JPH0414860A - Semiconductor device - Google Patents

Abstract

PURPOSE:To reduce protrusion of a lead toward a main surface of a body as compared with a protruding lead from the side of the body and to decrease its mounting area by leading leads from the lower surface of the body, forming the led end in an L shape. CONSTITUTION:A semiconductor chip 12 is placed on a base 10 by a die bonder by using a lower die 9 formed of glass epoxy material and formed integrally with a lead 11. In this case, the chip 12 is secured with adhesive. Then, the electrode 13 of the chip 12 is bonded via a wire 14 at the L-shaped part toward the center of the lower mold 9 of the lead 11. Thereafter, an upper mold 15 is formed by a molding machine to provide a completely assembled product. In a semiconductor device 8 obtained in this manner, since the leads 11 protrude from the lower surface of a body 16, the protruding area of the lead toward the main surface of the body can be reduced to decrease its mounting area.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technology for manufacturing semiconductor devices, and particularly to a technology that is effective when used in manufacturing large-sized semiconductor devices.

[Conventional technology] As a conventional technique, there is a technique as shown in FIG.

In the figure, 1 indicates a semiconductor device. 2 is a semiconductor chip, which is the heart of the semiconductor device. Reference numeral 5 represents a wire, which is made of a thin metal wire, and is used to establish electrical conduction between the electrode 4 of the semiconductor chip and a lead to be described later.0 5 represents a lead, to which one end of the wire 3 is bonded. . The other end of the lead 5, which is different from the one end to which the wire 6 is bonded, is led out from the side surface of the main body, which will be described later, parallel to the main surface of the main body, and then
It is bent into a letter shape. Reference numeral 6 denotes a die pad, which is a rectangular plate-like object to which the semiconductor chip is bonded with an adhesive (not shown). Reference numeral 7 denotes a main body, which is a rectangular object that covers the semiconductor chip 2, wires 5, and other main parts of the semiconductor device.

[Problems to be Solved by the Invention] When the present inventor manufactured a semiconductor device with a large number of pins (for example, one with leads of 100P or more) using the above-mentioned conventional technology, the following problems were found. I discovered something.

That is, as the number of bins increases, it is necessary to arrange a large number of leads, which causes the problem that the size of the main surface of the main body increases. As a result, in conventional semiconductor devices in which the leads are led out from the side of the main body, there is a problem in that the mounting area (mounting on a printed circuit board, etc.) becomes large because the leads are located further outside the main body. The inventor found out.

An object of the present invention is to provide a semiconductor device manufacturing technique that can reduce the mounting area even for a multi-bin semiconductor device.

Means for Solving the CM Problem] The semiconductor device of the present invention comprises a semiconductor chip, leads arranged around the semiconductor chip, and a main body in which at least a part of them is sealed. It is characterized by protruding from the lower surface and having an L-shaped tip.

Embodiment FIG. 1 is a schematic side view showing a semiconductor device which is an embodiment of the present invention.

In the figure, 8 indicates a semiconductor device. 9 is the lower mold;
A main body is formed with an upper mold described later. Reference numeral 1D denotes a mounting portion, which is provided at the center of the lower mold, and has a recessed portion on which a semiconductor chip, which will be described later, is placed. Reference numeral 11 denotes a lead, which penetrates from the upper surface to the lower surface of the lower mold 9.
Both ends are bent into an L-shape. The lower mold 9 is made of, for example, Gala Evo material, and has a lead 11 embedded therein. 12 is a semiconductor chip, and the above-mentioned mounting section 10
It is placed on the board with an adhesive (not shown) in between. Reference numeral 15 denotes an electrode, which is provided on the upper surface of the semiconductor chip 12. A wire 14 is made of a thin metal wire and is bonded to establish electrical conduction between the electrode 13 of the semiconductor chip 12 and the lead. 15 is the upper mold;
It is molded from resin, covers the main parts of the semiconductor device 8 such as the semiconductor chip, and forms a main body 16 together with the lower mold 9 .

Hereinafter, the operation of an embodiment of the present invention having the above-described structure will be explained.

First, a semiconductor chip 12 is placed on a holder 10 using a die bonder (not shown) using a lower mold 9 made of Gala Evo material and molded integrally with the leads 11 . At this time, the semiconductor chip 12 is fixed with an adhesive (not shown). Next, using a wire bonder (not shown), the electrodes 13 of the semiconductor chip 12 and the L-shaped portions of the leads 11 facing the center of the lower mold 9 are bonded with wires 14. After that, the upper mold 15 is molded using a molding device (not shown).
is formed, resulting in a finished assembled product.

In the semiconductor device 8 obtained in this manner, the leads 11 protrude from the lower surface of the main body 16, and the protruding area of the leads toward the main surface of the main body can be made smaller than when the leads 11 protrude from the side surfaces of the main body. The area can be reduced.

[Effects of the invention] (1) Leads are led out from the bottom surface of the main body of the semiconductor device,
By forming the led-out tip into an L-shape, the protrusion of the lead toward the main surface of the main body can be reduced compared to the case where the lead protrudes from the side of the main body, making it easy to mount even in multi-pin semiconductor devices. This has the effect of reducing the area.

(2) By leading out the leads from the bottom surface of the semiconductor device body and forming the leading ends into an L-shape, the lead is more stable during mounting compared to the case where the leads are extended linearly from the bottom surface of the body. It will be done.

[Brief explanation of drawings]

FIG. 1 is a schematic side view showing a semiconductor device that is an embodiment of the present invention. FIG. 2 is a schematic side view showing a semiconductor device for explaining the prior art. 1.8------Semiconductor device 2, 12---Semiconductor chip 3.14---Wire 4.13---Electrode 5, 11---Lead 6・・・・−・−・−・−・・Die pad 7.16
−・−・−・Main body 9・・・・・・・・・−・・・Lower mold 10・−1・−・−・−・Placement part 15−・・・・・・・--Top mold applicant Seiko Epson Co., Ltd. agent Patent attorney Kizobe Suzuki (and one other person) Bottom mold lead wire main body Figure 1

Claims (1)

[Claims] (1) In a semiconductor device consisting of a semiconductor chip, leads arranged around the semiconductor chip, and a main body in which at least a portion of these leads are sealed, the leads protrude from the bottom surface of the main body, and the tips thereof are L-shaped. A semiconductor device characterized by: