JPH041504U - - Google Patents

Info

Publication number
JPH041504U
JPH041504U JP1990040496U JP4049690U JPH041504U JP H041504 U JPH041504 U JP H041504U JP 1990040496 U JP1990040496 U JP 1990040496U JP 4049690 U JP4049690 U JP 4049690U JP H041504 U JPH041504 U JP H041504U
Authority
JP
Japan
Prior art keywords
optical fiber
recess
package
optical
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990040496U
Other languages
English (en)
Japanese (ja)
Other versions
JP2527665Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990040496U priority Critical patent/JP2527665Y2/ja
Publication of JPH041504U publication Critical patent/JPH041504U/ja
Application granted granted Critical
Publication of JP2527665Y2 publication Critical patent/JP2527665Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Optical Couplings Of Light Guides (AREA)
JP1990040496U 1990-04-16 1990-04-16 光送信器と光ファイバとの結合装置及び光受信器と光ファイバとの結合装置 Expired - Lifetime JP2527665Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990040496U JP2527665Y2 (ja) 1990-04-16 1990-04-16 光送信器と光ファイバとの結合装置及び光受信器と光ファイバとの結合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990040496U JP2527665Y2 (ja) 1990-04-16 1990-04-16 光送信器と光ファイバとの結合装置及び光受信器と光ファイバとの結合装置

Publications (2)

Publication Number Publication Date
JPH041504U true JPH041504U (cs) 1992-01-08
JP2527665Y2 JP2527665Y2 (ja) 1997-03-05

Family

ID=31550334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990040496U Expired - Lifetime JP2527665Y2 (ja) 1990-04-16 1990-04-16 光送信器と光ファイバとの結合装置及び光受信器と光ファイバとの結合装置

Country Status (1)

Country Link
JP (1) JP2527665Y2 (cs)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54130825A (en) * 1978-03-31 1979-10-11 Canon Inc Image scanner

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54130825A (en) * 1978-03-31 1979-10-11 Canon Inc Image scanner

Also Published As

Publication number Publication date
JP2527665Y2 (ja) 1997-03-05

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term