JPH0418453U - - Google Patents
Info
- Publication number
- JPH0418453U JPH0418453U JP1990059926U JP5992690U JPH0418453U JP H0418453 U JPH0418453 U JP H0418453U JP 1990059926 U JP1990059926 U JP 1990059926U JP 5992690 U JP5992690 U JP 5992690U JP H0418453 U JPH0418453 U JP H0418453U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- heat sink
- ceramic substrate
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
Landscapes
- Die Bonding (AREA)
Description
第１図第２図はこの考案の一実施例である混成
集積回路装置の平面図および側面図、第３図、第
４図は従来の混成集積回路の平面図および側面図
である。
図において、１はセラミツク基板、２は放熱板
、３は半田、４はスナツプラインを示す。なお、
図中、同一符号は同一、または相当部分を示す。
1, 2, and 2 are a plan view and a side view of a hybrid integrated circuit device which is an embodiment of this invention, and FIGS. 3 and 4 are a plan view and a side view of a conventional hybrid integrated circuit. In the figure, 1 is a ceramic substrate, 2 is a heat sink, 3 is solder, and 4 is a snap line. In addition,
In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
板を半田付けした混成集積回路装置において、所
定方向にスナツプラインを設けたことを特徴とす
る混成集積回路装置。 1. A hybrid integrated circuit device in which a ceramic substrate having a circuit structure is soldered onto a metal heat sink, characterized in that a snap line is provided in a predetermined direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990059926U JPH0418453U (en) | 1990-06-05 | 1990-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990059926U JPH0418453U (en) | 1990-06-05 | 1990-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0418453U true JPH0418453U (en) | 1992-02-17 |
Family
ID=31586858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990059926U Pending JPH0418453U (en) | 1990-06-05 | 1990-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0418453U (en) |
-
1990
- 1990-06-05 JP JP1990059926U patent/JPH0418453U/ja active Pending