JPH0412633U - - Google Patents
Info
- Publication number
- JPH0412633U JPH0412633U JP1990053185U JP5318590U JPH0412633U JP H0412633 U JPH0412633 U JP H0412633U JP 1990053185 U JP1990053185 U JP 1990053185U JP 5318590 U JP5318590 U JP 5318590U JP H0412633 U JPH0412633 U JP H0412633U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- insulating film
- contact hole
- contact pad
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は本考案におけるコンタクト構成体の配
線部の模式的平面図、第２図は本考案におけるコ
ンタクト構成体の製造時における露光面積を示す
説明図、第３図は従来のコンタクト構成体の配線
部の模式的平面図、第４図は従来のコンタクト構
成体の不都合例を示す説明図、第５図は従来のコ
ンタクト製造体の構造時における露光面積を示す
説明図である。
１，２……上部配線層、３……コンタクトパツ
ド、４……コンタクト穴。
Fig. 1 is a schematic plan view of the wiring part of the contact structure in the present invention, Fig. 2 is an explanatory diagram showing the exposed area during manufacturing of the contact structure in the present invention, and Fig. 3 is a diagram of the conventional contact structure. FIG. 4 is a schematic plan view of a wiring section, FIG. 4 is an explanatory diagram showing an example of a disadvantage of a conventional contact structure, and FIG. 5 is an explanatory diagram showing an exposed area in the structure of a conventional contact manufacturing body. 1, 2... Upper wiring layer, 3... Contact pad, 4... Contact hole.
Claims (1)
上部配線層とを前記絶縁膜に穿つたコンタクト穴
内に充填した導電材料及び該コンタクト穴の周囲
に形成したコンタクトパツドを介して接続するよ
うにしたコンタクト構成体において、前記コンタ
クトパツドの外周縁の輪郭を円形又は楕円形とし
たことを特徴とするコンタクト構成体。 A lower conductive layer and an upper wiring layer provided thereon with an insulating film interposed therebetween are connected through a conductive material filled in a contact hole formed in the insulating film and a contact pad formed around the contact hole. A contact structure as described above, wherein the outer peripheral edge of the contact pad has a circular or elliptical outline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990053185U JPH0412633U (en) | 1990-05-21 | 1990-05-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990053185U JPH0412633U (en) | 1990-05-21 | 1990-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412633U true JPH0412633U (en) | 1992-01-31 |
Family
ID=31574153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990053185U Pending JPH0412633U (en) | 1990-05-21 | 1990-05-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412633U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61245549A (en) * | 1985-04-24 | 1986-10-31 | Hitachi Ltd | Multilayer wiring structure |
-
1990
- 1990-05-21 JP JP1990053185U patent/JPH0412633U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61245549A (en) * | 1985-04-24 | 1986-10-31 | Hitachi Ltd | Multilayer wiring structure |