JPH0415023U - - Google Patents
Info
- Publication number
- JPH0415023U JPH0415023U JP5307890U JP5307890U JPH0415023U JP H0415023 U JPH0415023 U JP H0415023U JP 5307890 U JP5307890 U JP 5307890U JP 5307890 U JP5307890 U JP 5307890U JP H0415023 U JPH0415023 U JP H0415023U
- Authority
- JP
- Japan
- Prior art keywords
- absorbing layer
- infrared absorbing
- thermopile
- transparent film
- insulating transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Description
第１図は本考案の一実施例によるサーモパイル
の平面図、第２図は第１図の−線断面図、第
３図は従来のサーモパイルの一例の平面図、第４
図は第３図の−線断面図である。
１，１′……絶縁性透明フイルム、２，２′…
…薄膜熱電対パターン、２１，２１′……熱電対
温接点部、２２，２２′……熱電対冷接点部、３
１，３１′，３２，３２′……熱電対パターン出
力端子、４，４′……ヒートシンク基板、４１，
４１′……ヒートシンク中空穴、７，７′……赤
外線吸収層、８……付加赤外線吸収層。
FIG. 1 is a plan view of a thermopile according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line -- in FIG.
The figure is a sectional view taken along the line -- in FIG. 1, 1'... Insulating transparent film, 2, 2'...
... Thin film thermocouple pattern, 21, 21'... Thermocouple hot junction part, 22, 22'... Thermocouple cold junction part, 3
1, 31', 32, 32'...Thermocouple pattern output terminal, 4,4'...Heat sink board, 41,
41'... Heat sink hollow hole, 7,7'... Infrared absorption layer, 8... Additional infrared absorption layer.
Claims (1)
、かつ前記絶縁性透明フイルムの一面には前記熱
電対パターンの温接点部の近傍に位置した赤外線
吸収層を設けているサーモパイルにおいて、前記
絶縁性透明フイルムの反対面に形成された付加赤
外線吸収層を含み、前記熱電対パターンの温接点
部は前記付加赤外線吸収層に対応した位置に設け
られていることを特徴とするサーモパイル。 ２ 前記付加赤外線吸収層は金黒である請求項１
記載のサーモパイル。[Claims for Utility Model Registration] 1. An insulating transparent film is provided with a thermocouple pattern, and one surface of the insulating transparent film is provided with an infrared absorbing layer located near the hot junction of the thermocouple pattern. The thermopile includes an additional infrared absorbing layer formed on the opposite side of the insulating transparent film, and the hot junction portion of the thermocouple pattern is provided at a position corresponding to the additional infrared absorbing layer. thermopile. 2. Claim 1, wherein the additional infrared absorbing layer is gold black.
Thermopile as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5307890U JP2517199Y2 (en) | 1990-05-23 | 1990-05-23 | Thermopile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5307890U JP2517199Y2 (en) | 1990-05-23 | 1990-05-23 | Thermopile |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415023U true JPH0415023U (en) | 1992-02-06 |
| JP2517199Y2 JP2517199Y2 (en) | 1996-11-13 |
Family
ID=31573951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5307890U Expired - Lifetime JP2517199Y2 (en) | 1990-05-23 | 1990-05-23 | Thermopile |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2517199Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006047085A (en) * | 2004-08-04 | 2006-02-16 | Denso Corp | Infrared sensor device and manufacturing method thereof |
| JP2024063545A (en) * | 2022-10-26 | 2024-05-13 | 三菱電機株式会社 | Semiconductor laser device |
-
1990
- 1990-05-23 JP JP5307890U patent/JP2517199Y2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006047085A (en) * | 2004-08-04 | 2006-02-16 | Denso Corp | Infrared sensor device and manufacturing method thereof |
| JP2024063545A (en) * | 2022-10-26 | 2024-05-13 | 三菱電機株式会社 | Semiconductor laser device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2517199Y2 (en) | 1996-11-13 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |