JPH0416396A - Semiconductor device card - Google Patents

Semiconductor device card

Info

Publication number
JPH0416396A
JPH0416396A JP2121550A JP12155090A JPH0416396A JP H0416396 A JPH0416396 A JP H0416396A JP 2121550 A JP2121550 A JP 2121550A JP 12155090 A JP12155090 A JP 12155090A JP H0416396 A JPH0416396 A JP H0416396A
Authority
JP
Japan
Prior art keywords
card
cart
small
semiconductor device
rom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2121550A
Other languages
Japanese (ja)
Inventor
Yasuhiro Murasawa
村沢 靖博
Shunichi Kamimura
上村 俊一
Taiji Kasatani
泰司 笠谷
Makoto Omori
誠 大森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2121550A priority Critical patent/JPH0416396A/en
Publication of JPH0416396A publication Critical patent/JPH0416396A/en
Pending legal-status Critical Current

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  • Credit Cards Or The Like (AREA)

Abstract

PURPOSE:To enable two kinds of functions to be used on a same card by a method wherein a large sized card having an opening part and a small sized card capable of being inserted into its opening part, are established. CONSTITUTION:A card inserting part 4 is provided to a frame 2 of a card body 1, and a small card 5 is made capable of being inserted into the card inserting part 4. In the case where the small sized card 5 is inserted, an electrode contact part like to correspond to an outside connector is provided inside the card inserting part 4 of the large sized card 1, and the small sized card 5 is electrically connected to the large sized card 1. Thus, one sheet of a card can be used for various uses and further, for instance, for a jointly used card for RAM and ROM, since the ROM side can be especially exchanged, the use of the ROM card is widened.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はゲームカード及び産業用カードなとに用いら
れる半導体装置カードに関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device card used for game cards, industrial cards, and the like.

〔従来の技術〕[Conventional technology]

テレビゲーム用ソフトを内蔵したゲームカードや産業用
メモリカード等に用いられる従来のICカード(以下カ
ードと呼ぶ)は第2図に示す様に構成されていた。図に
於いて、(7)はカード基体となるフレーム、(6)は
フレーム(7)の表裏に接着剤等で装着され内部の半導
体素子を保護するパネル、(8)はシャッターである。
A conventional IC card (hereinafter referred to as a card) used for a game card with built-in video game software, an industrial memory card, etc. has a structure as shown in FIG. In the figure, (7) is a frame serving as a card base, (6) is a panel attached to the front and back of the frame (7) with adhesive or the like to protect the internal semiconductor elements, and (8) is a shutter.

ここでは、シャッター付きのカートエツジタイプのカー
トについて説明する。ツヤツタ−(8)の内部には、外
部電極か設けられており、例えば図の様にシャッター(
8)を開口した場合、外部電極(図示せず)か表面に露
出する構造となっている。
Here, a cart edge type cart with a shutter will be explained. An external electrode is provided inside the glosser (8), for example, as shown in the figure, the shutter (
8), the external electrode (not shown) is exposed to the surface.

次に動作について説明する。このカートをカートリーダ
側のコネクタ(図示せず)に挿入した場合、常時は閉し
られているシャッター(8)か開き、シャッター(8)
内部に設けられた外部電極か露出する。この外部電極か
コネクタの各電極接触部(図示せず)に接触する事によ
り、情報のやり取りを行っている。
Next, the operation will be explained. When this cart is inserted into the connector (not shown) on the cart reader side, the shutter (8) is normally closed or the shutter (8) is opened.
External electrodes installed inside are exposed. Information is exchanged by contacting this external electrode or each electrode contact portion (not shown) of the connector.

〔発明か解決しようとする課題〕[Invention or problem to be solved]

従来のカードは以上のように構成されていたので、たと
えば、他の機能を有するカードを並用して使用する場合
、2種類のカートか必要であり、又、ROMのような不
揮発性の半導体素子を有するカートの場合、その機能た
けしか適用できないという問題点かあった。
Conventional cards were configured as described above, so for example, if cards with other functions were to be used together, two types of carts were required, and non-volatile semiconductor elements such as ROM were required. In the case of a cart that has a function, there is a problem that only the functions can be applied.

この発明は、上記のような問題点を解消するためになさ
れたもので、用途の異なる2種類の機能を同一カード上
て使用できる半導体装置カートを得ることを目的とする
The present invention was made to solve the above-mentioned problems, and an object of the present invention is to obtain a semiconductor device cart that can use two types of functions for different purposes on the same card.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係る半導体装置カートは、ある機能を有する
カードに別の機能を持ったカードを挿入可能にしたもの
である。
The semiconductor device cart according to the present invention allows a card having one function to be inserted into a card having another function.

〔作 用〕[For production]

この発明における半導体装置カードは、2種類のカート
で構成され、大型のカートの一部に開口部か設けられ、
その開口部に他の小型カートを挿入することかできる。
The semiconductor device card according to the present invention is composed of two types of carts, and an opening is provided in a part of the large cart.
Other small carts can be inserted into the opening.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第1図において、(1)はカート本体、(2)はフレー
ム、(3)は保護用のパネルであり、(4)はフレーム
(2)に設けられたカート挿入部、(5)はカート挿入
部に挿入される小型カートである。
In Figure 1, (1) is the cart body, (2) is the frame, (3) is the protective panel, (4) is the cart insertion part provided in the frame (2), and (5) is the cart. It is a small cart that is inserted into the insertion section.

次に動作について説明する。Next, the operation will be explained.

小型カード(5)は大型カート(1)のカート挿入部(
4)に挿入されて使用される。たたし、小型カード(5
)を挿入しなくても動作可能である。また、大型カード
(1)と小型カード(5)の動作方法については前記従
来のものとなんらかわらない。
The small card (5) is inserted into the cart insertion section (
4) is inserted and used. Tatami, small card (5
) can be operated without inserting. Furthermore, the operating methods of the large card (1) and small card (5) are no different from the conventional ones.

ただし、大型カード(1)のカード挿入部(4)の内部
には、小型カート(5)か挿入された場合に、たとえば
、外部のコネクタ(図示せず)に相当するような電極接
触部か設けられており、小型カード(5)と大型カート
(1)か電気的に接続するような構造になっている。
However, when a small cart (5) is inserted inside the card insertion part (4) of the large card (1), there is no electrode contact part that corresponds to an external connector (not shown). The structure is such that the small card (5) and the large cart (1) are electrically connected.

なお、上記実施例では外部のコネクタとの電極接触部と
電気的に接続するための構造は、カートエツジタイプの
場合を示したか、別設カードエツジタイプに限定される
ものではない。
In the above embodiments, the structure for electrically connecting the electrode contact portion with an external connector is a cart edge type, but is not limited to a separate card edge type.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によれば大型のカートに小型カ
ートを挿入可能としたので、1枚のカードか様々な用途
に用いることかてき、また、例えば、RAM、ROMの
併用カートであり、特に、ROM側か取りかえられるた
め、様々な用途か考えられる。さらに、ROMカートの
用途か広くなるという効果かある。
As described above, according to the present invention, since a small cart can be inserted into a large cart, a single card can be used for various purposes. In particular, since the ROM side can be replaced, various uses can be considered. Furthermore, it has the effect of broadening the uses of ROM carts.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例である半導体装置カートを
示す展開斜視図、第2図は従来の半導体装置カートを示
す斜視図である。図において、(1)はカート本体。(
2)はフレーム、(3)はパネル、(4)はカート挿入
部、(5)は小型カートである。 なお、図中、同一符号は同一、又は相当部分を示す。 2 フし−ム J ハIネル 第2図
FIG. 1 is an exploded perspective view of a semiconductor device cart according to an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional semiconductor device cart. In the figure, (1) is the cart body. (
2) is a frame, (3) is a panel, (4) is a cart insertion part, and (5) is a small cart. In addition, in the figures, the same reference numerals indicate the same or equivalent parts. 2 Fushima J Heinel Diagram 2

Claims (1)

【特許請求の範囲】[Claims]  内部に半導体素子を有し、この半導体素子を保護する
ために、たとえば、金属パネル等か表裏に設けられた半
導体装置カードにおいて、開口部を有する大型のカード
と、その開口部に挿入可能な小型カードを備えたことを
特徴とする半導体装置カード。
In a semiconductor device card that has a semiconductor element inside and is provided with a metal panel or the like on the front and back to protect the semiconductor element, there is a large card with an opening and a small card that can be inserted into the opening. A semiconductor device card characterized by comprising a card.
JP2121550A 1990-05-10 1990-05-10 Semiconductor device card Pending JPH0416396A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2121550A JPH0416396A (en) 1990-05-10 1990-05-10 Semiconductor device card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2121550A JPH0416396A (en) 1990-05-10 1990-05-10 Semiconductor device card

Publications (1)

Publication Number Publication Date
JPH0416396A true JPH0416396A (en) 1992-01-21

Family

ID=14814024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2121550A Pending JPH0416396A (en) 1990-05-10 1990-05-10 Semiconductor device card

Country Status (1)

Country Link
JP (1) JPH0416396A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5822190A (en) * 1996-06-11 1998-10-13 Kabushiki Kaisha Toshiba Card type memory device and a method for manufacturing the same
US5892213A (en) * 1995-09-21 1999-04-06 Yamaichi Electronics Co., Ltd. Memory card
US5956601A (en) * 1996-04-25 1999-09-21 Kabushiki Kaisha Toshiba Method of mounting a plurality of semiconductor devices in corresponding supporters
US5992754A (en) * 1996-04-02 1999-11-30 Yamaichi Electronics Co., Ltd. IC protective device in memory card operating electronic apparatus
US6002605A (en) * 1997-02-28 1999-12-14 Kabushiki Kaisha Toshiba Connecting apparatus, and information processing apparatus
US6022763A (en) * 1996-05-10 2000-02-08 Kabushiki Kaisha Toshiba Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof
US6031724A (en) * 1994-11-29 2000-02-29 Kabushiki Kaisha Toshiba IC card and method of manufacturing the same
US6054774A (en) * 1994-03-22 2000-04-25 Kabushiki Kaisha Toshiba Thin type semiconductor package
US6091137A (en) * 1996-05-31 2000-07-18 Kabushiki Kaisha Toshiba Semiconductor device substrate and method of manufacturing the same
US6094697A (en) * 1995-02-03 2000-07-25 Kabuhiki Kaisha Toshiba Information processing system including processing device for detecting non-conductivity of state-indicating non-conductive member and discriminating prohibit state of writing information to information writable storage medium
US6141210A (en) * 1993-07-23 2000-10-31 Kabushiki Kaisha Toshiba External storage device
US6166431A (en) * 1995-08-25 2000-12-26 Kabushiki Kaisha Tishiba Semiconductor device with a thickness of 1 MM or less
US6201295B1 (en) 1993-04-28 2001-03-13 Kabushiki Kaisha Toshiba Plate-shaped external storage device and method of producing the same
US6471130B2 (en) 1995-02-03 2002-10-29 Kabushiki Kaisha Toshiba Information storage apparatus and information processing apparatus using the same
USRE38997E1 (en) * 1995-02-03 2006-02-28 Kabushiki Kaisha Toshiba Information storage and information processing system utilizing state-designating member provided on supporting card surface which produces write-permitting or write-inhibiting signal

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6201295B1 (en) 1993-04-28 2001-03-13 Kabushiki Kaisha Toshiba Plate-shaped external storage device and method of producing the same
US6274926B1 (en) 1993-04-28 2001-08-14 Kabushiki Kaisha Toshiba Plate-shaped external storage device and method of producing the same
US6141210A (en) * 1993-07-23 2000-10-31 Kabushiki Kaisha Toshiba External storage device
US6147860A (en) * 1993-07-23 2000-11-14 Kabushiki Kaisha Toshiba External storage device
US6147861A (en) * 1993-07-23 2000-11-14 Kabushiki Kaisha Toshiba External storage device unit
US6054774A (en) * 1994-03-22 2000-04-25 Kabushiki Kaisha Toshiba Thin type semiconductor package
US6031724A (en) * 1994-11-29 2000-02-29 Kabushiki Kaisha Toshiba IC card and method of manufacturing the same
US6471130B2 (en) 1995-02-03 2002-10-29 Kabushiki Kaisha Toshiba Information storage apparatus and information processing apparatus using the same
USRE38997E1 (en) * 1995-02-03 2006-02-28 Kabushiki Kaisha Toshiba Information storage and information processing system utilizing state-designating member provided on supporting card surface which produces write-permitting or write-inhibiting signal
US6145023A (en) * 1995-02-03 2000-11-07 Kabushiki Kaisha Toshiba Information storage and information processing system utilizing state-designating member provided on supporting card surface which produces write-permitting or write-inhibiting signal
US6338104B1 (en) 1995-02-03 2002-01-08 Kabushiki Kaisha Toshiba System including single connector pin supporter having two separate plurality of connector pins with one set of pins contacting state designating portion of memory card indicating write prohibit state
US6094697A (en) * 1995-02-03 2000-07-25 Kabuhiki Kaisha Toshiba Information processing system including processing device for detecting non-conductivity of state-indicating non-conductive member and discriminating prohibit state of writing information to information writable storage medium
US6292850B1 (en) 1995-02-03 2001-09-18 Kabushiki Kaisha Toshiba Information storage system including state-designating area on memory card and detecting presence or absence of state-designating member on state-designating area to inhibit or allow writing of information
US7104459B2 (en) 1995-02-03 2006-09-12 Kabushiki Kaisha Toshiba Information storage apparatus and information processing apparatus using the same
US6166431A (en) * 1995-08-25 2000-12-26 Kabushiki Kaisha Tishiba Semiconductor device with a thickness of 1 MM or less
US6333212B1 (en) 1995-08-25 2001-12-25 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
US5892213A (en) * 1995-09-21 1999-04-06 Yamaichi Electronics Co., Ltd. Memory card
US5992754A (en) * 1996-04-02 1999-11-30 Yamaichi Electronics Co., Ltd. IC protective device in memory card operating electronic apparatus
US5956601A (en) * 1996-04-25 1999-09-21 Kabushiki Kaisha Toshiba Method of mounting a plurality of semiconductor devices in corresponding supporters
US6022763A (en) * 1996-05-10 2000-02-08 Kabushiki Kaisha Toshiba Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof
US6091137A (en) * 1996-05-31 2000-07-18 Kabushiki Kaisha Toshiba Semiconductor device substrate and method of manufacturing the same
US5822190A (en) * 1996-06-11 1998-10-13 Kabushiki Kaisha Toshiba Card type memory device and a method for manufacturing the same
US6085412A (en) * 1996-06-11 2000-07-11 Kabushiki Kaisha Toshiba Method for manufacturing card type memory device
US6137710A (en) * 1997-02-28 2000-10-24 Kabushiki Kaisha Toshiba Connecting apparatus, and information processing apparatus
US6002605A (en) * 1997-02-28 1999-12-14 Kabushiki Kaisha Toshiba Connecting apparatus, and information processing apparatus

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