JPH0415537U - - Google Patents

Info

Publication number
JPH0415537U
JPH0415537U JP5755790U JP5755790U JPH0415537U JP H0415537 U JPH0415537 U JP H0415537U JP 5755790 U JP5755790 U JP 5755790U JP 5755790 U JP5755790 U JP 5755790U JP H0415537 U JPH0415537 U JP H0415537U
Authority
JP
Japan
Prior art keywords
opening
heat pipe
substrate
closing member
margin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5755790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5755790U priority Critical patent/JPH0415537U/ja
Publication of JPH0415537U publication Critical patent/JPH0415537U/ja
Pending legal-status Critical Current

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  • Accessory Devices And Overall Control Thereof (AREA)
  • Electronic Switches (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の一実施例を示すもので、第1図
は平面図、第2図は基板の一端を拡大した断面図
、第3図は支持部材の平面図である。 1……基板、2……発熱素子、3……開口部、
4……ヒートパイプ、7〜10……閉止部材、1
1……伝熱用液体。
The drawings show an embodiment of the present invention; FIG. 1 is a plan view, FIG. 2 is an enlarged sectional view of one end of the substrate, and FIG. 3 is a plan view of a support member. 1... Substrate, 2... Heat generating element, 3... Opening,
4... Heat pipe, 7-10... Closing member, 1
1...Heat transfer liquid.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多数の発熱素子が配列された基板と、前記発熱
素子の近傍に沿わせて前記基板に形成された開口
部と、この開口部に余裕をもつて挿通されたヒー
トパイプと、このヒートパイプの外周面と前記開
口部の内壁との間に満たされた伝熱用液体と、前
記開口部を密閉する閉止部材とよりなることを特
徴とするサーマルヘツドの冷却装置。
A substrate on which a large number of heating elements are arranged, an opening formed in the substrate along the vicinity of the heating element, a heat pipe inserted into the opening with a margin, and an outer periphery of the heat pipe. 1. A cooling device for a thermal head, comprising a heat transfer liquid filled between a surface and an inner wall of the opening, and a closing member for sealing the opening.
JP5755790U 1990-05-31 1990-05-31 Pending JPH0415537U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5755790U JPH0415537U (en) 1990-05-31 1990-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5755790U JPH0415537U (en) 1990-05-31 1990-05-31

Publications (1)

Publication Number Publication Date
JPH0415537U true JPH0415537U (en) 1992-02-07

Family

ID=31582376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5755790U Pending JPH0415537U (en) 1990-05-31 1990-05-31

Country Status (1)

Country Link
JP (1) JPH0415537U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009149056A (en) * 2007-11-30 2009-07-09 Canon Inc Inkjet recording head and inkjet recording apparatus
US8517499B2 (en) 2007-11-30 2013-08-27 Canon Kabushiki Kaisha Inkjet printing head and inkjet printing apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009149056A (en) * 2007-11-30 2009-07-09 Canon Inc Inkjet recording head and inkjet recording apparatus
US8517499B2 (en) 2007-11-30 2013-08-27 Canon Kabushiki Kaisha Inkjet printing head and inkjet printing apparatus

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