JPH0415864U - - Google Patents
Info
- Publication number
- JPH0415864U JPH0415864U JP5783390U JP5783390U JPH0415864U JP H0415864 U JPH0415864 U JP H0415864U JP 5783390 U JP5783390 U JP 5783390U JP 5783390 U JP5783390 U JP 5783390U JP H0415864 U JPH0415864 U JP H0415864U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- perforation
- shape
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は、この考案に用いたミシン目形状の部
分図であり、第２図は従来のミシン目形状図、第
３図はスルーホール基板の全体図である。
１……本体基板、２……捨て基板、３……連結
部、４……ミシン目穴、６……捨て基板上の導電
パターン、７……スリツト、８……ミシン目の結
なぎ部。
FIG. 1 is a partial diagram of the perforation shape used in this invention, FIG. 2 is a diagram of the conventional perforation shape, and FIG. 3 is an overall diagram of the through-hole board. DESCRIPTION OF SYMBOLS 1...Main board, 2...Disposable board, 3...Connection part, 4...Perforation hole, 6...Conductive pattern on the discarded board, 7...Slit, 8...Connection part of perforation.
Claims (1)
のプリント基板を分割するミシン目形状において
、捨て基板側に導電パターンを設け、ミシン目穴
の壁面の金属と一体に接続したことを特徴とする
プリント基板のミシン目形状。 A printed circuit board sewing machine characterized in that, in a perforation shape that divides a type of printed circuit board in which double-sided patterns are connected by through holes, a conductive pattern is provided on the side of the discarded circuit board and is integrally connected to the metal on the wall of the perforation hole. eye shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5783390U JPH0415864U (en) | 1990-05-30 | 1990-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5783390U JPH0415864U (en) | 1990-05-30 | 1990-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415864U true JPH0415864U (en) | 1992-02-07 |
Family
ID=31582901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5783390U Pending JPH0415864U (en) | 1990-05-30 | 1990-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415864U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7202017B2 (en) | 2003-08-25 | 2007-04-10 | Sharp Kabushiki Kaisha | Substrate, method of manufacturing multi-layer substrate, and satellite broadcasting reception apparatus |
-
1990
- 1990-05-30 JP JP5783390U patent/JPH0415864U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7202017B2 (en) | 2003-08-25 | 2007-04-10 | Sharp Kabushiki Kaisha | Substrate, method of manufacturing multi-layer substrate, and satellite broadcasting reception apparatus |