JPH04115678A - Solid-state image pickup element and its driving method therefor - Google Patents

Solid-state image pickup element and its driving method therefor

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Publication number
JPH04115678A
JPH04115678A JP2231684A JP23168490A JPH04115678A JP H04115678 A JPH04115678 A JP H04115678A JP 2231684 A JP2231684 A JP 2231684A JP 23168490 A JP23168490 A JP 23168490A JP H04115678 A JPH04115678 A JP H04115678A
Authority
JP
Japan
Prior art keywords
light
transfer
charge
solid
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2231684A
Other languages
Japanese (ja)
Inventor
Hiroya Ito
浩也 伊藤
Yoshihito Higashitsutsumi
良仁 東堤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2231684A priority Critical patent/JPH04115678A/en
Publication of JPH04115678A publication Critical patent/JPH04115678A/en
Pending legal-status Critical Current

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  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE:To suppress the weight of a smear electric charge by providing an optical means to lead a light radiated on a light shielding electrode on a non- light-shielding electrode or to the interval side of a transfer electrode so as to cover the transfer electrode. CONSTITUTION:Transfer electrodes 10b and 10d of a lower layer side among transfer electrodes 10a to 10d of a 2-layer-constitution are formed by the high melting point metal of w-Si (tungsten silicide) and so on opaque to incident light or the alloy of it and a microlens layer 11 to refract light radiated on the transfer electrodes 10b and 10d to an open part side is provided on an insulating film 7. That is, the microlens layer 11 which consists of acrylic resin is provided to prevent a smear electric charge from being mixed in the information electric charge of a transfer process with the lower layer side of the transfer electrodes 10a to 10d as light shielding electrodes and moreover to prevent the lowering of sensitivity owing to the light shielding electrodes so as to converge the light to the open part of the transfer electrodes 10a to 10d. Thus, a smear electric charge component can be suppressed.

Description

【発明の詳細な説明】 (イ)産業上の利用分野 本発明は、スミア電荷の発生を低減する固体撮像素子及
びその駆動方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a solid-state image sensor and a method for driving the same that reduce the generation of smear charges.

(ロ)従来の技術 第4図は縦型オーバーフロードレイン構造のCCD固体
撮像素子の撮像部の平面図であり、第5図はそのx−y
断面図である。
(b) Prior art FIG. 4 is a plan view of the imaging section of a CCD solid-state imaging device with a vertical overflow drain structure, and FIG. 5 is an x-y
FIG.

N型のSi基板(1)の一方の面には、P−Well領
域(2)が形成され、このP−Well領域(2)内に
分離領域(3)で区画されたN型の拡散領域(4)が互
いに並行に配列されて埋込み型の蓄積転送チャネルが構
成される0分離領域(3)は、例えばP゛型の拡散領域
からなり、水平方向の画素分離を成している。拡散領域
(4)上には、分離領域(3)に直交して複数のPo1
y−Si転送電極(5a ) (5b ) (5c )
 (5d )が配列形成される。この転送電極(5a)
 (5b) (5c) (5d)は、一部が互いに重な
る2層構造を成し、夫々に4相の転送りロックφ、〜φ
4が印加される。また、上層側の転送電極(5a) (
5c)は、分離領域(3)上で幅が狭(形成され、上層
側の転送電極(5a) (5c)と下層側の転送電極(
5b) (5d)との間に開口部が形成される。
A P-Well region (2) is formed on one surface of an N-type Si substrate (1), and an N-type diffusion region partitioned by a separation region (3) within this P-Well region (2). The zero isolation regions (3), which are arranged in parallel with each other to form a buried storage and transfer channel, are composed of, for example, P'-type diffusion regions, and form horizontal pixel isolation. On the diffusion region (4), there are a plurality of Po1s perpendicular to the separation region (3).
y-Si transfer electrode (5a) (5b) (5c)
(5d) is formed into an array. This transfer electrode (5a)
(5b) (5c) (5d) have a two-layer structure that partially overlaps each other, and each has a four-phase transfer lock φ, ~φ
4 is applied. In addition, the transfer electrode (5a) on the upper layer side (
5c) is narrow (formed) on the separation region (3) and connects the upper layer side transfer electrode (5a) (5c) and the lower layer side transfer electrode (5c).
5b) An opening is formed between (5d).

さらに、開口部から露出する拡散領域(4)には、N−
型の拡散領域(6)が形成される。そして、これらの転
送電極(5a) (5b) (5c) (5d)は、5
idlL等の絶縁膜(7)により保護される。
Furthermore, the diffusion region (4) exposed from the opening has N-
A mold diffusion region (6) is formed. These transfer electrodes (5a) (5b) (5c) (5d) are 5
It is protected by an insulating film (7) such as idlL.

方、Si基板(1)には、Si基板(1)内部のポテン
シャルを制御する基板クロックが印加され、転送りロッ
クφ1〜φ4との作用により蓄積転送チャネル内に蓄積
される情報電荷がSi基板(1)側に排出可能なように
構成される。
On the other hand, a substrate clock that controls the potential inside the Si substrate (1) is applied to the Si substrate (1), and information charges accumulated in the storage and transfer channels due to the action of the transfer locks φ1 to φ4 are transferred to the Si substrate. (1) It is constructed so that it can be discharged to the side.

第6図は、第5図の縦方向のポテンシャルの状態を示す
図で、情報電荷の蓄積時(実線)及び排出時(破線)を
示す。
FIG. 6 is a diagram showing the state of the potential in the vertical direction of FIG. 5, and shows the state of the potential in the vertical direction when information charges are accumulated (solid line) and when they are discharged (broken line).

情報電荷の蓄積時には、基板クロックを低電位に固定し
、転送りロックφ2を高電位に固定することによりP−
Well領域(2)付近にポテンシャル障壁が形成され
、このポテンシャル障壁と拡散領域(4)表面のポテン
シャル障壁との間に情報電荷が蓄積される。
When accumulating information charges, P-
A potential barrier is formed near the well region (2), and information charges are accumulated between this potential barrier and the potential barrier on the surface of the diffusion region (4).

一方、情報電荷の排出時には、蓄積時とは逆に基板クロ
ックを高電位とすると共に転送りロックφ2を低電位と
してP−Well領域(2)付近に形成されたポテンシ
ャル障壁を消滅させる。従って、ポテンシャル障壁の間
に蓄積された情報電荷は、第6図の破線に示すようにポ
テンシャルの勾配に従ってSi基板(1)側に排出され
る。
On the other hand, when discharging information charges, the substrate clock is set to a high potential and the transfer lock φ2 is set to a low potential to eliminate the potential barrier formed near the P-well region (2), contrary to the case when storing information charges. Therefore, the information charges accumulated between the potential barriers are discharged to the Si substrate (1) side according to the potential gradient as shown by the broken line in FIG.

第7図は転送りロックφ、〜φ4の波形図−c、第8図
は各タイミングのポテンシャルを示す図である。
FIG. 7 is a waveform diagram-c of transfer locks φ and φ4, and FIG. 8 is a diagram showing the potential at each timing.

転送りロックφ1〜φ4は、例えばデユーティ比50%
の4相のクロックで、夫々転送電極(5aH5bH5c
) (5d)に印加される。タイミングT1で転送電極
(5b)下に蓄積される情報電荷は、次のタイミングT
2で転送りロックφ!、φ、が反転し、さらにタイミン
グT3で転送りロックφ2、φ4が反転すると転送電極
(5d)転送される。そして、タイミングT4で転送り
ロックφ3、φ3が反転し、続いて転送りロックφ2、
φ、が反転してタイミングT1の状態になる。このよう
なタイミングT1〜T4の動作を繰り返すことにより蓄
積転送チャネル内の情報電荷は、所定の方向に転送出力
される。
Transfer locks φ1 to φ4 have a duty ratio of 50%, for example.
The transfer electrodes (5aH5bH5c
) (5d) is applied. The information charge accumulated under the transfer electrode (5b) at timing T1 is transferred to the next timing T.
Transfer lock with 2! , φ are inverted, and furthermore, at timing T3, transfer locks φ2 and φ4 are inverted, and the transfer electrode (5d) is transferred. Then, at timing T4, transfer locks φ3 and φ3 are reversed, and then transfer locks φ2 and
φ is inverted and becomes the state at timing T1. By repeating the operations at timings T1 to T4, the information charges in the storage and transfer channel are transferred and output in a predetermined direction.

(ハ)発明が解決しようとする課題 上述のように受光部がそのまま転送部となるフレームト
ランスファ方式のCOD固体撮像素子に於いては、情報
電荷を転送出力する過程でも光の照射により蓄積転送チ
ャネル内に電荷が発生し、この電荷がスミア電荷として
情報電荷に重畳することになる。このように情報電荷に
重畳するスミア電荷は、再生画面上に縦縞状になって表
れるため、固体撮像素子から得られる映像信号の処理段
階で補正されることにより抑圧される。
(c) Problems to be Solved by the Invention As mentioned above, in a frame transfer type COD solid-state image sensor in which the light receiving part directly functions as a transfer part, even in the process of transferring and outputting information charges, the storage and transfer channel is created by light irradiation. A charge is generated within the information charge, and this charge is superimposed on the information charge as a smear charge. Since the smear charge superimposed on the information charge appears in the form of vertical stripes on the reproduction screen, it is suppressed by being corrected at the processing stage of the video signal obtained from the solid-state image sensor.

このようなスミア電荷成分の補正のためには、例えば特
公昭56−35067号公報に開示されているような特
殊な回路構成が必要となり、コストアップの要因となっ
ている。
In order to correct such smear charge components, a special circuit configuration as disclosed in, for example, Japanese Patent Publication No. 56-35067 is required, which causes an increase in cost.

そこで本発明は、固体撮像素子自体をスミア電荷が情報
電荷に重畳しにくくなるように構成し、スミア電荷の重
畳を抑圧する駆動方法の提供を目的とする。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a driving method that suppresses the superimposition of smear charges by configuring the solid-state image sensor itself so that smear charges are difficult to superimpose on information charges.

(ニ)課題を解決するための手段 本発明は、上述の課題を解決するためになされたもので
、第1の特徴とするところは、半導体基板の一主面上に
複数の電荷転送領域が配列形成されると共に、多層構造
を有する複数の転送電極が上記電荷転送領域と交差して
互いに並行に形成された固体撮像素子に於いて、上記転
送電極の一層が入射光を遮光する遮光電極からなり、こ
の遮光電極上に照射される光を非遮光電極上或いは転送
電極の間隙側に導く光学手段が上記転送電極を覆うよう
に設けられることにある。
(d) Means for Solving the Problems The present invention has been made to solve the above-mentioned problems, and the first feature is that a plurality of charge transfer regions are provided on one principal surface of a semiconductor substrate. In a solid-state imaging device in which a plurality of transfer electrodes having a multilayer structure are formed in an array and parallel to each other and intersect with the charge transfer region, one layer of the transfer electrodes is formed from a light-shielding electrode that blocks incident light. An optical means for guiding the light irradiated onto the light-shielding electrode onto the non-light-shielding electrode or onto the gap side of the transfer electrode is provided to cover the transfer electrode.

そして第2の特徴とするところは、半導体基板の一主面
上に複数の電荷転送領域が配列形成され、一層が入射光
を遮光する多層構造の複数の転送電極が互いに並行に形
成された固体撮像素子に於いて、上記情報電荷が上記電
荷転送領域内を転送される過程で、上記情報電荷が上記
遮光電極下にあるとき、非遮光電極下の電荷転送領域と
これに隣接する過剰電荷吸収領域との間の電位障壁を消
滅させ、非遮光電極を通して電荷転送領域内に入射され
る光により発生するスミア電荷を上記過剰電荷吸収領域
に排出することにある。
The second feature is that it is a solid state in which a plurality of charge transfer regions are arranged and formed on one main surface of a semiconductor substrate, and a plurality of transfer electrodes of a multilayer structure in which one layer blocks incident light are formed in parallel to each other. In the imaging device, when the information charge is under the light shielding electrode during the process of transferring the information charge within the charge transfer region, the charge transfer region under the non-light shielding electrode and the adjacent excess charge absorption The purpose is to eliminate the potential barrier between the charge transfer region and the charge transfer region, and discharge smear charges generated by light incident into the charge transfer region through the non-light-shielding electrode to the excess charge absorption region.

(ホ)作用 本発明によれば、情報電荷が蓄積転送チャネル内を転送
される過程で、遮光電極の下に情報電荷があるときには
、情報電荷のある領域でのスミア電荷の発生自体が抑圧
され、情報電荷へのスミア電荷の混入が無くなる。
(E) Effect According to the present invention, when information charges are present under the light-shielding electrode during the process in which information charges are transferred within the storage and transfer channel, the generation of smear charges itself in the region where the information charges are present is suppressed. , smear charges are no longer mixed into information charges.

また、非遮光転送電極を通して拡散領域に照射される光
により発生するスミア電荷は、その領域に情報電荷がな
ければ基板側に排出される。従って、情報電荷にスミア
電荷が重畳されるのは情報電荷が非遮光電極下を通過す
るときのみとなり、理論上スミア電荷の情報電荷への混
入は1/4となる。
Furthermore, smear charges generated by light irradiated onto the diffusion region through the non-light-shielded transfer electrode are discharged to the substrate side if there is no information charge in that region. Therefore, the smear charge is superimposed on the information charge only when the information charge passes under the non-light-shielding electrode, and theoretically the amount of smear charge mixed into the information charge is 1/4.

(へ)実施例 本発明の一実施例を図面に従って説明する。(f) Example An embodiment of the present invention will be described with reference to the drawings.

第1図は本発明の固体撮像素子の撮像部の平面図であり
、第2図はそのX−Y断面図である。この図に於いて、
 Si基板(1)、P−Well領域(2)、分離領域
(3)及び拡散領域(4)は、第4図と同一であり、同
一部分には同一符号が付しである。
FIG. 1 is a plan view of the imaging section of the solid-state imaging device of the present invention, and FIG. 2 is an X-Y sectional view thereof. In this diagram,
The Si substrate (1), P-Well region (2), isolation region (3), and diffusion region (4) are the same as in FIG. 4, and the same parts are given the same reference numerals.

本発明の特徴とするところは、2相構造の転送電極(1
0a) (10b)(IOC) (10d)のうち、下
層側の転送電極(10b) (10d)を入射光に対し
て不透明なW−5i(タングステンシリサイド)等の高
融点金属或いはその合金により形成し、この転送型i 
(]Ob) (10d)上に照射される光を開口部側に
屈折させるマイクロレンズ層(11)を絶縁膜(7)上
に設けたことにある。即ち、転送電極(10a) (1
0b) (10c) (10d)の下層側を遮光電極と
して転送過程の情報電荷にスミア電荷が混入するのを防
止し、さらに遮光電極による感度の低下を防止するため
にアクリル樹脂からなるマイクロレンズ層(11)を設
けて転送電極(10a) (10b) (10c) (
10d)の開口部に光を集光するように構成される。
The feature of the present invention is that the transfer electrode has a two-phase structure (1
0a) (10b) (IOC) Among (10d), the lower transfer electrode (10b) (10d) is formed of a high melting point metal such as W-5i (tungsten silicide) or its alloy, which is opaque to incident light. and this transfer type i
(]Ob) (10d) A microlens layer (11) is provided on the insulating film (7) to refract light irradiated onto the opening toward the opening. That is, the transfer electrode (10a) (1
0b) (10c) The lower layer side of (10d) is used as a light-shielding electrode to prevent smear charges from being mixed into the information charges during the transfer process, and a microlens layer made of acrylic resin is used to prevent a decrease in sensitivity due to the light-shielding electrode. (11) and transfer electrodes (10a) (10b) (10c) (
10d) is configured to condense light into the opening.

このような固体撮像素子に於いては、情報電荷が転送電
極(Job) (10d)下にあるときには、スミア電
荷そのものの発生が抑圧されることから、情報電荷にス
ミア電荷が重畳するのを防止できる。
In such a solid-state image sensor, when the information charge is under the transfer electrode (Job) (10d), the generation of the smear charge itself is suppressed, so the smear charge is prevented from being superimposed on the information charge. can.

第3図は、本発明の駆動方法を説明するポテンシャルの
状態を示す図である。ここで、タイミングT1〜T4は
、第7図のタイミングT1〜T4に一致している。
FIG. 3 is a diagram showing potential states for explaining the driving method of the present invention. Here, the timings T1 to T4 correspond to the timings T1 to T4 in FIG. 7.

転送りロックφ0、φ3は、高電位時には第6図の実線
に示すようにP−Well領域(2)付近にポテンシャ
ル障壁を形成し、低電位時には第6図の破線に示すよう
にポテンシャル障壁が消滅するような電位に設定される
。転送りロックφ2、φ4が印加される転送電極(Jo
b) (10d)は、遮光電極であるtこめ光が照射さ
れず、入射光に対して感度を有していない、従って、第
3図に示すように、転送りロックφ、 φ3の作用によ
り無感度領域となる転送電極(10a) (]Oc)の
領域と、遮光する転送電極(10b) (10d)の領
域とにより情報電荷が転送される過程の3/4が入射光
に対して感度がなくなり、情報電荷にスミア電荷が重畳
されるのは、転送電極(10a) <10c)下を通過
する時のみとなる。
Transfer locks φ0 and φ3 form a potential barrier near the P-Well region (2) as shown by the solid line in Figure 6 when the potential is high, and a potential barrier is formed near the P-Well region (2) as shown by the broken line in Figure 6 when the potential is low. The potential is set so that it disappears. Transfer electrodes (Jo) to which transfer locks φ2 and φ4 are applied
b) (10d) is a light-shielding electrode that is not irradiated with light and has no sensitivity to incident light.Therefore, as shown in Figure 3, due to the action of transfer locks φ and φ3, 3/4 of the process in which information charges are transferred by the area of the transfer electrode (10a) (]Oc) that is an insensitive area and the area of the transfer electrode (10b) (10d) that blocks light is sensitive to incident light. The smear charge is superimposed on the information charge only when it passes under the transfer electrode (10a) <10c).

ここで、タイミングT2からタイミングT3、或いはタ
イミングT4からタイミングT1にかけて転送電極(1
0a) (]Oc)下の蓄積転送チャネルを情報電荷が
通過する時間が短くなるように転送りロックφ1〜φ4
のデユーティ比を設定すれば、さらにスミア電荷の混入
を低減できる。
Here, the transfer electrode (1
0a) (]Oc) Transfer locks φ1 to φ4 so that the time for information charges to pass through the lower storage transfer channel is shortened.
By setting the duty ratio of , it is possible to further reduce the inclusion of smear charges.

出願人らの測定によれば、転送電極(10a) (10
b)(10c) (10d)の一方を遮光電極とするこ
とでスミア比を3.5dB改善することができた。さら
に、転送りロックφ1〜φ4のデユーティ比を最適化す
ることでさらに9.5dBの改善が望める。
According to applicants' measurements, the transfer electrode (10a) (10
b) (10c) By using one of (10d) as a light-shielding electrode, the smear ratio could be improved by 3.5 dB. Further, by optimizing the duty ratios of transfer locks φ1 to φ4, a further improvement of 9.5 dB can be expected.

一方、情報電荷の蓄積時には転送電極(10a)(10
C)による無感度領域を無くして必要な情報電荷が基板
側に漏れ出すのを防止して感度の低下防止が図られる。
On the other hand, when information charges are accumulated, the transfer electrodes (10a) (10
By eliminating the insensitive region caused by C), necessary information charges are prevented from leaking to the substrate side, thereby preventing a decrease in sensitivity.

(ト)発明の効果 本発明によれば、固体撮像素子での情報電荷へのスミア
電荷の混入を低減できるため、映像信号に対してスミア
電荷成分の補正処理を施す必要がなくなり、回路構成の
増大を防止できる。
(g) Effects of the Invention According to the present invention, it is possible to reduce the mixing of smear charges into information charges in a solid-state image sensor, so there is no need to perform correction processing for smear charge components on video signals, and the circuit configuration can be simplified. Increase can be prevented.

従って、コストの大幅な増大なしにスミア電荷成分の抑
圧ができ、安価で高画質の映像を得ることのできる固体
撮像装置を実現できる。
Therefore, it is possible to suppress smear charge components without significantly increasing cost, and to realize a solid-state imaging device that can obtain high-quality images at low cost.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の固体撮像素子の平面図、第2図は第1
図の断面図、第3図は本発明の駆動方法を説明するポテ
ンシャル図、第4図は従来の固体撮像素子の平面図、第
5図は第4図の断面図、第6図は第4図のポテンシャル
状態図、第7図は転送りロックの波形図、第8図は従来
の駆動方法を説明するポテンシャル図である。 (1)・= Si基板、(2)−−P−Well領域、
(3)= ・分離領域、(4)−=拡散領域、(5aH
5b) (5c)(5d)(10a> (1ob) (
10c) (]0dl−転送電極、(IJ、)−= フ
ィクロレンズ層。
FIG. 1 is a plan view of the solid-state image sensing device of the present invention, and FIG.
3 is a potential diagram explaining the driving method of the present invention, FIG. 4 is a plan view of a conventional solid-state image sensor, FIG. 5 is a sectional view of FIG. 4, and FIG. 7 is a waveform diagram of a transfer lock, and FIG. 8 is a potential diagram explaining a conventional driving method. (1)・=Si substrate, (2)--P-Well region,
(3) = - Separation region, (4) - = Diffusion region, (5aH
5b) (5c) (5d) (10a> (1ob) (
10c) (]0dl-transfer electrode, (IJ,)-= fibrolens layer.

Claims (3)

【特許請求の範囲】[Claims] (1)半導体基板の一主面上に複数の電荷転送領域が配
列形成されると共に、 多層構造を有する複数の転送電極が上記電荷転送領域と
交差して互いに並行に形成された固体撮像素子に於いて
、 上記転送電極の一層が入射光を遮光する遮光電極からな
り、 この遮光電極上に照射される光を非遮光電極上或いは転
送電極の間隙側に導く光学手段が上記転送電極を覆うよ
うに設けられることを特徴とする固体撮像素子。
(1) A solid-state imaging device in which a plurality of charge transfer regions are arranged and formed on one main surface of a semiconductor substrate, and a plurality of transfer electrodes having a multilayer structure are formed in parallel to each other and intersect with the charge transfer regions. One layer of the transfer electrode is a light-shielding electrode that blocks incident light, and an optical means that guides the light irradiated onto the light-shielding electrode onto the non-light-shielding electrode or onto the gap between the transfer electrodes covers the transfer electrode. A solid-state imaging device characterized in that it is provided in.
(2)入射光を受けて発生した情報電荷を上記電荷転送
領域に蓄積することを特徴とする請求項第1項記載の固
体撮像素子。
(2) The solid-state image pickup device according to claim 1, wherein information charges generated upon receiving incident light are accumulated in the charge transfer region.
(3)半導体基板の一主面上に複数の電荷転送領域が配
列形成され、一層が入射光を遮光する多層構造の複数の
転送電極が互いに並行に形成された固体撮像素子に於い
て、 上記情報電荷が上記電荷転送領域内を転送される過程で
、上記情報電荷が上記遮光電極下にあるとき、 非遮光電極下の電荷転送領域とこれに隣接する過剰電荷
吸収領域との間の電位障壁を消滅させ、非遮光電極を通
して電荷転送領域内に入射される光により発生するスミ
ア電荷を上記過剰電荷吸収領域に排出することを特徴と
する固体撮像素子の駆動方法。
(3) In a solid-state imaging device in which a plurality of charge transfer regions are arranged and formed on one principal surface of a semiconductor substrate, and a plurality of transfer electrodes of a multilayer structure in which one layer blocks incident light are formed in parallel to each other, the above-mentioned During the process in which the information charge is transferred within the charge transfer region, when the information charge is under the light-shielding electrode, a potential barrier is formed between the charge transfer region under the non-light-shielding electrode and the adjacent excess charge absorption region. A method for driving a solid-state image sensor, characterized in that smear charges generated by light incident on a charge transfer region through a non-light-shielding electrode are discharged to the excess charge absorption region.
JP2231684A 1990-08-31 1990-08-31 Solid-state image pickup element and its driving method therefor Pending JPH04115678A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2231684A JPH04115678A (en) 1990-08-31 1990-08-31 Solid-state image pickup element and its driving method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2231684A JPH04115678A (en) 1990-08-31 1990-08-31 Solid-state image pickup element and its driving method therefor

Publications (1)

Publication Number Publication Date
JPH04115678A true JPH04115678A (en) 1992-04-16

Family

ID=16927376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2231684A Pending JPH04115678A (en) 1990-08-31 1990-08-31 Solid-state image pickup element and its driving method therefor

Country Status (1)

Country Link
JP (1) JPH04115678A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0744778A1 (en) * 1995-05-22 1996-11-27 Matsushita Electronics Corporation Solid-state imaging device and method of manufacturing the same
WO2004093196A1 (en) * 2003-04-16 2004-10-28 Sanyo Electric Co. Ltd. Solid-state imager and method for manufacturing same
JP2016143732A (en) * 2015-01-30 2016-08-08 三菱電機株式会社 Charge-coupled device, manufacturing method of charge-coupled device, and solid-state imaging apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0744778A1 (en) * 1995-05-22 1996-11-27 Matsushita Electronics Corporation Solid-state imaging device and method of manufacturing the same
US5796154A (en) * 1995-05-22 1998-08-18 Matsushita Electronics Corporation Solid-state imaging device with dual lens structure
US6030852A (en) * 1995-05-22 2000-02-29 Matsushita Electronics Corporation Solid-state imaging device and method of manufacturing the same
WO2004093196A1 (en) * 2003-04-16 2004-10-28 Sanyo Electric Co. Ltd. Solid-state imager and method for manufacturing same
CN100392862C (en) * 2003-04-16 2008-06-04 三洋电机株式会社 Solid-state imaging device and manufacturing method thereof
US7459327B2 (en) 2003-04-16 2008-12-02 Sanyo Electric Co., Ltd. Method for manufacturing micro lenses including underlayer film and lens film etching steps
JP2016143732A (en) * 2015-01-30 2016-08-08 三菱電機株式会社 Charge-coupled device, manufacturing method of charge-coupled device, and solid-state imaging apparatus

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