JPH041519B2 - - Google Patents

Info

Publication number
JPH041519B2
JPH041519B2 JP57132663A JP13266382A JPH041519B2 JP H041519 B2 JPH041519 B2 JP H041519B2 JP 57132663 A JP57132663 A JP 57132663A JP 13266382 A JP13266382 A JP 13266382A JP H041519 B2 JPH041519 B2 JP H041519B2
Authority
JP
Japan
Prior art keywords
layer
powder
ceramic substrate
mixed
dielectric constant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57132663A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5922398A (ja
Inventor
Masahiro Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13266382A priority Critical patent/JPS5922398A/ja
Publication of JPS5922398A publication Critical patent/JPS5922398A/ja
Publication of JPH041519B2 publication Critical patent/JPH041519B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP13266382A 1982-07-28 1982-07-28 多層セラミツク基板 Granted JPS5922398A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13266382A JPS5922398A (ja) 1982-07-28 1982-07-28 多層セラミツク基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13266382A JPS5922398A (ja) 1982-07-28 1982-07-28 多層セラミツク基板

Publications (2)

Publication Number Publication Date
JPS5922398A JPS5922398A (ja) 1984-02-04
JPH041519B2 true JPH041519B2 (fr) 1992-01-13

Family

ID=15086581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13266382A Granted JPS5922398A (ja) 1982-07-28 1982-07-28 多層セラミツク基板

Country Status (1)

Country Link
JP (1) JPS5922398A (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6223198A (ja) * 1985-07-23 1987-01-31 ダイソー株式会社 多層配線板の製法
JPS6317590A (ja) * 1986-07-10 1988-01-25 旭硝子株式会社 複合セラミツクス基板
US4756956A (en) * 1987-10-02 1988-07-12 National House Industrial Co., Ltd. Foamed ceramic panel and method of producing the same
JPH0277194A (ja) * 1988-09-13 1990-03-16 Nec Corp 低誘電率多層セラミック配線基板
JPH02123793A (ja) * 1988-11-02 1990-05-11 Murata Mfg Co Ltd セラミック多層基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5367879A (en) * 1976-11-30 1978-06-16 Fujitsu Ltd Method of producing ceramic circuit board
JPS53135459A (en) * 1977-04-30 1978-11-27 Fujitsu Ltd Multilayer ceramic board

Also Published As

Publication number Publication date
JPS5922398A (ja) 1984-02-04

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