JPH0412662U - - Google Patents

Info

Publication number
JPH0412662U
JPH0412662U JP5343290U JP5343290U JPH0412662U JP H0412662 U JPH0412662 U JP H0412662U JP 5343290 U JP5343290 U JP 5343290U JP 5343290 U JP5343290 U JP 5343290U JP H0412662 U JPH0412662 U JP H0412662U
Authority
JP
Japan
Prior art keywords
frame
lead frame
semiconductor device
pilot hole
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5343290U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5343290U priority Critical patent/JPH0412662U/ja
Publication of JPH0412662U publication Critical patent/JPH0412662U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例１の平面図、第２図ａ
〜ｄは実施例１における種類判別方法を示す平面
図、第３図は実施例２の平面図、第４図は実施例
３の平面図、第５図は従来の半導体装置用リード
フレームの平面図である。 １……半導体素子搭載部、２……リード、３…
…パイロツト穴、４……フレーム枠、５……判別
穴、６……切欠き。 Figure 1 is a plan view of Embodiment 1 of the present invention, Figure 2 a
~d is a plan view showing the type discrimination method in Example 1, FIG. 3 is a plan view of Example 2, FIG. 4 is a plan view of Example 3, and FIG. 5 is a plan view of a conventional lead frame for a semiconductor device. It is a diagram. 1...Semiconductor element mounting part, 2...Lead, 3...
...Pilot hole, 4...Frame frame, 5...Discrimination hole, 6...Notch.

Claims (1)

【実用新案登録請求の範囲】 １ 半導体装置用リードフレームにおいて、フレ
ーム枠の幅方向のパイロツト穴位置とオフセツト
した位置に、前記リードフレームの種類を判別す
るための１個又は複数個の貫通穴を有することを
特徴とする半導体装置用リードフレーム。 ２ パイロツト穴と反対側のフレーム枠に貫通穴
に替わる切欠きを設けた請求項１記載の半導体装
置用リードフレーム。[Claims for Utility Model Registration] 1. In a lead frame for a semiconductor device, one or more through holes for identifying the type of the lead frame are provided at a position offset from the pilot hole position in the width direction of the frame frame. A lead frame for a semiconductor device comprising: 2. The lead frame for a semiconductor device according to claim 1, wherein a notch is provided in the frame opposite to the pilot hole in place of the through hole.
JP5343290U 1990-05-22 1990-05-22 Pending JPH0412662U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5343290U JPH0412662U (en) 1990-05-22 1990-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5343290U JPH0412662U (en) 1990-05-22 1990-05-22

Publications (1)

Publication Number Publication Date
JPH0412662U true JPH0412662U (en) 1992-01-31

Family

ID=31574609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5343290U Pending JPH0412662U (en) 1990-05-22 1990-05-22

Country Status (1)

Country Link
JP (1) JPH0412662U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58151048A (en) * 1982-03-03 1983-09-08 Toshiba Corp Preparation of semiconductor device
JPS6167743A (en) * 1984-09-07 1986-04-07 Tokuriki Honten Co Ltd Dental kneading and restoring metallic material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58151048A (en) * 1982-03-03 1983-09-08 Toshiba Corp Preparation of semiconductor device
JPS6167743A (en) * 1984-09-07 1986-04-07 Tokuriki Honten Co Ltd Dental kneading and restoring metallic material

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