JPH0416456Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a substrate for an LED lamp using a semiconductor light emitting element such as a light emitting diode, which is used in place of an incandescent lamp.

[Prior Art] An LED lamp is sometimes used in place of a tungsten light bulb, and the external shape of the LED lamp is shown in FIG. In FIG. 6, in order to be housed and installed in the cylindrical lamp housing 12, the board 2 used must also have a round shape or a shape close to this. Work such as separating the substrates into two small pieces, placing thick film wiring 8 on them, and mounting LED chips 9 on them was performed by arranging each substrate 2 one by one on a work holder.

[Problems to be Solved by the Invention] Regarding the processing order of the alumina substrate, the thick film wiring 8 and other connection work cannot be performed unless the shape of the substrate 2 is formed by press working. Since conventional substrates are round, they are separated into individual pieces and then thick film wiring is applied.In this case, the substrate 2
Since there is a lead wire insertion hole 6 in the lead wire insertion hole 6, the direction cannot be determined using an automatic aligner or the like, and arranging the wires on the work holder has to be done manually.

Alternatively, as shown in FIG. 3, it is possible to insert scribe lines 3 for dividing the alumina substrate 2 instead of separating them individually and separate them after the thick film wiring 8, etc. If only the scribe line 3 is used, there is a problem that when potting the transparent resin 7 for a lens effect, the resin flows beyond the scribe line 3.

[Means for solving the problem] Thick film wiring 8 is applied to the insulating substrate and LED
In an LED lamp 11 to which a chip 9 is connected and resin potting is performed on the LED lamp 11, a sheet-like substrate 1 divided into a plurality of substrates 2 has notches 5 for making the corners of each substrate 2 closer to a circular shape. , and a dividing scribe line 3 and a flow prevention groove 4 for transparent resin 7 are formed at the connecting portion between each substrate 2.

[Embodiment] FIGS. 1 and 2 show a first embodiment of a substrate according to the present invention. In these figures, 1 is a sheet-like board, and this sheet-like board 1 has a plurality of boards 2, 2... between them so that they can be divided after wiring etc. As shown, scribe lines 3 and flow prevention grooves 4 are formed, as well as cutouts 5 at the corners for making each substrate 2 close to a circular shape. More specifically, this flow prevention groove 4 allows the transparent resin 7 to flow from each substrate 2 to the other during resin potting with the transparent resin 7.
The groove has a width of about 500 μm, for example, to prevent the substrate from flowing out, and a scribe line 3 of about 60 μm is cut in the center of the flow prevention groove 4 to divide the substrates 2 into each substrate 2. Further, the notch 5...
is for making the shape as close to a circle as possible when each substrate 2 is divided. Note that these flow prevention grooves 4, scribe lines 3, notches 5, and lead wire insertion holes 6 are made using a mold when molding the alumina substrate 2.

In this way, in the state of the sheet-like substrate 1 before it is separated into each substrate 2..., the thick film wiring 8 is printed on the sheet-like substrate 1, and the lead wires are inserted and connected to the lead wire insertion holes 6. Equipped with 9 LED chips, 1 gold wire
Wire bonding is performed using 0 and the transparent resin 7 is potted into a lens shape. After completing this series of operations on the sheet-like substrate 1, it is divided into individual pieces at the scribe lines 3 to complete the LED lamp 11.

In the example shown in Fig. 1, the shape of the board 2 is an octagonal cutout 5, but the shape is not limited to this, and other polygons or corners with rounded corners as shown in Fig. 4 are used. It may have a shape like this.

In the embodiment described above, the flow prevention grooves 4 and the scribe lines 3 were formed in two stages, but as shown in FIG.
The two can also be integrated to form a V-shaped groove.

[Effects of the invention] Since the present invention is configured as described above, it is possible to consistently automate processing such as wiring and resin potting on individual boards at the sheet-like board stage, and it is possible to arrange them on a work holder as in the past. It is possible to eliminate manual work that wastes time and effort, such as performing individual wiring work, and therefore, products of excellent quality can be provided at low cost.

[Brief explanation of the drawing]

Figure 1 is a plan view of the sheet-like substrate according to the present invention and an enlarged plan view of a part of the mounted LED lamp.
The figures are a side view and an enlarged sectional view of FIG. 1, FIG. 3 is a partial sectional view of a sheet-like substrate with only scribe lines, and FIG. 4 is a plan view showing another embodiment of the present invention.
Fig. 5 is a cross-sectional view showing another implementation order of this filial plan, and Fig. 6 is a perspective view of an LED lamp. DESCRIPTION OF SYMBOLS 1... Sheet-like substrate, 2... Substrate, 3... Scribe line, 4... Flow prevention groove, 5... Notch, 7...
...Transparent resin, 8...Thick film wiring, 9...LED chip, 10...Gold wire, 11...LED lamp element.

Claims (1)

[Scope of utility model registration request] In an LED lamp where thick-film wiring is applied to an insulating substrate, LED chips are connected, and resin potting is performed on top of that, the sheet substrate is divided into multiple substrates, and the corners of each substrate are shaped into circles. An LED characterized in that a notch is formed to allow the substrates to approach each other, and a dividing scribe line and a resin flow prevention groove are formed at the interconnection portions of each substrate.
Lamp board.