JPH0419800Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an IC socket having an IC holding mechanism that allows the IC socket to be easily held and released.

In the IC socket shown in FIG. 1, in which the IC contact piece 2 of the IC package 1 is placed on the contact 4 provided on the socket base 3 to make contact, a downward force W as shown by the arrow in the figure is applied. It is necessary to attach an IC holding mechanism to pressurize the contact piece 2 into contact with the contact 4 and hold it.

This IC holding mechanism can of course be opened for attaching and detaching the IC package 1, but it is also possible to engage and detach the IC holding mechanism when work involves frequently attaching and detaching a large number of IC packages 1, such as in an IC performance test. It is desired that the work be easier and faster, and that the IC holding action can be performed appropriately.

The present invention has been devised in accordance with the above-mentioned purpose. The present invention will be explained in detail below according to the illustrated embodiments.

In the figure, 10 is a socket base forming the base of the IC socket, and 11 is a holding plate for an IC package 12 mounted on the IC socket. Applicable
The IC holding plate 11 is rotatably pivoted to one end of the socket base by a hinge arm 13 whose base end is bent into a shape at the end of the holding plate. The IC package 12 is pressed down from above and the contacts of the IC socket (corresponding to FIG. 1, 4) and the IC mounted thereon are made to be able to rise and fall on the upper surface of the socket base 10 on which the IC package 12 is mounted. Contact (corresponds to Figure 1, Figure 2)
When the IC package 12 stands up, the pressure is released and the IC package 12 can be extracted.

The contact features of the contacts and IC contact pieces are known structures that can be understood from the above-illustrated description of FIG.

Pressurized contact between the above IC contact piece and the contact, i.e.
In order to maintain the above-mentioned pressure by the IC pressing plate 11,
The free end of the IC holding plate is provided with a locking part that engages with the other end of the socket base 10 and holds the IC holding plate 11 upside down. The locking part is an IC, for example.
A downward mold hook 14 is bent at the free end of the holding plate, and a groove 15 into which the mold hook 14 slides is provided in the end face of the socket base corresponding to the mold hook 14, and the mold hook is engaged in the groove 15. Matching step part 1
5' is provided.

The IC holding plate 11 has bending elasticity in the warping direction, and the mold hook 14 bends upward due to the bending elasticity in the warping direction, as shown in FIG.
It slides on the inner wall and is pushed toward the stepped portion 15' and engages with the stepped portion 15' by a restoring force.

Before this engagement occurs, the inner surface of the IC holding plate 11 extending above the IC package contacts the top surface of the IC package 12, and after contact, the IC holding plate 11 is further pressed while pressing the IC package 12, thereby achieving the above-mentioned effect. The mold hook 14 is engaged and the IC is held down.

At this time, the IC holding plate 11 is inevitably pushed by the upward restoring force of the contact and is urged in the upright direction. If the mold hook 14 is again elastically deflected in the upward warping direction, the engagement is released, and the biasing force automatically rotates the IC holding plate 11 in the upright direction to open the socket as shown in FIG. The top surface of the base plate 10 is opened to allow extraction of the IC package cage 12.

The bending elasticity of the IC holding plate 11 in the warping direction is determined by the region extending from the hinge arm 13 at the base of the holding plate to the IC holding plate base, the die hook 14,
That is, it can be constructed by making the region between the engaging portion and the connecting plate base body have a spring plate structure, or by making the intermediate portion of the IC pressing plate 11 have a spring plate structure.

The illustrated embodiment shows a case in which the IC holding plate 11, its hinge arm 13, and mold hook 14 are formed of thin metal plates, and the whole is given bending elasticity in the warping direction.

The IC holding plate 11 may be flat as long as it comes into contact with the top surface of the IC package 12 before reaching the above-mentioned engagement when the IC holding plate 11 is laid down. Either the entire pressing plate part is curved so as to project toward the top surface of the IC package 12, or it is partially bent and its top surface is brought into contact with the top surface of the IC package to elastically press it. .

The free end side of the lever lever 16 is fixed to the free end of the IC retainer 11 configured as described above. The lever lever 16 extends above the IC holding plate 11, and its free end is located near the pivoting portion of the IC holding plate 11 in the opposite direction to the fixed portion.

The lever lever 16 is fixed, for example, by bending the base end of the lever into a shape as shown in the figure to form a mounting piece 17, attaching the mounting piece 17 to the outer surface of the mold hook 14 of the IC holding plate, and fixing it together with rivets 18 or the like. This shows the case of caulking.

The locking portion provided at the free end of the IC holding plate 11 may be formed at the end below the fixed portion of the lever lever 16. That is, FIG. 7 shows, as an example, the case where the mounting piece 17 of the lever lever 16 is also used as a mold hook 17', and this is engaged with the step part 15' at the end of the socket base 10 as a locking part. show.

The above-mentioned locking mechanism may be configured by providing an engagement hole in the free end of the IC holding plate and providing a protrusion on the socket base side, or vice versa, so that when the IC holding plate falls down, it engages with a snap and prevents it from rising. There is. Furthermore, the engagement position may be outside the end face of the socket base or at the end of the side surface. In this case, the lever 16 is fixed to a locking portion at the end of the same side and extends from there toward the opposite side.

The lever lever 16 is made of a rigid body that does not cause warping, whereas the IC holding plate 11 has bending elasticity in the warping direction.

That is, while the lever lever 16 is formed of a separate member as described above, it is formed of a rigid body that does not warp when pressed.
This is the IC holding plate 11 that causes warping as described above.
Attach to the free end of.

The lever lever 16 made of a rigid body properly transmits the pressing operation distance and pressing operation force applied to itself to the hook portions 14, 17' without warping itself, and efficiently causes the IC holding plate 11 to warp. To surely release the hook parts 14, 17'.

The present invention is as explained above in Figure 1.
While the IC package is housed in the socket base 10, the IC contact piece is placed on the contact, and then
When the IC holding plate 11 is laid down on the IC package 12 and the free end is pressed downward while pressing the IC package 12, the mold hook part ₁₄ or 17', which is the locking part, is elastically moved outward. It is deflected and engaged with the socket base 10, and cannot be opened.
The IC presser is held.

Furthermore, press the free end of the lever 16 downward.
When W ₂ is applied, as a reaction, the fixed part, that is, the mold hook part 14 of the free end of the IC holding plate of the fixed part,
17' becomes elastically deflected outward (curved upward),
The engagement will be released. As a result, the IC holding plate 11 is pushed up together with the IC package 12 by the restoring action and self-restoring action of the contacts, and stands up at a wide angle due to the instantaneous reaction of the disengagement, thereby opening the upper surface of the socket base 10. Therefore, the IC package cage can be extracted.

In addition to relying on the restoring force of the contact for the IC holding plate 11 to stand up, the bending angle at the connecting portion between the base of the IC holding plate 11 and the hinge arm 13 is set at a fourth angle, as shown by α in FIG. It is preferable to set the self-restoring position (erected position) of the IC holding plate 11 itself to maintain the opening angle at a wide angle by setting the angle to be larger than the angle when holding the IC shown in the figure. This is ultimately IC holding plate 11
This results in an example that utilizes the bending elasticity in the warp direction.

As described above, according to the present invention, the IC holding plate 11
The lowering, engagement, and raising/releasing of the can all be done easily with one touch.

That is, the IC holding plate 11 can be easily laid down by pushing the free end of the IC holding plate 11 using its bending elasticity in the direction of warpage, and similarly, by lightly pushing the free end of the lever lever 16, it can be turned down. The engagement can be released very easily by lever action.

To be more specific, the lever lever 16 is formed of a separate member as described above, but is made of a rigid body that does not warp when pressed, and is fixed to the free end of the IC holding plate 11, which warps as described above. Therefore, the lever lever 16 made of a rigid body properly transmits the pressing operation distance and pressing force applied to itself to the hook portions 14 and 17' without causing any warpage, and efficiently prevents the IC holding plate 11 from warping. Raising hook part 1
4, 17' are surely released.

Therefore, the lever 16 is connected to the hook portion 14,1.
It is possible to reach the above-mentioned release with the minimum necessary pressing operation distance compared to the disengagement distance of 7',
Therefore, the pressing operation force can be reduced without any loss.

The IC holding plate 11, which causes warping, and the lever lever 16, which does not cause warping, function synergistically as described above, causing the IC holding plate 11 and the hook portions 14, 17' to respond extremely sharply to the pressure of the lever lever 16.
Ensure cancellation. Furthermore, the problem of incomplete release can be effectively resolved.

Due to the above, frequent opening and closing of the IC holding plate 11,
The repeated attachment and detachment of the IC package 12 can be performed quickly and efficiently, and the workload of workers involved in IC test work for long periods of time can be significantly reduced.

Although FIG. 1 shows an example in which the IC package 1 has an IC contact piece 2 formed of conductive foil at the bottom end, the present invention is applicable to an IC package 1 in which the IC lead is shaped like a crab's leg. It can also be applied to IC package cages that protrude in parallel in the lateral direction.
In this case, in addition to directly pressing the top surface of the base of the IC package, a means such as a pad for pressing the IC leads placed on the contacts from above may be attached to the IC holding plate 11 to serve for holding the IC. can.

[Brief explanation of the drawing]

FIG. 1 is a side view schematically illustrating the form of contact between an IC socket and an IC package, FIG. 2 and subsequent figures show examples of the present invention, and FIG. 2 is a plan view of an IC socket.
Fig. 3 is a rear view of the same, Fig. 4 is a partially cutaway side view of the same showing the IC holding plate in the engaged state in the prone position, Fig. 5 is a side view of the same showing the same in the upright open state, and Fig. 6 is the same in the engaged state. FIG. 7 is a side view showing another example. 10...Socket base, 11...IC holding plate,
12...IC package cage, 13...hinge arm,
14, 17'... Barrel type hook serving as an engaging portion, 15...
...Groove into which the hook slides, 15'...Step, 16...
...Leverage lever, 17...Mounting piece.

Claims (1)

[Scope of Claim for Utility Model Registration] (1) An IC holding plate having bending elasticity in the warp direction is pivotably mounted on a socket base, and the free end of the IC holding plate is engaged with the socket base.
Has an IC holding mechanism equipped with a locking part that holds the IC holding plate upside down (IC holding state)
In the IC socket, a lever lever is fixed to the free end of the IC holding plate, the free end side of the lever lever is extended from the fixed part to the upper part of the IC holding plate, and the free end of the lever lever is pressed downward. By doing so, the IC holding plate is bent upward by the fixing portion to release the engagement of the locking portion, and the lever lever is a separate member from the IC holding plate and prevents the warping when pressed. An IC socket characterized by having an IC holding mechanism formed of a rigid body that does not bend. (2) Utility model registration claim 1, characterized in that the free end of the IC holding plate is provided with a locking portion formed at the fixed end of the lever lever.
IC socket as described in section.