JPH0412019B2 - - Google Patents

Info

Publication number: JPH0412019B2
Authority: JP; Japan
Prior art keywords: silver; multilayer ceramic; solder; electrode; nickel
Prior art date: 1982-10-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP18404482A

Other languages

English (en)

Japanese (ja)

Other versions

JPS5972713A (ja

Inventor

Hiroshi Niwa

Yoshihiro Tsutsumi

Kazu Takada

Takayuki Kuroda

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Panasonic Holdings Corp

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-10-20

Filing date

1982-10-20

Publication date

1992-03-03

1982-10-20 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

1982-10-20 Priority to JP57184044A priority Critical patent/JPS5972713A/ja

1984-04-24 Publication of JPS5972713A publication Critical patent/JPS5972713A/ja

1992-03-03 Publication of JPH0412019B2 publication Critical patent/JPH0412019B2/ja

Status Granted legal-status Critical Current

Links

BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 36
239000004332 silver Substances 0.000 claims description 36
229910052709 silver Inorganic materials 0.000 claims description 30
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
239000003985 ceramic capacitor Substances 0.000 claims description 18
229910000679 solder Inorganic materials 0.000 claims description 18
238000010304 firing Methods 0.000 claims description 16
229910001252 Pd alloy Inorganic materials 0.000 claims description 13
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 13
229910052751 metal Inorganic materials 0.000 claims description 13
239000002184 metal Substances 0.000 claims description 13
229910052760 oxygen Inorganic materials 0.000 claims description 13
239000001301 oxygen Substances 0.000 claims description 13
239000002253 acid Substances 0.000 claims description 12
239000011521 glass Substances 0.000 claims description 11
229910052759 nickel Inorganic materials 0.000 claims description 11
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
229910052718 tin Inorganic materials 0.000 claims description 10
238000000034 method Methods 0.000 claims description 8
238000009713 electroplating Methods 0.000 claims description 6
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
229910052802 copper Inorganic materials 0.000 claims description 5
239000010949 copper Substances 0.000 claims description 5
238000007772 electroless plating Methods 0.000 claims description 3
239000000853 adhesive Substances 0.000 description 15
230000001070 adhesive effect Effects 0.000 description 15
238000007747 plating Methods 0.000 description 12
239000000243 solution Substances 0.000 description 9
229910001316 Ag alloy Inorganic materials 0.000 description 6
LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 6
SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 6
238000005476 soldering Methods 0.000 description 5
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
230000003247 decreasing effect Effects 0.000 description 4
239000002904 solvent Substances 0.000 description 4
239000003929 acidic solution Substances 0.000 description 3
238000002485 combustion reaction Methods 0.000 description 3
230000007423 decrease Effects 0.000 description 3
230000000694 effects Effects 0.000 description 3
239000000203 mixture Substances 0.000 description 3
238000005245 sintering Methods 0.000 description 3
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
239000011230 binding agent Substances 0.000 description 2
230000000052 comparative effect Effects 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
PQMFVUNERGGBPG-UHFFFAOYSA-N (6-bromopyridin-2-yl)hydrazine Chemical compound NNC1=CC=CC(Br)=N1 PQMFVUNERGGBPG-UHFFFAOYSA-N 0.000 description 1
OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
229910000812 Ra alloy Inorganic materials 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
238000009835 boiling Methods 0.000 description 1
239000004327 boric acid Substances 0.000 description 1
239000005388 borosilicate glass Substances 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
239000013256 coordination polymer Substances 0.000 description 1
238000005260 corrosion Methods 0.000 description 1
230000007797 corrosion Effects 0.000 description 1
230000002542 deteriorative effect Effects 0.000 description 1
239000002003 electrode paste Substances 0.000 description 1
238000007654 immersion Methods 0.000 description 1
238000009413 insulation Methods 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000002844 melting Methods 0.000 description 1
QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
239000000615 nonconductor Substances 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
239000000843 powder Substances 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000011135 tin Substances 0.000 description 1

Landscapes

Ceramic Capacitors (AREA)
Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

JP57184044A 1982-10-20 1982-10-20 積層セラミツクコンデンサの端子電極形成法 Granted JPS5972713A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP57184044A JPS5972713A (ja)	1982-10-20	1982-10-20	積層セラミツクコンデンサの端子電極形成法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP57184044A JPS5972713A (ja)	1982-10-20	1982-10-20	積層セラミツクコンデンサの端子電極形成法

Publications (2)

Publication Number	Publication Date
JPS5972713A JPS5972713A (ja)	1984-04-24
JPH0412019B2 true JPH0412019B2 (de)	1992-03-03

Family

ID=16146374

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP57184044A Granted JPS5972713A (ja)	1982-10-20	1982-10-20	積層セラミツクコンデンサの端子電極形成法

Country Status (1)

Country	Link
JP (1)	JPS5972713A (de)

1982
- 1982-10-20 JP JP57184044A patent/JPS5972713A/ja active Granted

Also Published As

Publication number	Publication date
JPS5972713A (ja)	1984-04-24

Publication	Publication Date	Title
JPH08180731A (ja)	1996-07-12	導電性厚膜組成物、厚膜電極、セラミック電子部品、および積層セラミックコンデンサ
KR930002982B1 (ko)	1993-04-16	전자부품
US7285232B2 (en)	2007-10-23	Conductive paste and ceramic electronic component
JP2658509B2 (ja)	1997-09-30	電子部品と電極ペーストおよび端子電極の形成方法
JP3257036B2 (ja)	2002-02-18	チップ型電子部品用導電性ペースト
JP2973558B2 (ja)	1999-11-08	チップ型電子部品用導電性ペースト
JPS6342879B2 (de)	1988-08-25
JPH0412019B2 (de)	1992-03-03
JPH0834168B2 (ja)	1996-03-29	セラミックコンデンサ端子電極用導電性組成物
JPH10163067A (ja)	1998-06-19	チップ型電子部品の外部電極
JPH0239410A (ja)	1990-02-08	セラミックコンデンサ端子電極用導電性組成物
JP3291831B2 (ja)	2002-06-17	チップ型電子部品用導電性ペースト
JPH0440803B2 (de)	1992-07-06
JPH04329616A (ja)	1992-11-18	積層形電子部品
JPS6127003A (ja)	1986-02-06	導電性ペ−スト組成物
JPS6132808B2 (de)	1986-07-29
JPS63283184A (ja)	1988-11-21	導体組成物を被覆した回路基板
JPH10106346A (ja)	1998-04-24	銀系導体ペースト
JPS58107605A (ja)	1983-06-27	チツプ抵抗器の製造方法
JPH0239411A (ja)	1990-02-08	セラミックコンデンサ端子電極用導電性組成物
JPS6132807B2 (de)	1986-07-29
JPH0239408A (ja)	1990-02-08	セラミックコンデンサ端子電極用導電性組成物
JPH06204077A (ja)	1994-07-22	セラミックチップコンデンサ及びその製造方法
JPH06349316A (ja)	1994-12-22	導電ペースト
JP2992958B2 (ja)	1999-12-20	低温焼成多層配線基板用導体ペースト