the through hole 63 formed at the bottom of the guide case 61. Air is drawn into the back side of 6, and this air flow moves the chip-shaped circuit component a into the guide cage. source 61. After that, the template 6 moves to the suction head (suction head) and The chip-shaped circuit component a received in the guide case 61 is placed in the set slot of the suction head. It is adsorbed by the slider and mounted on the circuit board described above.

0004

[Problem that the invention is trying to solve]

However, chip-shaped circuit parts falling from the distributor 2 side While falling through the guide tube 21 in front of it, a becomes electrostatically charged. Then, the guide case 61 receives such charged chip-shaped circuit components a one after another. During this process, the guide case 61 is also charged to the same charge as the chip-shaped circuit component. Then, the charged chip that is subsequently sent through the guide tube 21 A repulsive force is generated between the loop-shaped circuit component a and the guide case 61, and for example, in FIG. Chip-shaped circuit component a sticks to the distributor 2 side as shown by the dotted chain line. , a situation occurs where the item does not fit in the guide case. Therefore, the present invention was made based on the above-mentioned consideration, and its purpose is to We have solved the problem of chip-shaped circuit parts that use magnetic materials in part. To provide a template that can be reliably received in a storage recess.

[0005]

[Means to solve the problem]

That is, in order to achieve the above object, the present invention provides chip-shaped circuit components on a circuit board. A recess for receiving the chip-shaped circuit component is arranged in accordance with the position where the chip-shaped circuit component is to be mounted. A magnetic template is provided on the back side of the template corresponding to the recess. A template for a chip-shaped circuit component mounting device characterized by a stone being provided. provide a route.

[0006]

[Effect]

According to the present invention, the template corresponds to the recess for receiving the chip-shaped circuit component. Since a magnet is installed on the back of the template, the above-mentioned chip caused by the air flow in the container can be prevented. In addition to assisting the transportation of loop-shaped circuit components, some magnetic materials, such as nickel electrodes, etc. For chip-shaped circuit components using the member, attractive force due to magnetic force acts. Therefore, the chip-shaped circuit components are attracted to the distributor side due to static electricity. Even if you try to do so, the magnetic force of the magnet resists this and pulls the chip-shaped circuit component into the storage recess. Get into it. This ensures that the chip-shaped circuit components are reliably received in the storage recess. Ru.

[0007]

【Example】

Next, embodiments of the present invention will be specifically described with reference to the drawings. An overview of the entire mounting device for chip-shaped circuit components to which the present invention is applied is shown in Figure 2. It is. That is, a plurality of containers 1 storing chip-shaped circuit components in bulk are arranged. A delivery section 11, which is an escapement, is connected to this via a tube 10. It is. Furthermore, a distributor 2 is arranged below this delivery section 11. There is.

[0008] This distributor 2 has a fixed frame fixed under the delivery section 11. The template 6 is arranged parallel to the template 23 under the template 23, and the template 6 is removably attached to the lower surface side. It has a movable frame 22 to which it is attached, and these fixed frames 23 and movable frames The beam 22 consists of four flexible columns of equal length whose four corners are connected to each other. connected. A vibrator 24 that vibrates the movable frame 22 is connected to the movable frame 22. , whereby the movable frame 22 is horizontally vibrated. Furthermore, a chip-shaped circuit component is proposed between the fixed frame 23 and the movable frame 22. Inside, flexible guide tubes 21, 21, . . . for conveyance are installed.

[0009] Below the movable frame 22 is a mounting position for chip-shaped circuit components on a circuit board. At the same time, the template 6 provided with the guide case 61 is inserted and fixed. child When the lower end of the guide tube 21 connected to the movable frame 22 is It is located above each guide case 61 of rate 6. At this time, the template A vacuum case 4 is placed under 6, and a vacuum connected through an exhaust duct 5 By operating a blower (not shown), the lower surface side of the template 6 is maintained at negative pressure. Ru.

0010 Immediately below the distributor 2, a template 6 places chip-shaped circuit components at various locations. After receiving the template 6 into the fixed guide case 61, the template 6 is placed under the suction head 8. Move with. There, the chip-shaped circuit components received in the guide case 61 are suctioned. It is attracted to the head 8. After that, the template retreats from under the suction head 8. After being avoided, the circuit board 9 conveyed by the conveyor 7 is inserted under it. So Then, the suction head 8 picks up the chip-shaped circuit adsorbed to the tip of the set nozzle. The components are mounted on the circuit board 9.

[0011] As already mentioned, the template 6 has chip-shaped circuit components stored thereon. In order to form a recess for receiving the base of the template 6, as shown in FIG. A guide case 61 is attached on top of the board 60. At the bottom of this guide case 61 In the case shown in the figure, a through hole 63 is provided on the back side of the baseboard 60. , the bottom surface of the storage recess 61 has a slope such that one end side is lower, and the bottom surface is lower. The suction holes 63 are formed on the opposite side. .

0012 Furthermore, on the back side of the baseboard 60 where the guide case 61 is attached, , permanent magnets 62, 62 are provided at positions corresponding to the guide case 61. this The magnets 62, 62, as shown in FIG. 2, as shown by the imaginary line, from the guide tube 21. When a chip-shaped circuit component a containing a magnetic material falls, the chip-shaped circuit part a Item a is magnetically attracted and placed at the bottom of the guide case 61.

[0013] In addition, in the embodiment, the guide case 61 is arranged on the baseboard 60, An example of configuring a template has been explained. However, the present invention is not limited to this. For example, without using the guide case 61, a recess is provided directly on the baseboard 60, and the chip is inserted there. The present invention can also be applied to templates designed to receive top-shaped circuit components. In this case, The magnets 62, 62 are provided on the back side of the base board 60 where the concave portion is formed. is basically the same as in the previous embodiment.

[0014]

[Effect of the idea]

As explained above, according to the present invention, the chip-shaped circuit component a of the template 6 is The chip-shaped circuit component a can be reliably received in the recess, and is not disturbed by static electricity. This can reduce the trouble of not being able to collect.

[Brief explanation of drawings]

FIG. 1 is a vertical sectional side view of a main part of a template showing an embodiment of the present invention.

FIG. 2 is a schematic perspective view showing a chip-shaped circuit component mounting device.

FIG. 3 is a vertical sectional side view of a main part of a template showing a conventional example.

[Explanation of symbols]

6 Template 60 Baseboard 61 Information case 62 Magnet

Claims (1)

[Reference number] 0020943-01 [Scope of utility model registration request] 1. A template provided with a recess for receiving the chip circuit component in accordance with a position where the chip circuit component is to be mounted on a circuit board, the back surface of the template corresponding to the recess. A template for a chip-shaped circuit component mounting device, characterized in that a magnet is provided on the side.