JPH04133475U - Mounting structure for surface mount components - Google Patents

Abstract

(57) [Summary] [Purpose] To improve mounting density in automatic mounting of surface mount components. [Configuration] A plurality of surface mount components 1 are mounted on the largest outer surface 1.
a facing each other and bonded with adhesive 2 to form an assembly S, and this assembly S is assembled into a printed wiring board 6 with the surface consisting of the circumferential surface of the surface mount component 1 as the bonding surface Sa.
Load it on top. [Effect] Part spacing during automatic mounting is no longer necessary, and
Since surface mount components are bonded in an upright position, the mounting area can be reduced.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention is a mounting structure for surface mount components that automatically mounts surface mount components onto a wiring board. related.

0002

[Conventional technology]

Conventionally, the mounting structure for surface mount components has been shaped like a rectangular parallelepiped, for example, as shown in Figure 2. The formed surface mount component 1 is attached to a printed wiring board with the largest rectangular outer surface 1a having the largest area. The six sides are joined facing each other. This surface mount component 1 is mounted on an automatic mounting machine, for example. Therefore, one by one was placed on the printed wiring board 6 at predetermined intervals b.

0003

[Problem that the idea aims to solve]

However, in the conventional mounting structure for surface mount components, only one surface mount component can be mounted. In order to place the printed wiring board one by one using an automatic mounting machine, the mounting accuracy of the automatic mounting machine, etc. In consideration of setting, and the mounting density of surface mount components is reduced accordingly. There was a problem.

0004 In addition, the surface in contact with the printed wiring board 6 is made the largest outer surface 1a with the largest surface area. Since it is necessary to achieve stability by bonding the maximum outer surface 1a, the packaging density is reduced. ing.

[0005] This invention was devised in view of the above-mentioned problems. The purpose of this invention is to provide a mounting structure for surface mount components that improves the packaging density of the components.

[0006]

[Means to solve the problem]

In order to achieve the above purpose, the surface mount component mounting structure of the present invention maximizes the area. Two rectangular maximum outer surfaces facing each other, and four rectangular maximum outer surfaces continuous to these two maximum outer surfaces. A large number of rectangular parallelepiped surface mount components with a rectangular peripheral surface are mounted on a wiring board. In a surface mount component mounting structure, multiple surface mount components are placed with their largest outer surfaces facing each other. facing each other and interposing an adhesive between the largest outer surfaces to form a connected aggregate. One surface consisting of the peripheral surface of each surface mount component in the assembly is used as a bonding surface, and the bonding surface is used for wiring. It has a configuration in which it is bonded to a substrate.

[0007]

[Effect]

According to the mounting structure for surface mount components having the above configuration, for example, an automatic mounting machine can be used. Before placing surface mount components on a printed wiring board, The surface mount components are bonded together using adhesive, etc., and the surface area of the surface mount components is reduced. Small peripheral surfaces are joined together and mounted at once.

[0008]

【Example】

Embodiments of the present invention will be described below with reference to the drawings. Figure 1 shows the glued table This shows a state in which an assembly of surface-mounted components is mounted on a printed wiring board.

[0009] The surface mount components 1 are formed in the shape of a rectangular parallelepiped, and are arranged facing each other to maximize the area. two rectangular maximum outer surfaces 1a, and four rectangles continuous to these two maximum outer surfaces 1a. It has a shaped peripheral surface 1b.

0010 That is, generally, the surface mount component 1 has a length L, a width W, and a height H such that L>W>H. The surface areas c and d of the maximum outer surface 1a and one circumferential surface 1b are c =L×W, d=L×H, and c>d.

[0011] Further, the plurality of surface mount components 1 are arranged so that their maximum outer surfaces 1a face each other, and the maximum outer surfaces 1a thereof face each other. An assembly S of surface mount components 1 is connected by interposing an adhesive 2 having a thickness of a between the large outer surfaces 1a. is formed. Here, we will take as an example an assembly S using three arbitrary surface mount components. and show. Here, the adhesive 2 is used to prevent short circuit between the electrodes 3 of the surface mount component 1. An insulating adhesive is used.

0012 This assembly S has one surface consisting of the peripheral surface 1b of each surface mount component 1 as a bonding surface. The bonding surface Sa is bonded to the printed wiring board 6 as Sa.

[0013] Therefore, this assembly S consists of several surface mount components 1 glued together. The assembly S is treated as one surface-mounted component, and printed and mounted using a conventional automatic mounting machine. It is mounted onto the wire board 6.

[0014]

[Effect of the idea]

As explained above, according to the surface mount component mounting structure of the present invention, multiple Surface-mounted components are bonded together using adhesives, etc., and mounted on the wiring board all at once. Previously required component spacing can now be reduced to just the thickness of the adhesive; As the size can be reduced, the packaging density can be increased.

[0015] Moreover, the bonding area that one surface mount component occupies on the wiring board is the largest ever. The area of the outer surface has been reduced by using the smaller peripheral surface as the adhesive surface. This can also improve the packaging density. It has this effect.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a mounting structure for surface mount components according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an example of a conventional surface mount component mounting structure.

[Explanation of symbols]

S aggregate Sa joint surface 1 Surface mount parts 1a Maximum outer surface 1b Circumferential surface 2 Adhesive 3 electrode 4 Printed wiring board a Width of adhesive b Part spacing c Maximum outer surface area of surface mount components d Area of one peripheral surface of surface mount component

Claims (1)

[Scope of utility model registration request] 1. A rectangular parallelepiped-shaped surface mount component having two mutually opposing rectangular maximum outer surfaces having the maximum area and four rectangular circumferential surfaces continuous to these two maximum outer surfaces is mounted on a wiring board. In a mounting structure for a large number of surface mount components mounted on a board, a plurality of surface mount components are connected with their largest outer surfaces facing each other and an adhesive is interposed between the largest outer surfaces to form an aggregate. A mounting structure for surface mount components, characterized in that one surface consisting of the circumferential surface of each surface mount component is used as a bonding surface, and the bonding surface is bonded to a wiring board.