JPH0412642U - - Google Patents

Info

Publication number
JPH0412642U
JPH0412642U JP5343190U JP5343190U JPH0412642U JP H0412642 U JPH0412642 U JP H0412642U JP 5343190 U JP5343190 U JP 5343190U JP 5343190 U JP5343190 U JP 5343190U JP H0412642 U JPH0412642 U JP H0412642U
Authority
JP
Japan
Prior art keywords
sleeve
extruded
semiconductor device
jig
semiconductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5343190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5343190U priority Critical patent/JPH0412642U/ja
Publication of JPH0412642U publication Critical patent/JPH0412642U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す側面図、第2
図はそのA−A線断面図である。 1……スリーブ治具本体、2……半導体装置、
3……ガイドブロツク、4……窓穴、5……Al
押出しスリーブ。
Figure 1 is a side view showing one embodiment of the present invention;
The figure is a cross-sectional view taken along line A-A. 1...Sleeve jig main body, 2...Semiconductor device,
3...Guide block, 4...Window hole, 5...Al
Extruded sleeve.

Claims (1)

【実用新案登録請求の範囲】 1 半導体装置を収容したAl押出しスリーブと
継ぎ合わせ半導体装置をそのまま移し替えて使用
するスリーブ治具であつて、移し替えられた半導
体装置の外観不良確認用の窓穴を両側面に有する
ことを特徴とする半導体装置外観検査用スリーブ
治具。 2 Al押出しスリーブと同一断面形状を有する
請求項1記載の半導体装置外観検査用スリーブ治
具。 3 Al押出しスリーブに継ぎ合わせるためのガ
イドブロツクを端部に有する請求項1記載の半導
体装置外観検査用スリーブ治具。
[Scope of Claim for Utility Model Registration] 1. A sleeve jig used by directly transferring an Al extruded sleeve containing a semiconductor device and a spliced semiconductor device, which has a window hole for checking external defects of the transferred semiconductor device. 1. A sleeve jig for external inspection of semiconductor devices, characterized by having on both sides. 2. The sleeve jig for visual inspection of semiconductor devices according to claim 1, which has the same cross-sectional shape as the extruded Al sleeve. 3. The sleeve jig for visual inspection of semiconductor devices according to claim 1, which has a guide block at the end for joining to the extruded Al sleeve.
JP5343190U 1990-05-22 1990-05-22 Pending JPH0412642U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5343190U JPH0412642U (en) 1990-05-22 1990-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5343190U JPH0412642U (en) 1990-05-22 1990-05-22

Publications (1)

Publication Number Publication Date
JPH0412642U true JPH0412642U (en) 1992-01-31

Family

ID=31574607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5343190U Pending JPH0412642U (en) 1990-05-22 1990-05-22

Country Status (1)

Country Link
JP (1) JPH0412642U (en)

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