JPH04201880A - Embossed type carrier tape - Google Patents

Embossed type carrier tape

Info

Publication number
JPH04201880A
JPH04201880A JP2324198A JP32419890A JPH04201880A JP H04201880 A JPH04201880 A JP H04201880A JP 2324198 A JP2324198 A JP 2324198A JP 32419890 A JP32419890 A JP 32419890A JP H04201880 A JPH04201880 A JP H04201880A
Authority
JP
Japan
Prior art keywords
carrier
carrier tape
corner
view
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2324198A
Other languages
Japanese (ja)
Other versions
JP2632084B2 (en
Inventor
Yoshihiko Okihara
沖原　好彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2324198A priority Critical patent/JP2632084B2/en
Publication of JPH04201880A publication Critical patent/JPH04201880A/en
Application granted granted Critical
Publication of JP2632084B2 publication Critical patent/JP2632084B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

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  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)

Abstract

PURPOSE:To free a carrier tape of the possibility of bending leads of an integrated circuit by forming a hollow near a corner of an individual carrier in order that a lead near the corner of a semiconductor IC device should not touch a side or the bottom of the individual carrier. CONSTITUTION:A hollow 4 is formed near a corner of an individual carrier 2a in a carrier tape 1a. As a result, when an IC 3 is mounted on the carrier 2a in the carrier tape 1a, the effect of the hollow 4 is such that, at the corner of the IC 3 where otherwise bending of a lead occurs most frequently, there is no possibility of a lead of the IC 3 touching a side or the bottom of the carrier 2a, that is, there is no occurrence of a lead near a corner of the IC 3 being accidentally bent.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、スモールアウトラインパッケージタイプの
半導体集積回路素子（以下ＩＣという）をテーピングす
る際に使用するエンボスタイプキャリアテープに（以下
キャリアテープという）に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an embossed type carrier tape (hereinafter referred to as carrier tape) used when taping a small outline package type semiconductor integrated circuit element (hereinafter referred to as IC). It is related to.

〔従来の技術〕[Conventional technology]

第７図ないし第９図は従来のキャリアテープの構成を示
すものて、第７図は平面図、第８図は正面図、第９図は
右側面図である。第１０図（よ第７図のキャリアテープ
に、ＩＣを封入した状態を示す平面図、第１．１図は第
１θ図に示す０部においてＩＣのリードに曲りを生した
状態を示す拡大平面図である。図において、（ｌｂ）は
キャリアテープ、（２ｂ）はキャリアテープ（ｌｂ）に
設けたキャリア部分、（３）はＩＣである。7 to 9 show the structure of a conventional carrier tape, with FIG. 7 being a plan view, FIG. 8 being a front view, and FIG. 9 being a right side view. Figure 10 is a plan view showing a state in which an IC is encapsulated in the carrier tape shown in Figure 7, and Figure 1.1 is an enlarged plan view showing a state in which the IC lead is bent at the 0 section shown in Figure 1. In the figure, (lb) is a carrier tape, (2b) is a carrier portion provided on the carrier tape (lb), and (3) is an IC.

次に動作について説明する。キャリアテープ（ｌｂ）に
、Ｉ　Ｃ（３１を入れると、第１Ｏ図に示した様に、Ｉ
　Ｃ＋３１とキャリア部分（２ｂ）との間にすきまが生
じる。Ｉ　Ｃ（３１はこのすき間の中を自由に動きまわ
るため、Ｉ　Ｃ（３）のリードがキャリア部分（２ｂ）
の側面もしくは底面と接触して、第１１図に示した様に
リードか曲がることがある。すなわち、ＩＣ（３）のコ
ーナー付近のリードが真先にキャリア部分（２）の側面
もしくは底面に接触するので、Ｉ　Ｃ（３）のコーナー
付近のリードが最も曲がる可能性が大きい。Next, the operation will be explained. When IC (31) is put into the carrier tape (lb), as shown in Figure 1O, the IC
A gap is created between C+31 and the carrier portion (2b). Since the IC (31) moves freely in this gap, the lead of the IC (3) is connected to the carrier part (2b).
The lead may be bent as shown in Figure 11 by contacting the side or bottom of the lead. That is, since the leads near the corners of the IC (3) contact the side or bottom surface of the carrier portion (2) first, the leads near the corners of the IC (3) are most likely to bend.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のキャリアテープは以上の様に構成されているので
、Ｉ　、Ｃのリード、特にコーナー付近のり　５−ドが
曲がり易いという問題点かあった。Since the conventional carrier tape is constructed as described above, there was a problem in that the I and C leads, especially the leads near the corners, were easily bent.

この発明は上記の様な問題点を解消するためになされた
もので、ＩＣのリードか曲からないキヤ、リアテープを
得ることを目的とする。This invention was made to solve the above-mentioned problems, and its purpose is to obtain a rear and rear tape that does not bend the leads of an IC.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係るキャリアテープは、そのキャリア部分の
形状において、キャリア部分のコーナー付近にくほみを
設けたものである。In the carrier tape according to the present invention, the shape of the carrier portion is provided with a notch near the corner of the carrier portion.

〔作用〕[Effect]

この発明におけるキャリアテープのキャリア部′分は、
コーナー付近にくほみを設けたことにより、封入される
ＩＣのコーナー付近のリードをキャリア部分の側面もし
くは底面に接触させない。The carrier portion of the carrier tape in this invention is
By providing a recess near the corner, the leads near the corner of the IC to be encapsulated do not come into contact with the side or bottom surface of the carrier portion.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第１
図ないし第３図はキャリアテープの構成を示すもので、
第１図は平面図、第２図は正面図、第３図は右側面図で
ある。！４図ないし第６図は１１図のキャリアテープに
ＩＣを封入した場合の特にキャリア部分のコーナー付近
を拡大して示すもので、第４図は平面図、第５図は第４
図に示すＡ、Ａにおける断面図、第６図は第４図に示す
Ｂ、Ｂにおける断面図である。図において（ｌａ）はキ
ャリアテープ、（２ａ）はキャリアテープ（ｌａ）に設
けたキャリア部分、（３）はＩＣ１（４）はキャリア部
分（２ａ）のコーナー付近に設けたくはみである。An embodiment of the present invention will be described below with reference to the drawings. 1st
Figures 3 to 3 show the structure of the carrier tape.
FIG. 1 is a plan view, FIG. 2 is a front view, and FIG. 3 is a right side view. ! Figures 4 to 6 are enlarged views of the vicinity of the corners of the carrier section when an IC is encapsulated in the carrier tape of Figure 11.
FIG. 6 is a sectional view at A and A shown in the figure, and FIG. 6 is a sectional view at B and B shown in FIG. In the figure, (la) is a carrier tape, (2a) is a carrier portion provided on the carrier tape (la), and (3) is a block where IC1 (4) is provided near the corner of the carrier portion (2a).

次に、作用について説明する。第４図ないし第６図に示
した様に、キャリアテープ（ｌａ）のキャリア部分（２
ａ）にＩ　Ｃ（３１を封入した場合、キャリア部分（２
ａ）のコーナー付近のくぼみ（４）の効果て、最もリー
ド曲がりの起こりやすいＩ　Ｃ（３）のコーナー付近の
リードはキャリア部分（２ａ）の側面もしくは底面に接
触することはない。すなわち、ＩＣ（３）のコーナー付
近のリードは誤って曲がることはない。Next, the effect will be explained. As shown in Figures 4 to 6, the carrier portion (2) of the carrier tape (la)
When IC (31) is enclosed in a), the carrier part (2
Due to the effect of the recesses (4) near the corners of a), the leads near the corners of the IC (3), where lead bending is most likely to occur, do not come into contact with the side or bottom surface of the carrier portion (2a). That is, the leads near the corners of the IC (3) will not be erroneously bent.

また、中央付近のリードについては、キャリア部分（２
ａ）の側面もしくは底面に接触する可能性かあるが、Ｉ
　Ｃ（３１の複数のピンか同時に接触するので比較的リ
ード曲がりは起こりにくい。Also, regarding the lead near the center, the carrier part (2
There is a possibility that it will come into contact with the side or bottom of a), but I
Since multiple pins C (31) are in contact at the same time, lead bending is relatively unlikely to occur.

さらに、キャリアテープ（１ａ）の構造は、第７図の従
来例に示した単純な形状のキャリアテープ（Ｉｂ）に比
較して凹凸が多いので、キャリア部分（２ａ）の外部圧
力による変形に対する強度か強くなるという利点もある
。Furthermore, the structure of the carrier tape (1a) has more irregularities than the simple carrier tape (Ib) shown in the conventional example in FIG. It also has the advantage of being stronger.

なお、上記実施例ではキャリア部分（２）のコーナ二付
近のくほみ（４）が第１図ないし第３図に示すような形
状の場合について説明したか、くほみ（４）の形状は上
記実施例に示した形状に限らず、上記実施例と同様の効
果をもたらすものであればよいことはいうまでもない。In addition, in the above embodiment, the shape of the corner (4) near the second corner of the carrier portion (2) is explained as shown in FIGS. 1 to 3. Needless to say, the shape is not limited to the shape shown in the above embodiment, but may be any shape as long as it provides the same effect as the above embodiment.

〔発明の効果〕〔Effect of the invention〕

以上の様に、この発明によれば、キャリアテープのキャ
リア部分において、キャリア部分のコーナー付近にくぼ
みを設けたので、封入されるＩＣのコーナー付近のリー
ドが上記キャリア部分の側面もしくは底面に接触゛する
ごとがなく、ＩＣのリード曲がりが発生しにくいという
効果がある。As described above, according to the present invention, in the carrier portion of the carrier tape, recesses are provided near the corners of the carrier portion, so that the leads near the corners of the encapsulated IC come into contact with the side or bottom surface of the carrier portion. There is no need to do anything, and there is an effect that bending of the IC leads is less likely to occur.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ないし第３図はこの発明の一実施例によるキャリ
アテープの構成を示すもので、第１図は平面図、第２図
は正面図、第３図は右側面図である。第４図ないし第６
図は第１図のキャリアテープにＩＣを封入した場合の特
にキャリア部分のコーナー付近を拡大して示すもので、
第４図は平面図、第５図は第４図に示すＡ、Ａにおける
断面図、第６図は第４図に示すＢ、Ｂにおける断面図で
ある。 第７図ないし第９図は従来のキャリアテープを示すもの
で、第７図は平面図、第８図は正面図、第９図は右側面
図である。第１θ図は第７図のキャリアテープにＩＣを
封入した場合を示す平面図、第１１図は第１θ図に示す
６部において、ＩＣのリードに曲りを生した状態を示す
拡大平面図てあ、る。 図において、（１ａ）はキャリアテープ、（２ａ）はキ
ャリア部分、（３）はＩＣ１（４）はくぼみである。 なお、図中、同一符号は同一、又は相当部分を示す。1 to 3 show the structure of a carrier tape according to an embodiment of the present invention, in which FIG. 1 is a plan view, FIG. 2 is a front view, and FIG. 3 is a right side view. Figures 4 to 6
The figure shows an enlarged view of the area around the corner of the carrier part when an IC is encapsulated in the carrier tape shown in Figure 1.
4 is a plan view, FIG. 5 is a cross-sectional view at A and A shown in FIG. 4, and FIG. 6 is a cross-sectional view at B and B shown in FIG. 4. 7 to 9 show a conventional carrier tape, with FIG. 7 being a plan view, FIG. 8 being a front view, and FIG. 9 being a right side view. Fig. 1θ is a plan view showing the case where an IC is enclosed in the carrier tape of Fig. 7, and Fig. 11 is an enlarged plan view showing a state where the IC lead is bent at the 6th section shown in Fig. 1θ. ,ru. In the figure, (1a) is the carrier tape, (2a) is the carrier portion, (3) is IC1, and (4) is the depression. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] 　半導体集積回路素子を封入するためのエンボスタイプ
キャリアテープにおいて、半導体集積回路素子のコーナ
ー付近のリードが上記エンボスタイプキャリアテープに
設けたキャリア部分の側面もしくは底面に接触すること
がない様に、キャリア部分のコーナー付近にくぼみを設
けたことを特徴とするエンボスタイプキャリアテープ。In an embossed type carrier tape for encapsulating a semiconductor integrated circuit device, the carrier portion is designed so that the leads near the corners of the semiconductor integrated circuit device do not come into contact with the side or bottom surface of the carrier portion provided on the embossed type carrier tape. An embossed type carrier tape characterized by having depressions near the corners.
JP2324198A 1990-11-26 1990-11-26 Emboss type carrier tape Expired - Lifetime JP2632084B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2324198A JP2632084B2 (en) 1990-11-26 1990-11-26 Emboss type carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2324198A JP2632084B2 (en) 1990-11-26 1990-11-26 Emboss type carrier tape

Publications (2)

Publication Number Publication Date
JPH04201880A true JPH04201880A (en) 1992-07-22
JP2632084B2 JP2632084B2 (en) 1997-07-16

Family

ID=18163161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2324198A Expired - Lifetime JP2632084B2 (en) 1990-11-26 1990-11-26 Emboss type carrier tape

Country Status (1)

Country Link
JP (1) JP2632084B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5913425A (en) * 1997-12-08 1999-06-22 Peak International, Inc. Component carrier having anti-reflective pocket

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3247662B2 (en) * 1999-05-17 2002-01-21 信越ポリマー株式会社 Carrier tape

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6160483A (en) * 1984-08-28 1986-03-28 松下電器産業株式会社 Electronic component carrier
JPS6278082A (en) * 1985-09-24 1987-04-10 日立東部セミコンダクタ株式会社 Semiconductor equipment carrier

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6160483A (en) * 1984-08-28 1986-03-28 松下電器産業株式会社 Electronic component carrier
JPS6278082A (en) * 1985-09-24 1987-04-10 日立東部セミコンダクタ株式会社 Semiconductor equipment carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5913425A (en) * 1997-12-08 1999-06-22 Peak International, Inc. Component carrier having anti-reflective pocket

Also Published As

Publication number Publication date
JP2632084B2 (en) 1997-07-16

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