JPH0412695Y2 - - Google Patents

Description

[Detailed description of the invention] Industrial application field This invention is based on a light-emitting diode chip (hereinafter referred to as
It relates to an LED lamp equipped with an LED chip.

Conventional technology The LED stem S of the conventional LED lamp is the 16th LED stem S.
As shown in the figure, it has a cathode lead part K and an anode lead part A molded from plastic, and the cathode lead part K is provided with an arbitrary number of LED chips C, and each LED chip C and anode lead Electrical wiring is established with part A.

By the way, this kind of LED lamp, when lit
The LED chip C generates heat and the outer shell P of the plastic part is deformed, and in the worst case, the LED chip C may not light up, which has the disadvantage that mounting reliability cannot be ensured.

Purpose of the invention This invention was made to eliminate the above-mentioned drawbacks, and provides an LED chip that can emit heat generated from the LED chip to the outside to extend its life and ensure mounting reliability. The purpose is to

Means for Solving the Disadvantages Therefore, in order to achieve this purpose, the LED lamp of this invention is an LED lamp in which a cathode lead part and an anode lead part to which a light emitting diode chip is bonded are provided in the outer shell. The outer shell is characterized in that heat dissipation holes are formed that communicate from the outside from a cathode lead part and an anode lead part housed in the outer shell.

Example 1 This invention will be explained below with reference to illustrated examples.

FIG. 1 is a perspective view showing an embodiment of the LED lamp of this invention, and FIGS. 2 to 4 are front, side, and rear views of the same LED lamp.

The lead frame 1 is formed by punching out a copper alloy plate having a thickness of 0.4 mm, for example, and has a configuration in which an arbitrary number of lead groups 3 are connected by connecting portions 2. In this embodiment, each lead group 3 consists of one anode lead part 4 and two cathode lead parts 5 and 6, and an outer shell 7 as a reflector made of plastic, for example, is provided on the tip side of the lead group 3. It is insert molded and constitutes the LED stem 8.

A lead terminal surface 9 having a predetermined shape is formed on one end side of the anode lead portion 4, as shown in FIG. Moreover, mount terminal surfaces 10 and 11 having a predetermined shape are formed on each one end side of the cathode lead parts 5 and 6.

As shown in FIG. 6, each of the lead terminal surfaces 9 and the mount terminal surfaces 10, 11 are bent horizontally so as to be substantially orthogonal to the axial directions of the anode lead portion 4 and cathode lead portions 5, 6. As shown in FIG. 1 and FIG.
They are placed almost flush. Further, as shown in FIG. 8, the other ends of the anode lead portion 4 and the cathode lead portions 5, 6 are led out from the lower end surface 7c of the outer shell 7.

As shown in FIG. 7, LED chips D ₁ to D ₄ are bonded to the upper surfaces of the mount terminal surfaces 10 and 11 at predetermined positions, respectively. The LED chips D ₁ to _{D 4} emit monochromatic light in specific colors, such as red, yellow, and green, when turned on. Also, between the mount terminal surfaces 10 and 11, the mount terminal surface 11
and the lead terminal surface 9 are each provided with a thin metal wire 12.
Electrical connections are made by. Therefore,
As shown in the circuit shown in Fig. 10, each LED chip D ₁ ,
D ₂ and D ₃ , D ₄ are each connected in series, and the LED chip
D ₁ , D ₂ and LED chips D ₃ , D ₄ are connected in parallel.

Incidentally, the LED chips _D1 to _D4 are covered and protected by a transparent hood 7b attached to the outer shell 7, as shown in FIG.

In addition, the outer shell 7 has a plurality of heat dissipation holes 13,1.
4 and 15 are formed. This heat dissipation hole 13,1
4 and 15 are formed so as to communicate with each anode lead part 4 and cathode lead part 5 and 6 from the outer circumferential surface of the outer shell 7, as shown in FIGS. 1 to 4 and 8. This is to dissipate the heat generated in the LED chips _D1 to _D4 outside the outer shell 7.

As shown in FIG. 1, the cathode lead portion 6 is cut off as an unnecessary terminal along the cutting line CL ₂ , and the connecting portion 2 is cut along the cutting line CL ₁ - _{CL 1} . By connecting a power source between the anode lead part 4 and the cathode lead part 5 as shown, desired monochromatic light emission such as red, green, and yellow becomes possible.

At this time, each LED chip D ₁ to _{D 4} generates heat, but the heat can be dissipated to the outside of the outer shell 7 through the heat dissipation holes, and the LED chips due to deformation or deformation of the outer shell 7
It is possible to prevent poor light emission of chips _D1 to _D4 .

Embodiment 2 What has been described above is the 2-pin type LED lamp according to the first embodiment of this invention. Next, the second embodiment will be described.

LED stem 28 of the LED lamp of the second embodiment
As shown in FIG. 11, this is a 3-pin type that uses one anode lead part 24 and two cathode lead parts 25, 26, and the mount terminal surface 30 of the cathode lead part 25 has
LED chips D ₁₁ and D ₁₂ are also mounted on the mount terminal surface 31 of the cathode lead portion 26.
D ₁₃ and D ₁₄ are each bonded.
The LED chips D ₁₁ and D ₁₂ emit light in red, for example, and the LED chips D ₁₃ and D ₁₄ emit light in green, for example.

The LED chips D ₁₁ to _{D 14} are electrically connected to the lead terminal surface 29 of the anode lead portion 24 through thin metal wires 32 . That is, the 12th
As shown in the figure, LED chips D ₁₁ , D ₁₂ and D ₁₃ ,
D ₁₄ in parallel, and LED chips D ₁₁ ,
D ₁₂ and LED chips D ₁₃ and D ₁₄ are connected in parallel.

Therefore, by connecting a power source between the anode lead section 24 and the cathode lead sections 25 and 26, a two-color mixture (yellow) can be obtained.

Also in this case, the heat generated by the LED chips D ₁₁ to _{D 14} can be dissipated to the outside of the outer shell through the heat dissipation holes 13, 14, and 15.

Embodiment 3 In the third embodiment, LED chips D ₂₁ to D ₂₄ of two different luminescent colors are bonded to the mount terminal surfaces 30 and 31 of the cathode lead parts 25 and 26, as in the second embodiment. This is for the case of emitting light in three colors. (See FIG. 11) That is, as shown in FIG. 13, a power source is connected between the anode lead portion 24 and the cathode lead portion 25 to cause the LED chips D ₂₁ to D ₂₂ to emit red light.

Further, as shown in FIG. 14, a power source is connected between the anode lead part 24 and the cathode lead part 26 to cause the LED chips D ₂₃ and D ₂₄ to emit green light.

Furthermore, as shown in FIG. 15, a power source is connected between the anode lead section 24 and the cathode lead sections 25 and 26 to emit mixed red and green light (yellow).

In this way, a three-color luminescent display of red, green, and yellow can be achieved.

Also in this case, the heat generated by each LED chip D ₂₁ to _{D 24} can be dissipated through the heat dissipation holes 13 , 14 , 15 .

By the way, the LED lamp of this invention is not limited to the above-mentioned embodiments, and various shapes and positions of the heat dissipation holes can be considered.

Effects of the invention As is clear from the above explanation, according to this invention, the heat generated by the light emitting diode chip during lighting is dissipated to the outside of the outer shell through the heat dissipation holes, which prevents the outer shell from deforming or deforming. Since it is possible to reliably prevent the diode chip from not lighting up due to heat, it has an excellent effect of ensuring reliability in mounting.

[Brief explanation of the drawing]

Figure 1 is a perspective view showing the first embodiment of the LED lamp of this invention, and Figures 2 to 4 are the same.
Front view, side view and back view of LED lamp, 5th
The figure is a perspective view showing the lead frame, and FIG.
A perspective view showing a state in which one end side of the cathode lead part and the anode lead part is bent; FIGS. 7 to 9 are a plan view, a sectional view, and a bottom view of the same LED lamp; FIG. 10 is a diagram showing the first implementation. A diagram showing the circuit of an example light emitting diode chip, FIG.
A perspective view showing a second embodiment of the LED lamp, the first
2 is a diagram showing the circuit of the light emitting diode chip of the LED lamp, and FIGS. 13 to 15 are diagrams illustrating the circuit operation of the light emitting diode chip in the third embodiment of the LED lamp of this invention.
The figure is a perspective view of a conventional LED lamp. 4, 24...Anode lead part, 5, 6, 2
5, 26...Cathode lead part, 7...Outer shell, 9
... Lead terminal surface, 10, 11 ... Mount terminal surface, D ₁ to D ₄ , D ₁₁ to _{D 14} , D ₂₁ to _{D 24} ... Light emitting diode chip (LED chip), 13, 14, 15
...Heat dissipation hole.

Claims (1)

[Scope of utility model registration request] In an LED lamp in which an outer shell is provided with a cathode lead part and an anode lead part to which a light emitting diode chip is bonded, the outer shell includes:
An LED lamp characterized by having heat dissipation holes that communicate from the outside from a cathode lead part and an anode lead part built into the outer shell.