JPH04158596A - Electronic parts mounting method and electronic parts mounting board - Google Patents
Electronic parts mounting method and electronic parts mounting boardInfo
- Publication number
- JPH04158596A JPH04158596A JP28376490A JP28376490A JPH04158596A JP H04158596 A JPH04158596 A JP H04158596A JP 28376490 A JP28376490 A JP 28376490A JP 28376490 A JP28376490 A JP 28376490A JP H04158596 A JPH04158596 A JP H04158596A
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- electronic component
- wiring board
- electronic parts
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 9
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、電子部品の配線基板への実装に関するもので
あり、特に電子部品と配線基板とを一体化する電子部品
実装方法及び電子部品実装基板に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to mounting electronic components onto a wiring board, and particularly relates to an electronic component mounting method and electronic component mounting for integrating electronic components and a wiring board. It is related to the board.
［従来の技術］
従来の電子部品実装用の配線基板は、樹脂基板の表裏に
設けられた銅箔をエツチングして配線パターンを形成し
たものである。該配線基板に電子部品を実装する場合は
、前記形成したパターンに半田印刷をし、更に、該配線
基板に電子部品を搭載し、リフロー炉を通して、半田を
溶融させ、電子部品と配線パターンの半田付けを行って
いた。[Prior Art] A conventional wiring board for mounting electronic components has a wiring pattern formed by etching copper foil provided on the front and back sides of a resin board. When mounting electronic components on the wiring board, the formed pattern is printed with solder, the electronic components are mounted on the wiring board, and the solder is melted in a reflow oven to solder the electronic components and the wiring pattern. I was attaching it.
［発明が解決しようとする課題］
然し乍ら、上記した従来の電子部品実装方法、及び電子
部品実装基板では、電子部品実装の為の配線基板が必要
であり、部品点数が増えると配線基板が大型化すると共
に、該配線基板の板厚分だけは厚くなり、電子部品実装
基板の軽薄短小化が難しいという問題があり、又電子部
品を実装するのに、半田を使用するので、配線基板の半
田印刷工程、電子部品搭載後のりフロー類を通しての、
電子部品と配線パターンの半田付は工程が必要であり、
工程数か多く生産性か悪いという問題かあった。[Problems to be Solved by the Invention] However, the conventional electronic component mounting method and electronic component mounting board described above require a wiring board for mounting electronic components, and as the number of components increases, the wiring board becomes larger. At the same time, the board thickness of the wiring board increases, making it difficult to make electronic component mounting boards lighter, thinner, and smaller.Also, since solder is used to mount electronic components, solder printing on the wiring board is difficult. Through the process and the glue flow after mounting electronic components,
Soldering electronic components and wiring patterns requires a process,
There were problems with poor productivity due to the large number of processes.
本発明は、斯かる実情に鑑み、電子部品実装基板の軽薄
短小化を図り、而も半田を用いること無く生産性の向上
を図ろうとするものである。In view of these circumstances, the present invention aims to make electronic component mounting boards lighter, thinner, shorter and smaller, and to improve productivity without using solder.
［課題を解決する為の手Ｈ１
本発明は、所要の電子部品をその電極が露出する様に樹
脂によって埋設し、該樹脂の電極露出面に導体をメッキ
し、該導体層をエツチング処理して前記電子部品を所要
の状態に接続する配線パターンを成形する電子部品実装
方法及び該電子部品実装方法によって、実装された電子
部品実装基板に係るものである。[Measures to Solve the Problem H1] The present invention involves embedding required electronic components in a resin so that their electrodes are exposed, plating a conductor on the exposed electrode surface of the resin, and etching the conductor layer. The present invention relates to an electronic component mounting method for forming a wiring pattern that connects the electronic components in a desired state, and an electronic component mounting board mounted by the electronic component mounting method.
［作 用コ
電子部品は、配線基板本体に埋設された状態で基板に搭
載され、電子部品間の配線接続は配線基板本体の表面に
メッキされた導体によって、半田等の接合材料を介在さ
せること無く直接接続される。[Function] The electronic components are mounted on the board while being embedded in the wiring board body, and the wiring connections between the electronic components are made using conductors plated on the surface of the wiring board body, with a bonding material such as solder interposed. directly connected.
［実 施 例］ 以下、図面を参照しつつ本発明の一実施例を説明する。[Example] An embodiment of the present invention will be described below with reference to the drawings.
第１図は、本実施例に係る電子部品実装基板の概念図を
示すものであり、図中、１は配線基板、２ａ、２ｂ、２
ｃ、・・・は該配線基板に埋設された電子部品、３は前
記配線基板の表面に形成した配線パターン（第２図（Ｅ
）参照）である。FIG. 1 shows a conceptual diagram of an electronic component mounting board according to this embodiment, and in the figure, 1 is a wiring board, 2a, 2b, 2
c, . . . are electronic components embedded in the wiring board, 3 is a wiring pattern formed on the surface of the wiring board (Fig. 2 (E)
).
前記埋設された電子部品２ａ、２ｂ、２ｃ、・・・は、
前記配線パターン３によって、所要の状態に電気的に接
続されている。而して、本実施例に係る電子部品実装基
板では配線基板１の厚みが、即ち電子部品実装基板の厚
みである。The buried electronic components 2a, 2b, 2c,...
The wiring pattern 3 electrically connects in a desired state. Thus, in the electronic component mounting board according to this embodiment, the thickness of the wiring board 1 is the thickness of the electronic component mounting board.
次に、第２図に於いて、本実施例に於ける電子部品の実
装について説明する。Next, referring to FIG. 2, mounting of electronic components in this embodiment will be explained.
製作すべき電子部品実装基板と同じ外形形状を有し、且
平滑面に仕上げられた定盤４の上に、電極面を下にして
、電子部品２ａ、２ｂ、２ｃ、・・・を所定の位置に配
置する（第２図（Ａ））。Electronic components 2a, 2b, 2c, . (FIG. 2(A)).
矩形の枠体５を前記定盤４に嵌込み、該枠体５の内部に
基板材料の液状樹脂６を流込み固化させる（第２図（Ｂ
））。A rectangular frame 5 is fitted into the surface plate 4, and liquid resin 6, which is a substrate material, is poured into the frame 5 and solidified (see Fig. 2 (B).
)).
樹脂６が固化した後、前記枠体５、前記定盤４を除去す
る。樹脂６の固化によって、樹脂６は配線基板本体６゛
となり、前記電子部品２ａ、２ｂ。After the resin 6 is solidified, the frame 5 and the surface plate 4 are removed. By solidifying the resin 6, the resin 6 becomes a wiring board main body 6'', and the electronic components 2a, 2b.
２ｃ、・・・は、この配線基板本体６゛に埋設された状
態になる。2c, . . . are buried in this wiring board main body 6'.
第２図（Ｃ）は、前記配線基板本体６′を裏返し、該配
線基板本体６゛の前記定盤４の当接面を示しているが、
この当接面には前記電子部品２ａ、２ｂ、２Ｃ，・・・
の電極がそれぞれ露出している。FIG. 2(C) shows the contact surface of the wiring board main body 6′ with the surface plate 4 when the wiring board main body 6′ is turned over.
On this contact surface, the electronic components 2a, 2b, 2C, . . .
Each electrode is exposed.
次に、前記当接面全面に導体、例えば銅をメッキする（
第２図（Ｄ））。Next, the entire contact surface is plated with a conductor, such as copper (
Figure 2 (D)).
この導体のメッキによって、前記電子部品２ａ、２ｂ、
２ｃ、・・・の電極はこの導体層７に導通する。By plating this conductor, the electronic components 2a, 2b,
The electrodes 2c, . . . are electrically connected to the conductor layer 7.
その後、該導体層７を通常の手段によりエツチングして
配線パターン３を成形する（第２図（Ｅ））。Thereafter, the conductor layer 7 is etched by conventional means to form the wiring pattern 3 (FIG. 2(E)).
この配線パターン３の成形により、前記電子部品２ａ、
２ｂ、２ｃ、・・・間の電気的配線が完了し、電子部品
実装基板が完成する。By forming this wiring pattern 3, the electronic component 2a,
The electrical wiring between 2b, 2c, . . . is completed, and the electronic component mounting board is completed.
［発明の効果］
以上述べた如く、本発明によれば電子部品が配線基板自
体に埋設された構造となるので、電子部品実装基板の厚
みが著しく減少し、又その製造工程に、半田を使用しな
いので工程数が減少し、生産性が向上するという優れた
効果を発揮する。[Effects of the Invention] As described above, according to the present invention, the electronic components are embedded in the wiring board itself, so the thickness of the electronic component mounting board is significantly reduced, and solder is not used in the manufacturing process. This has the excellent effect of reducing the number of steps and improving productivity.
第１図は本発明の１実施例に係る電子部品実装基板の概
念図、第２図（Ａ）（Ｂ）（Ｃ）（Ｄ）（Ｅ）は本実施
例に係る電子部品の実装手順を示す説明図である。
１は配線基板、２ａ、２ｂ、２ｃ、・・・は電子部品、
３は配線パターン、４は定盤、５は枠体、６は樹脂、６
゛は配線基板本体、７は導体層を示す。FIG. 1 is a conceptual diagram of an electronic component mounting board according to an embodiment of the present invention, and FIGS. FIG. 1 is a wiring board, 2a, 2b, 2c, ... are electronic components,
3 is a wiring pattern, 4 is a surface plate, 5 is a frame body, 6 is a resin, 6
゛ represents the wiring board body, and 7 represents the conductor layer.
Claims (1)
って埋設し、該樹脂の電極露出面に導体をメッキし、該
導体層をエッチング処理して前記電子部品を所要の状態
に接続する配線パターンを成形することを特徴とする電
子部品実装方法。 ２）所要の電子部品を配線基板本体に電極が露出する様
に埋設し、前記電子部品を配線基板本体の電極露出面に
成形した配線パターンによって接続したことを特徴とす
る電子部品実装基板。[Claims] 1) A required electronic component is buried in a resin so that its electrodes are exposed, a conductor is plated on the exposed electrode surface of the resin, and the conductive layer is etched to remove the required electronic component. An electronic component mounting method characterized by forming a wiring pattern that connects to the state. 2) An electronic component mounting board, characterized in that required electronic components are embedded in a wiring board main body so that electrodes are exposed, and the electronic components are connected by a wiring pattern formed on the electrode exposed surface of the wiring board main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2283764A JPH0697710B2 (en) | 1990-10-22 | 1990-10-22 | Electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2283764A JPH0697710B2 (en) | 1990-10-22 | 1990-10-22 | Electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04158596A true JPH04158596A (en) | 1992-06-01 |
| JPH0697710B2 JPH0697710B2 (en) | 1994-11-30 |
Family
ID=17669819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2283764A Expired - Fee Related JPH0697710B2 (en) | 1990-10-22 | 1990-10-22 | Electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0697710B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7671696B1 (en) | 2006-09-21 | 2010-03-02 | Raytheon Company | Radio frequency interconnect circuits and techniques |
| US8810448B1 (en) | 2010-11-18 | 2014-08-19 | Raytheon Company | Modular architecture for scalable phased array radars |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54158669A (en) * | 1978-06-05 | 1979-12-14 | Matsushita Electric Industrial Co Ltd | Printed circuit board |
| JPS5542338U (en) * | 1978-09-11 | 1980-03-18 | ||
| JPS5718349A (en) * | 1980-07-09 | 1982-01-30 | Matsushita Electric Ind Co Ltd | Manufacture of electronic circuit device |
| JPS57118690A (en) * | 1981-01-14 | 1982-07-23 | Fujitsu Ltd | Method of producing electronic circuit |
| JPS6186970U (en) * | 1984-11-13 | 1986-06-07 | ||
| JPS6320469U (en) * | 1986-07-25 | 1988-02-10 | ||
| JPH0183365U (en) * | 1987-11-26 | 1989-06-02 |
-
1990
- 1990-10-22 JP JP2283764A patent/JPH0697710B2/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54158669A (en) * | 1978-06-05 | 1979-12-14 | Matsushita Electric Industrial Co Ltd | Printed circuit board |
| JPS5542338U (en) * | 1978-09-11 | 1980-03-18 | ||
| JPS5718349A (en) * | 1980-07-09 | 1982-01-30 | Matsushita Electric Ind Co Ltd | Manufacture of electronic circuit device |
| JPS57118690A (en) * | 1981-01-14 | 1982-07-23 | Fujitsu Ltd | Method of producing electronic circuit |
| JPS6186970U (en) * | 1984-11-13 | 1986-06-07 | ||
| JPS6320469U (en) * | 1986-07-25 | 1988-02-10 | ||
| JPH0183365U (en) * | 1987-11-26 | 1989-06-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0697710B2 (en) | 1994-11-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |