JPH04130800A - Correcting method for x-y table operation and component mounting device applying same - Google Patents

Abstract

PURPOSE:To accurately mount a component as an instructed device position without influence of a straightness of an X-Y table, etc., by position-correcting device instruction coordinates based on deviation amounts stored with respect to points for constituting its zone. CONSTITUTION:A mounting head is moved from an origin O in a lattice state at a constant pitch in X-Y directions a board to be corrected is position-measured by a two-dimensional measuring unit, etc., and deviations between the coordinates for instructing the operation and the measured values are calculated. Which zone of the lattice the coordinates for instructing the mounting of a component belongs to is judged by a central processing unit, the deviations of the points for constituting the zone are removed from a memory, and coordinates to be actually reached are calculated. The component of a component supply unit 11 is sucked by a suction nozzle 4 provided rotatably at the head 3, the sucked component image is input to an image sensing unit 7, the sucking position of the component is detected by a recognition unit, the positional deviation of the sucking position is corrected, and the component is rotated at a desired angle. An X-Y table controller is so controlled to be corrected as to actually mount it in the instructed mounting position coordinates based on the calculated coordinate values to mount the component in a predetermined position of a printed board.

Description

Detailed Description of the Invention (a) Industrial Application Field The present invention provides a correction method for correcting the influence of the straightness of an X-Y table, and a method for correcting the influence of the straightness of an When automatically installing electronic components,
The present invention relates to a component mounting device that corrects the position of an X-Y table.

(B) Conventional Technology Various correction methods have been proposed in the past for component mounting apparatuses to improve mounting accuracy.

For example, Japanese Patent Application Laid-Open No. 62133794 discloses an automatic article loading device that corrects the influence of errors in the mounting of each mounting head attached to a rotary index table; A component mounting method is disclosed that corrects the influence of eccentricity of a rotatably mounted suction nozzle.

Furthermore, Japanese Patent Application Laid-Open No. 215-215-00 discloses a method for calibrating the position of an electronic component mounting head for correcting individual differences in the positioning of each mounting head for a plurality of mounting heads attached to a rotary index table. There is.

(c) Problems to be Solved by the Invention In these prior art, the correction of the position of the mounting head is mainly discussed, and the straightness of the X'-Y table on which the substrate is mounted and moved is corrected.

It does not take into account positioning errors, which do not extend to component mounting positions.

Therefore, when a flat package type IC element or the like, which requires highly accurate positioning, is mounted on a printed circuit board, there is a problem in that mounting misalignment occurs only by correcting the position of the mounting head using the above-mentioned prior art.

(Means for solving the slope problem) Therefore, the present invention divides the operating range of the X-Y table into a grid, moves the X-Y table to each point constituting this grid, and gives it as an operation command. The discrepancy between the coordinates and the coordinates actually reached is detected and stored.For example, if the mounting head is mounted on an Depending on which section it belongs to, the position of the mounting command coordinates is corrected based on the amount of deviation stored for each point constituting the section.

(E) Function With the above configuration, positioning errors due to the straightness of the X-Y table are corrected, so the X-Y table can be positioned according to the coordinates given as the operation command.

(f) Embodiment FIG. 1 is a configuration diagram showing an embodiment of a component mounting apparatus set forth in claim 2, which uses the X-Y table motion correction method of the present invention. 1 is the component mounting device;
Mounting head 3 movably attached to the X-Y table 2
A suction nozzle 4 rotatably installed in the parts supply section 1
Ten components are sucked and mounted on the printed circuit board 9. 5 is
An imaging unit that captures the board position recognition mark image of the printed board 9 supported on the board support unit 8; 6 is the printed board 9;
7 is an imaging section that captures an image of the component being sucked by the suction nozzle 4. The conveyor 1o feeds the printed circuit board 9 onto the board support stand 8, and discharges the pressure after the mounting is completed.

The automatic control system of the component mounting apparatus 1 is shown in FIG. Reference numeral 20 denotes a main body control section, the central part of which is a central processing section 21, which includes a memory 22 and a CRT 2.
3. A keyboard 24 is included. Central processing unit 21
is connected via the pass line 25 to the lighting controller 26,
- Controls the Y table controller 27, the head controller 28, the conveyor controller 29, the substrate support controller 30, and the component supply controller 31.

The illumination controller 26 controls the illumination section 12, and the illumination section 12 is a collective name for the illumination sections that are respectively combined with the aforementioned imaging section 5.6.7.

There is a recognition unit 40 separate from the main body control unit, and a central processing unit 41
A memory 42 and a CRT 43 are attached to this, and an A/D connected to the central processing unit 41 via a pass line 44.
It is composed of a converting section 45 and an image processing section 46. A/D
The conversion section 45 is connected to each imaging section 5, 6.7. Further, the central processing section 41 is connected to the central processing section 21 of the main body control section 20 by a communication line 50.

Next, a method for correcting the X-Y table motion of the present invention in a component mounting apparatus having such a configuration will be explained based on FIG. 3.

Prior to component mounting, the correction board M is prepared.The correction board M is conveyed by the conveyor 10, placed on the board support stand 8, and held so that its negative side is in contact with the reference surface of the reference side conveyor 10a. Further, a suction nozzle-like jig having a conical protrusion at the tip is attached to the mounting head. Then, the mounting head is moved from the origin 0 in the X-Y direction at a fixed pitch in a grid pattern, and a mounting operation is performed such that the protrusion at the tip of the jig contacts the surface of the correction substrate M at each point forming the grid. let The position of the dents on the correction substrate M caused by the protrusions thus obtained is measured using a two-dimensional measuring machine, and the deviation between each coordinate at which the operation was instructed and each measured value is calculated. Each of these deviation amounts is stored in the memory 22.

When mounting a component, the central processing unit 21 first determines to which division of the aforementioned grid the coordinates p (x, y) to which the mounting is commanded belongs, and the points a and b constituting that division are used. , c, and d are retrieved from the memory 22 at points a and b.

The motion command coordinates A, B, C, and D corresponding to c and d are A (
XA, yA) B (XA, Y,) XA≦X≦xcC(XC
, yA ) D(xc, y,) yA≦Y≦y8, and this point a
, b, c, d and the corresponding motion command coordinates A, B, C, D
If the amount of deviation from the , a (XA+△X a + 'l' A+Δy,)b (XA+
Δxb+:! 7' a+△yb)c (xc
10△X a + Y A+△y, )d (xc+△
x < +:! / , +△ya), and calculate the points p+(X', y') and p2(x", y") by internally dividing the straight line ac and straight line bd into X-xA :x, -X, respectively. Then, the point that internally divides the straight line plp2 into Y-Y^ :y, Y is the coordinate p(x,
y).

While calculating the coordinate value p (x, y) in this way,
A suction nozzle 4 rotatably provided on the mounting head 3 sucks the component in the component supply section 11, an image of the sucked component is captured by the imaging section 7, the pickup position of the component is detected by the recognition section 40, and the suction position shift is detected. is corrected and the part is rotated to a desired angle, and the calculated coordinate value p (
Based on the commanded mounting position coordinate p (x, y)
In this example, the X-Y table controller is corrected and the components are mounted at predetermined positions on the printed circuit board so that the components can be actually mounted on the lattice. , a case has been described in which the mounting position is plotted on the correction board using a jig attached to the mounting head and measured using another measuring device.
The amount of deviation can also be measured using image recognition. That is, the reference side conveyor 10 is placed on the correction board.
A desired lattice is created by drawing straight lines at regular pitches parallel to the substrate reference plane of a, and straight lines perpendicular to the straight lines at regular pitches, and a recognition mark is provided on each intersection point.

Then, a command is given to move the XY table so that the center of the imaging section 5 is located at the coordinates where this recognition mark is provided. The imaging unit 5 images the recognition mark at the point actually reached, and the image processing unit 46 calculates the center of gravity of the recognition mark via the A/D conversion unit 45 of the recognition unit 40. In this method, the amount of deviation between the coordinates of the center of gravity and the commanded coordinates is stored in the memory 42 for each point.

Further, as an embodiment of the component mounting device set forth in claim 3, the present invention X-Y
The table motion correction method will be applied and explained.

The measurement of the positioning error with respect to the movement command value of the moving table 8, which is performed before mounting the parts, can be similarly applied to the embodiment described in the second aspect of the present invention. That is, a protruding jig is attached to the tip of the suction nozzle 4 of the mounting head 3 located at the component mounting position E, and the correction board, which is positioned and held on the moving table 8, is aligned in a grid pattern in the X-Y direction at a fixed pitch. Move it, perform a mounting operation at each point, and leave a mark on the correction board.
The amount of deviation between the coordinates of each dent and each coordinate that commanded movement is measured and stored.

When mounting a component, it is determined which section of the grid formed on the movable table the mounting position belongs to, and the coordinate values that will actually be reached are determined based on the amount of deviation of each point that makes up the grid, as in the previous embodiment. Calculate.

While this coordinate value is being calculated, the components in the component supply cassette 2 are sucked by the suction nozzle 4 provided on the mounting rack 3 located at the component takeout position A on the outer periphery of the rotary table 5.
The position of the suctioned component is regulated at the component regulation position B, the position of the component is detected by image recognition at the component recognition position C, and deviations in the suction position of the component are corrected, and the suction nozzle is rotated at the component posture adjustment position. to adjust the part to the desired angle. Then, based on the above-described calculated coordinate values, the moving table 8
The components are corrected and mounted on the printed circuit board at predetermined positions.

(G) Effects of the Invention As described above, the X-Y table motion correction method of the present invention makes it possible to accurately position the motion according to the commanded coordinates without being affected by the straightness of the X-Y table. can.

In addition, the component mounting device of the present invention allows components to be mounted with high precision according to the commanded mounting position without being affected by the straightness of the x-y table, etc. It is effective for wearing.

[Brief explanation of drawings]

The figures show an embodiment of the component mounting device according to claim 2 of the present invention, FIG. 1 is a partially cut away perspective view thereof, FIG. 2 is a block diagram showing a control system, and FIG. 3 is an X - It is an explanatory diagram of a Y table operation correction method. 1. Component placement device, 2- X-Y table, 3.
Mounting head, 4 Suction nozzle, 5,6° 7 Imaging unit, 8 Board support stand, 9 Printed circuit board, 10 Conveyor, 11 Parts supply unit 20 Main body control unit, 40
Recognition unit, M correction board.

Claims (3)

[Claims] (1) X-Y characterized by sequentially performing the following steps
Table motion correction method. a. A process of dividing the operating range of the X-Y table into a grid pattern. b. A step of moving the X-Y table to each point constituting the grid and measuring the deviation between the coordinates given as an operation command and the coordinates actually reached by the X-Y table. c. Step of memorizing the deviation for each point. d. When giving actual movement to the X-Y table that supports the supported object, depending on which section the destination belongs to, the movement command coordinates are determined based on the amount of deviation stored for each point that makes up that section. The process of correction. (2) A suction nozzle rotatably installed on a mounting head movably attached to an X-Y table suctions the parts;
A component mounting device that detects the position of a suctioned component using an image recognition means, corrects the suction position deviation, rotates the component to a desired angle, and mounts the component at a predetermined position on a printed circuit board. First, there is a section forming step in which the movement range of the mounting head is divided into a grid pattern, and the mounting head is moved to each point constituting the grid, and the coordinates given as a mounting command and the coordinates actually reached by the center of the mounting head are determined. a measurement process for measuring the deviation of the parts; a storage process for storing the amount of deviation for each point; and a storage process for storing the deviation amount for each point, and configuring the mounting command coordinates according to which section the position to be mounted belongs to when mounting the component. A component mounting apparatus characterized in that a position correction process is performed in sequence, in which the position correction process is performed based on the stored deviation amount for each point. (3) The suction nozzles installed on multiple component mounting heads placed on a rotating body that indexes in a horizontal plane pick up the parts, correct the misalignment of the suction position of the picked parts, and rotate the parts to a desired angle. In a component mounting device that mounts components at predetermined positions on a printed circuit board mounted on a board mounting stand movably attached to an X-Y table, the movement range of the board mounting stand is divided into a grid pattern before mounting components a step of forming a section; a measuring step of moving the substrate mounting table to each point constituting the grid and measuring the deviation between the coordinates given as a mounting command and the coordinates actually reached at the center of the mounting head; and each of the above steps. A storage process that stores the amount of deviation for each point, and when installing a component, depending on which section the position to be installed belongs to, the mounting command coordinates are determined based on the amount of deviation stored for each point that makes up that section. A component mounting device characterized in that a position correction step is performed sequentially.