JPH04128151A - A series of electronic part - Google Patents

Abstract

PURPOSE:To eliminate the shift of an electronic part when it is held on the transfer pallet of an automatic inserting machine or during its transfer by a method wherein a number of electronic parts are held on one side of a tape- like board and nonskid members are formed on the other side thereof. CONSTITUTION:A board 12 is provided with projecting parts 14 extending from one side thereof to serve as a nonskid. An electronic part 16 is held on the other side of the board 12 with its lead wires 20a and 20b held between the board 12 and a pressure-sensitive adhesive tape 22. In the case where the electronic part is mounted on the printed board by an automatic inserting machine or the like, when the electronic parts 16 are separated individually and held on a transfer pallet 16, the projecting parts 14 of the board 12 contacts the base seat 7 of the transfer pallet 6. By these projecting parts 14, a friction resistance between the board 12 and the base seat 7 is increased, thereby making the shift of the electronic parts 16 difficult during its transfer. For this reason, the shifting movement of the electronic part 16 to an inserting index can be effected smoothly.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component series, and particularly to an electronic component series that holds a large number of electronic components having lead wires, such as ceramic capacitors.

(Prior Art) FIG. 4 is a plan view showing an example of a conventional series of electronic components, which is the background of the present invention. Electronic parts series 1 is a tape-shaped mount 2
including. On one main surface of the mount 2, lead wires 3b and 3C attached to an element 3a of an electronic component 3, such as a ceramic capacitor, are arranged at regular intervals in the longitudinal direction. Then, an adhesive tape 4 is attached to the mount 2 from above. Thereby, the electronic components 3 are held on one main surface of the mount 2 at regular intervals in the longitudinal direction. Note that feed holes 5 are formed in the mount 2 and the adhesive tape 4.

The electronic components 3 of the electronic component series 1 are inserted into holes formed in the printed circuit board using, for example, an automatic insertion machine. In this case, the electronic component chain 1 is pulled out by hooking the feed hole 5 with a sprocket wheel, for example. Then, by separating the mount 2 and the adhesive tape 4, the electronic components 3 are divided one by one.

The divided electronic components 3 are transported by a transport pallet 6, as shown in FIG. At this time, the mount 2 side is placed on the pedestal 7 of the transport pallet 6, and the lead wires 3b, 3c are pressed by the pressing member 8 from the adhesive tape 4 side. A pressing force is applied to this pressing member 8 by a spring or the like.

The electronic component 3 held on the transport pallet 6 is transported to the insertion index, transferred to the insertion index, and then the leads M3b and 3c are cut, and as shown in FIG. 6, the lead wire 3b + 3 Cr printed circuit board 9 is inserted and held in the hole 9a. Then, the electrodes of the printed circuit board 9 and the glue lines 3b, 3c of the electronic component 3 are soldered.

(1Jaf to be Solved by the Invention) However, in such a conventional electronic component assembly 1, the circumferential resistance between the mount 2 and the pedestal 7 of the conveyance pallet 6 is small, so that On the other hand, when the electronic component 3 is held on the transport pallet 6 or during transport, it may slip and shift.
There was a drawback that the electronic component 3 could not be transferred to the insertion index, and the electronic component 3 could not be attached to the printed circuit board 9. Therefore, the reliability of inserting the electronic component 3 into the printed circuit board 9 becomes low.

Therefore, the main object of the present invention is to provide a set of electronic components that will not shift when the electronic components are held on a transport pallet of an automatic insertion machine or during transport.

(Means for Solving the Problems) The present invention is an electronic component series holding a large number of electronic components each having a lead wire on one main surface of a tape-shaped mount,
This is a series of electronic components with a non-slip plate formed on the other main surface of the mount.

(Function) Since the anti-slip layer is formed on the other main surface of the mount, the coefficient of friction between the mount and the pedestal of the conveyor pallet 7) is large.

(Effects of the Invention) According to the present invention, since the frictional resistance between the mount and the base of the transport pallet is large, electronic components are unlikely to shift when held on the transport pallet of an automatic insertion machine or during transport. Therefore, electronic components can be transferred smoothly to the insertion index, and electronic components can be easily attached to the printed circuit board. Therefore, the ease with which electronic components can be inserted into the printed circuit board is improved.

The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.

(Embodiment) FIG. 1A is a plan view showing an embodiment of the present invention, and FIG. 1B is a bottom view thereof. This electronic component series 10 includes a mount 12. The mount 12 is made of, for example, paper or synthetic resin, and is formed into a tape shape.

A convex portion 14 is formed on the mount 12 to prevent slipping, and protrudes from one main surface side toward the other main surface side.

The convex portion 14 may be formed by, for example, pushing the mount 12 from one main surface side to the other main surface side with a punch, or by pasting a granular material on the other main surface of the mount 12. It may also be formed by attaching.

On one main surface of the mount 12, an electronic component 16 having a lead wire, such as a ceramic capacitor, is held.

The electronic component 16 includes an element 18 and this element 1.
Lead wires 20! of the electronic components 16 are placed on one main surface side of the mount 12 including the lead wires 20a and 20b extending from the electronic component 16 at regular intervals in the longitudinal direction. , 20b are arranged. A lead wire 20a is provided on one main surface side of the mount 12.
Adhesive tape 22 is attached from above 20b.

In this way, the electronic component 16 has its lead wires 2°a, 2
By sandwiching 0b between the mount 12 and the adhesive tape 22, it is held on one main surface side of the mount 12.

Furthermore, a plurality of feed holes 24 are formed in the mount 12 and the adhesive tape 22. These feed holes 24 are formed, for example, between adjacent electronic components 16. Then, the electronic component chain 1o holding a large number of electronic components 16 is folded in a meandering manner and packed in a box, or wound on a reel, for example.

When attaching the electronic component 16 held in the electronic component chain 1o to a printed circuit board using an automatic insertion machine or the like, the feed hole 24 is hooked with a sprocket wheel, for example,
The electronic component series 10 is pulled out from the box or reel. Then, the mount 12 and the adhesive tape 22 are cut, and the electronic components 16 are separated one by one as shown in FIG. The separated electronic component 16 is held on a conveyance pallet 6 as shown in FIG. 5 and conveyed to a location where the printed circuit board is located. At this time, the electronic component I6 is held such that the pedestal 7 side of the transport pallet 6 and the other main surface side of the mount 12 are in contact with each other.

When using the electronic component series 10 of this invention, the electronic component 16
When the carrier pallet 6 is held on the carrier pallet 6, the convex portion 14 of the mount 12 and the pedestal 7 of the carrier pallet 60 come into contact with each other. This convex portion 14 increases the frictional resistance between the mount 12 and the pedestal 7, and the electronic component 16 is
6 does not easily shift, so the electronic component 16 can be smoothly transferred to the insertion index.

In fact, as shown in FIG. 2, an experiment was conducted in which four convex portions 14 were formed on the mount 12 corresponding to one electronic component 16. As a result, when a conventional electronic component series without convex portions was used, the electronic components held on the transport pallet were displaced at a rate of approximately 30%. On the other hand, when the electronic component assembly 10 of the present invention is used, the rate at which the electronic components 16 held on the transport pallet 6 shifts is 0.
%Became.

In the above-mentioned embodiment, the convex portion 14 was formed on the other main surface of the mount 12 to prevent slipping, but as shown in FIG. may be formed.

[Brief explanation of the drawing]

FIG. 1A is a plan view showing an embodiment of the present invention, and FIG. 1B is a bottom view thereof. FIG. 2 is a perspective view showing a state in which the electronic components of the series of electronic components shown in FIGS. 1A and 1B are separated one by one. FIG. 3 is a perspective view showing another embodiment of the invention. FIG. 4 is a plan view showing an example of a conventional series of electronic components, which is the background of the present invention. FIG. 5 is a perspective view showing a conveyance pallet of an automatic insertion machine using a series of electronic parts. FIG. 6 is an illustrative view showing a state when electronic components are attached to a printed circuit board. FIG. 7 is a perspective view showing a state in which electronic components shift when a conventional series of electronic components is held by a conveyor barent. In the figure, 10 is an electronic component series, 12 is a mount, 14 is a convex portion, 16 is an electronic component, 18 is an element, 20a and 20b are lead wires, 22 is an adhesive tape, and 24 is a feed hole. Patent applicant Murata Manufacturing Co., Ltd. Representative Patent attorney Oka 1) Kei Zen

Claims (1)

[Claims] An electronic component series that holds a large number of electronic components having lead wires on one principal surface of a tape-shaped mount, the electronic component series having a non-slip surface formed on the other principal surface of the mount.