JPH0415896U - - Google Patents
Info
- Publication number
- JPH0415896U JPH0415896U JP5781690U JP5781690U JPH0415896U JP H0415896 U JPH0415896 U JP H0415896U JP 5781690 U JP5781690 U JP 5781690U JP 5781690 U JP5781690 U JP 5781690U JP H0415896 U JPH0415896 U JP H0415896U
- Authority
- JP
- Japan
- Prior art keywords
- ground
- circuit board
- piece
- case body
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例であるシールドケー
スのアース片近傍を拡大して示す図、第２図及び
第３図は本考案になるシールドケースを適用して
なる電子装置を示す図、第４図及び第５図は従来
のシールドケースにおけるアース片近傍を拡大し
て示す図である。
１１……シールドケース、１３……ケース本体
、１４，１５……カバー、１６……回路基板、１
７……シールド板部、１９……アースバネ、２０
……アース片、２１……半田付け部、２２……接
続部、２３……連結部、２４……曲げ部、２５…
…孔、２６……幅狭部、２７……幅広部、２８…
…アースパターン、２９……半田。
FIG. 1 is an enlarged view showing the vicinity of the ground piece of a shield case according to an embodiment of the present invention, FIGS. 2 and 3 are views showing an electronic device to which the shield case according to the present invention is applied, FIGS. 4 and 5 are enlarged views showing the vicinity of the ground piece in a conventional shield case. 11... Shield case, 13... Case body, 14, 15... Cover, 16... Circuit board, 1
7... Shield plate part, 19... Earth spring, 20
...Earth piece, 21...Soldering part, 22...Connecting part, 23...Connecting part, 24...Bending part, 25...
...hole, 26...narrow part, 27...wide part, 28...
...Earth pattern, 29...Solder.
Claims (1)
回路基板に形成された孔を貫通してアース片が立
設し、該ケース本体に取り付けられるカバーに形
成されたアースバネが該アース片に圧接すること
により、該ケース本体と該カバーとを接続すると
共に、該アース片を該回路基板に形成されたアー
スパターンに半田付けする構成とされたシールド
ケースにおいて、 該アース片を、その面方向からみて略Ｚ形状を
なす半田付け部と接続部とにより構成し、 かつ該接続部の上端部に該アースバネが圧接す
る曲げ部を形成してなるシールドケース。[Scope of Claim for Utility Model Registration] A circuit board is disposed within the case body, a grounding piece is erected through a hole formed in the circuit board, and is formed on a cover that is attached to the case body. A shield case configured such that a ground spring is pressed against the ground piece to connect the case body and the cover, and the ground piece is soldered to a ground pattern formed on the circuit board. A shield case in which a grounding piece is constituted by a soldering part and a connecting part that are approximately Z-shaped when viewed from the surface thereof, and a bent part is formed at the upper end of the connecting part to which the earthing spring is pressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5781690U JPH0415896U (en) | 1990-05-31 | 1990-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5781690U JPH0415896U (en) | 1990-05-31 | 1990-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415896U true JPH0415896U (en) | 1992-02-07 |
Family
ID=31582868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5781690U Pending JPH0415896U (en) | 1990-05-31 | 1990-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415896U (en) |
-
1990
- 1990-05-31 JP JP5781690U patent/JPH0415896U/ja active Pending
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