JPH0418476U - - Google Patents

Info

Publication number
JPH0418476U
JPH0418476U JP5953890U JP5953890U JPH0418476U JP H0418476 U JPH0418476 U JP H0418476U JP 5953890 U JP5953890 U JP 5953890U JP 5953890 U JP5953890 U JP 5953890U JP H0418476 U JPH0418476 U JP H0418476U
Authority
JP
Japan
Prior art keywords
pad
wiring board
printed wiring
width
auxiliary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5953890U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5953890U priority Critical patent/JPH0418476U/ja
Publication of JPH0418476U publication Critical patent/JPH0418476U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による第一の実施例を示す図、
第２図は本考案による第二の実施例を示す図、第
３図は従来のパツドを示す図である。 １……ヴイアホール、２……信号パターン、３
……パツド、４……補助パツド、５……ソルダー
レジスト、６……富士山型補助パツド。 FIG. 1 is a diagram showing a first embodiment of the present invention;
FIG. 2 shows a second embodiment of the present invention, and FIG. 3 shows a conventional pad. 1... Via hole, 2... Signal pattern, 3
... Pad, 4... Auxiliary pad, 5... Solder resist, 6... Mt. Fuji type auxiliary pad.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品搭載用パツドを具備するプリント配線
板においてパツド外縁部より、パツドの幅に等し
いかそれより小さい幅の補助パツドを設け、更に
補助パツドの一部をソルダーレジストにて被覆し
ていることを特徴とするプリント配線板。 In a printed wiring board equipped with a pad for mounting electronic components, an auxiliary pad with a width equal to or smaller than the width of the pad is provided from the outer edge of the pad, and a part of the auxiliary pad is further covered with solder resist. Features printed wiring board.
JP5953890U 1990-06-05 1990-06-05 Pending JPH0418476U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5953890U JPH0418476U (en) 1990-06-05 1990-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5953890U JPH0418476U (en) 1990-06-05 1990-06-05

Publications (1)

Publication Number Publication Date
JPH0418476U true JPH0418476U (en) 1992-02-17

Family

ID=31586122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5953890U Pending JPH0418476U (en) 1990-06-05 1990-06-05

Country Status (1)

Country Link
JP (1) JPH0418476U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10718419B2 (en) 2014-11-28 2020-07-21 Harmonic Drive Systems Inc. Method for lubricating strain wave gearing

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63308398A (en) * 1987-06-10 1988-12-15 Fujitsu Ltd Printed wiring board
JPH01194498A (en) * 1988-01-29 1989-08-04 Ibiden Co Ltd Printed wiring board with exfoliation preventing pad

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63308398A (en) * 1987-06-10 1988-12-15 Fujitsu Ltd Printed wiring board
JPH01194498A (en) * 1988-01-29 1989-08-04 Ibiden Co Ltd Printed wiring board with exfoliation preventing pad

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10718419B2 (en) 2014-11-28 2020-07-21 Harmonic Drive Systems Inc. Method for lubricating strain wave gearing

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