JPH04167440A - Mold for semiconductor manufacturing apparatus - Google Patents
Mold for semiconductor manufacturing apparatusInfo
- Publication number
- JPH04167440A JPH04167440A JP29381490A JP29381490A JPH04167440A JP H04167440 A JPH04167440 A JP H04167440A JP 29381490 A JP29381490 A JP 29381490A JP 29381490 A JP29381490 A JP 29381490A JP H04167440 A JPH04167440 A JP H04167440A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cull
- resin
- runner
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ＩＣアセンブリ工程のモールド金型に間す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a mold for an IC assembly process.
第４図〜第６図は従来のモールド金型の断面図で、この
図において、１はセンターブロック、２はチエイスブロ
ック、３はチエイスブロック２のランナ一部、４はセン
ターブロックｌのカル部、５はカル部エジェクタービン
、６はランナ一部エジェクタービンである。７はカル出
口部、８はセンターランナー部、９は樹脂、１０はゲー
ト部、１１はパッケージ、１２はセンターブロック、１
３はプランジャ一部、１４はチャンバ一部である。Figures 4 to 6 are cross-sectional views of conventional molding molds. In these figures, 1 is the center block, 2 is the chase block, 3 is a part of the runner of the chase block 2, and 4 is the center block l. 5 is a cull part eject turbine, and 6 is a runner part eject turbine. 7 is a cull outlet part, 8 is a center runner part, 9 is a resin, 10 is a gate part, 11 is a package, 12 is a center block, 1
3 is a part of the plunger, and 14 is a part of the chamber.
次に動作について説明する。チャンバ一部１４に投入さ
れたモールド樹脂は、プランジャ一部１３により押圧さ
れ、カル部４に充填した後、ランナー部３を通り、ゲー
ト部ＩＯを通って、キャビティに注入される。注入され
た樹脂の硬化が完了した後、金型を型開きし、その際に
カル部エジェクタービン５及びランナ一部エジェクター
ビン６が作動して樹脂９を押し出して、金型からカル・
ランナー部及び製品を離型させる。Next, the operation will be explained. The molding resin introduced into the chamber part 14 is pressed by the plunger part 13, fills the cull part 4, and is then injected into the cavity through the runner part 3 and the gate part IO. After the injected resin has completely hardened, the mold is opened, and at that time the cull part ejector turbine 5 and the runner part ejector turbine 6 are operated to extrude the resin 9 and remove the cull from the mold.
Release the runner part and product from the mold.
従来のモールド金型は、センターブロック１が５ＫＤ−
１１相当の材質の一体物であったため、第５図イ１口に
示すように、カル出口部７．センターランナー部８が樹
脂により摩耗し、その摩耗部に樹脂が入り込んで食らい
付くため、第６図に示すように、金型離型時に上金型か
らカル・ランナ一部が離型しに＜＜、パッケージ部１１
と樹脂９部が引き剥がされて、パッケージ１１にクラッ
クが入ることや、樹脂９が金型内に残り、自動機が使用
できない場合や、樹脂９が金型内に残ったまま成形を行
って金型を破損させる等の問題点があった。In the conventional mold, the center block 1 is 5KD-
Since it was an integral part made of material equivalent to 11, the cull outlet part 7. The center runner part 8 is worn by the resin, and the resin enters and bites into the worn part, so when the mold is released, part of the cull runner is released from the upper mold, as shown in Figure 6. <, package part 11
The resin 9 may be peeled off and cracks may appear in the package 11, the resin 9 may remain in the mold and automatic machines cannot be used, or molding may be performed with the resin 9 remaining in the mold. There were problems such as damage to the mold.
この発明は上記のような問題点を解消するためになされ
たもので、金型のセンターブロック１のカル出口部７．
センターランナー部８の摩耗を防ぎ、金型離型をスムー
ズに行うことができるモールド金型を得ることを目的と
する。This invention was made to solve the above-mentioned problems, and the cull outlet part 7 of the center block 1 of the mold.
To obtain a mold that can prevent wear of a center runner part 8 and smoothly release the mold.
この発明のモールド金型は、センターブロックのカル出
口部、センターランナー部を有する部位を分割部とし、
その部位に耐摩耗性の優れた性質（例えば超硬）を用い
たものである。In the mold of the present invention, the part having the cull outlet part and the center runner part of the center block is a divided part,
A material with excellent wear resistance (for example, carbide) is used in that part.
この発明におけるモールド金型は、センターブロックの
分割部に耐摩耗性の優れた材質（例えば超硬）を用い、
カル出口部、センターランナー部の摩耗が生じず、金型
離型時に樹脂とパッケージの離型がスムーズζなる。The mold according to the present invention uses a material with excellent wear resistance (for example, carbide) for the divided parts of the center block,
There is no wear on the cull exit part or center runner part, and the resin and package can be released smoothly from the mold.
以下この発明の実施例を図について説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図、第２図において、１はセンターブロック、２は
チエイスブロック、３はチエイスブロック２のランナ一
部、５はカル部エジェクタービン、６はランナ一部エジ
ェクター゛ビンである６分割部Ｉ５はセンターブロック
１において、カル出口部７、センターランナー部８を有
する部位である。そしてこの部位に耐摩耗性の優れた材
質（例えば超硬）を用いている。In Figures 1 and 2, 1 is the center block, 2 is the chase block, 3 is a part of the runner of the chase block 2, 5 is the cull part ejector turbine, and 6 is the ejector bin part of the runner. A portion I5 is a portion of the center block 1 that includes the cull outlet portion 7 and the center runner portion 8. A material with excellent wear resistance (for example, carbide) is used for this part.
第３図に本発明のモールド金型の離型状態を示す０本発
明のモールド金型は、カル出口部７．センターランナー
部８の摩耗が生じないため、金型型開時にカル部エジェ
クタービン５、ランナ一部エジェクタービン６の作動に
より、樹脂９が均一に押し出されるため、上型に樹脂９
が残ったり、樹脂つとパッケージ１１が分離することが
なく、パッケージ１１にクラックが入ったりすることが
ない。FIG. 3 shows the release state of the mold of the present invention. The mold of the present invention has a cull exit portion 7. Since the center runner part 8 does not wear out, the resin 9 is uniformly extruded by the operation of the cull part ejector turbine 5 and the runner part ejector turbine 6 when the mold is opened.
The package 11 will not be separated from the resin, and the package 11 will not be cracked.
また、金型内に樹脂９が残った状態で成形を行って金型
を破壊することもない。Moreover, the mold is not destroyed by molding with the resin 9 remaining in the mold.
以上のようにこの発明によれば、金型摩耗による離型不
良を防止して、製品品質の向上を図るとともに、金型内
に樹脂が残ったまま成形した場合の金型破損を防止する
ことができるという効果がある。As described above, according to the present invention, it is possible to improve product quality by preventing mold release failure due to mold wear, and to prevent mold breakage when molding is performed with resin remaining in the mold. It has the effect of being able to.
第１図は本発明のモールド金型の断面図、第２図は本発
明のモールド金型のセンターランナー部の断面図、第３
図は本発明のモールド金型の製品離型状態を示す断面図
、第４図は従来のモールド金型の断面図、第５図イは従
来のモールド金型摩耗状態を示す断面図、第５図口は従
来のモールド金型センターランナー部断面図（摩耗状ｉ
＞−第６図は従来のモールド金型の製品離型状態を示す
断面図である。
図中、１はセンターブロック、２はチエイスブロック、
３はランナ一部、４はカル部、５はカル部エジェクター
ビン、６はランナ一部エジェクタービン、７はカル出口
部、８はセンターランナー部、９は樹脂、１５は分割部
である。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a cross-sectional view of the mold of the present invention, FIG. 2 is a cross-sectional view of the center runner portion of the mold of the present invention, and FIG.
The figure is a sectional view showing the product release state of the mold of the present invention, FIG. 4 is a sectional view of a conventional mold, and FIG. The figure opening is a cross-sectional view of the center runner part of a conventional mold (wear condition i).
＞-FIG. 6 is a sectional view showing the product release state of a conventional mold. In the figure, 1 is the center block, 2 is the chase block,
3 is a part of the runner, 4 is a cull part, 5 is an eject turbine for the cull part, 6 is an eject turbine for a part of the runner, 7 is a cull outlet part, 8 is a center runner part, 9 is a resin, and 15 is a dividing part. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
た半導体素子、及び上記リードフレームのインナーリー
ドと半導体素子を電気的に接続する配線材を有するＩＣ
リードフレームを樹脂封止成形するモールド金型におい
て、そのセンターブロック部のカル出口部及びセンター
ランナー部を有する部位に耐摩耗性材料を用いたことを
特徴とする半導体製造装置のモールド金型。An IC having an IC lead frame, a semiconductor element mounted on the lead frame, and a wiring material that electrically connects the inner lead of the lead frame and the semiconductor element.
1. A mold for semiconductor manufacturing equipment for molding a lead frame with resin, characterized in that a wear-resistant material is used in a portion of a center block portion having a cull outlet portion and a center runner portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29381490A JPH04167440A (en) | 1990-10-30 | 1990-10-30 | Mold for semiconductor manufacturing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29381490A JPH04167440A (en) | 1990-10-30 | 1990-10-30 | Mold for semiconductor manufacturing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04167440A true JPH04167440A (en) | 1992-06-15 |
Family
ID=17799496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29381490A Pending JPH04167440A (en) | 1990-10-30 | 1990-10-30 | Mold for semiconductor manufacturing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04167440A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0629137U (en) * | 1992-09-11 | 1994-04-15 | 株式会社三井ハイテック | Mold for resin sealing |
| JPH08142123A (en) * | 1994-11-15 | 1996-06-04 | Nec Corp | Mold |
-
1990
- 1990-10-30 JP JP29381490A patent/JPH04167440A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0629137U (en) * | 1992-09-11 | 1994-04-15 | 株式会社三井ハイテック | Mold for resin sealing |
| JPH08142123A (en) * | 1994-11-15 | 1996-06-04 | Nec Corp | Mold |
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