JPH04202677A - Formation of resist pattern - Google Patents

Abstract

PURPOSE:To easily, swiftly and stably form a resist pattern with good precision by bringing a resin filled into a depressed part constituted of a resist pattern in a roll intaglio printing plate into contact with a film substrate, executing curing and thereafter transferring it to the material to be worked. CONSTITUTION:A depressed part 1 constituted of a resist pattern is formed on a roll intaglio printing plate 2. This depressed part 1 is filled with a resin 4 for an ionized radiation curable resist. Together with this, the roll intaglio printing plate 2 is wound with a film substrate 3 contg. a mold release agent via a pressurizing roll 8 and a feed roll 9, which is brought into contact with the above resin 4 for a resist, and they are cured and closely contacted at each other by ultraviolet rays, electron beams or the like from an ionized radiation apparatus 5. In this way, a transferred sheet 7 having a resist layer 6 with a pattern reproduced truly and clearly into a printing plate pattern on the film substrate 3 is obtd. Next, the transferred sheet 7 is superposed on the material 10 to be worked, and after they are heated and closely contacted at each other, the film substrate 3 is peeled away. In this way, the resist layer 6 with a pattern for etching is transferred onto the material 10 to be worked with good precision.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for forming a resist pattern, and more particularly to a method for forming a resist pattern that is applied when performing various pattern processing by etching.

[Conventional technology and the problem to be solved by the invention]

Pattern processing by etching has conventionally been carried out in various fields including printed circuit boards and semiconductor manufacturing, and photolithography is generally known as a means for forming resist patterns prior to etching. In this photolithography method, a photoresist is applied onto the workpiece, prebaked to improve the adhesion between the photoresist and the workpiece, and then ultraviolet light is passed through a mask with a desired pattern. Exposure is performed, and then either the exposed portion or the unexposed portion of the photoresist is selectively dissolved and removed using a predetermined developer to form a resist pattern.

However, this photolithography method involves a process of cleaning a workpiece such as a substrate, a process of applying photoresist to the workpiece, a heat treatment process to improve the adhesion between the workpiece and the applied photoresist, At a minimum, an exposure process of exposing ultraviolet rays through a predetermined mask and a development process of selectively removing the exposed and non-exposed areas of the resist by taking advantage of the difference in solubility in a developing solution are required. In some cases, a post-hake process is performed to harden the resist through heat treatment depending on the process.As is clear from the fact that the etching process is finally reached after passing through these many various processes, the number of steps is extremely large. All of these steps require relatively advanced operations and skill.

Moreover, this photolithography method has large equipment limitations, and the scale of the resist pattern that can be created at one time is small.
There is also the problem that the equipment is expensive and the processing cost is also relatively high.

On the other hand, a printing method is known as a means for forming a resist pattern with a relatively large processing capacity and with a relatively inexpensive device. For example, screen printing is used in the field of manufacturing printed circuit boards and the like.

However, it is extremely difficult to form fine patterns with such printing methods; for example, with screen printing,
It is not possible to print a pattern with a line width of less than μm, and other printing methods are also comparable. Therefore, although the printing method has simpler equipment and processes than the photolithography method, it has the disadvantage that it is difficult to form an ultra-fine resist pattern, and the resulting resist pattern is not completely satisfactory in terms of accuracy. There is.

The present invention was made to overcome the above-mentioned problems, and therefore provides a method for forming a Rennost pattern that can form various resist patterns, including complex and fine resist patterns, easily, quickly, accurately, and stably. The purpose is to

[Means to solve the problem]

That is, the method for forming a resist pattern of the present invention is a method in which a resist pattern for etching is formed on a workpiece by a transfer method, and first, a roll intaglio plate in which plate depressions made of a resist pattern are formed is used. , Filling the plate recesses of the rolled intaglio plate with a radiation-curable resist resin and contacting a film base material having release properties, and irradiating ionizing radiation while the base material is in contact with the intaglio plate. After curing the resin filled in the plate recesses and bringing the resin into close contact with the base material, the base material is peeled off from the intaglio plate to obtain a transfer sheet with a patterned resist layer provided on the base material. After preparing the transfer sheet, the transfer sheet is stacked and brought into close contact with the workpiece so that the resist layer forming side is in contact with the workpiece, and then the film base material is peeled off to transfer the resist layer to the workpiece. It is something.

〔Example] Embodiments of the present invention will be described below based on the drawings.

In the method of the present invention, first, a transfer sheet provided with a resist layer to be transferred is prepared. The above-mentioned transfer sorting is produced in the following manner using a roll intaglio plate 2 on which plate concave portions 1 corresponding to the resist pattern to be finally formed are made as shown in FIG. 1.

That is, a film base material 3 for a transfer sheet is appropriately supplied to a roll intaglio plate 2 set up as shown in the figure so as to be in contact with the intaglio surface by means of a conveying means, and at the same time, an ionizing radiation-curable resist resin 4 is applied to the plate recesses. Supply so that it is filled in 2. Then, while the base material 3 is in contact with the intaglio plate 2, ionizing radiation is irradiated by the ionizing radiation irradiation device 5, and the resist resin 4 filled in the plate recesses I is cured and is brought into close contact with the base material side. urge Finally, by peeling the base material 3 from the intaglio plate 2, a transfer sheet 7 provided with a resist N6 having a desired pattern shape as illustrated in FIG. 2 is obtained. In addition, 8 and 9 in FIG. 1 indicate a press roll and a feed roll installed in pairs with the roll intaglio 2.

In the present invention, since the resist layer 6 is formed by the above-described manufacturing method, an extremely precise resist layer in which the shape of the resist pattern molded on the roll intaglio is faithfully and clearly reproduced can be obtained. Even if the resist pattern is extremely complex and minute, a resist layer with good reproducibility can be obtained without any problems.

In the present invention, in order to ensure that the resist layer 6 is fixed to the transferred material side by the transfer described later, the ionizing radiation curable resin layer is not completely cured, that is, the transfer sheet is made with some residual thermoplasticity. After the transfer process, the film is further irradiated with ionizing radiation to completely cure the film. Even better results can be obtained if the above-mentioned procedure is carried out in the same manner using a known ionizing radiation-curable resin that becomes a non-adhesive solid when the solvent is dried even in an uncured state.

The plate recesses 1 in the roll intaglio plate 2 are formed by applying means such as electronic engraving, etching, mill pressing, electroforming, etc. to metal materials such as copper and iron, and plate materials such as glass and ceramics. be able to.

The resist resin 4 is supplied and filled by applying the resin to the area immediately before the contact between the roll intaglio plate 2 and the film base material 3 using a roll coating method, a coating method using a T-die nozzle, etc. so that the resin remains in the area as in this embodiment. In addition to being sandwiched and press-fitted between the intaglio plate and the base material, for example, before the base material 3 comes into contact with the roll intaglio plate 2, it can be coated on the base material in advance by a roll coating method or the like and supplied and filled. may be used, and is not particularly limited.

However, in order to form a resist resin layer with sharp outlines only in the patterned parts, after coating Resin 4 on the roll intaglio, remove unnecessary resin on the convex parts of the intaglio using a doctor blade, etc. It is most preferable to contact the film base material 3 after doing so.

The resist resin 4 is mainly composed of a radiation-curable resin (1). As the curing resin, known ultraviolet or electron beam-curing resins can be used, and among them, a type without fusing additives is preferable. In this case, problems such as volume shrinkage, shape deformation, and bubble generation due to curing do not occur, and a pre-drying step for the resin is not necessary, and recesses with better reproducibility can be reliably obtained. In addition, resist resins include polyvinyl, bisazide rubber, dichromate, polyester, acrylate, urethane acrylate, polyester acrylate, acrylate such as Epoquin acrylate, aromatic diazo resin, naphthoquinone diazide, etc. If necessary, a photosensitizer such as PVA or benzoquinone (in the case of a light- or ultraviolet-curable tree layer) is added.

Further, as the ionizing radiation to be irradiated, ultraviolet rays or light can be used when the film base material 3 is transparent, but when the base material is opaque, it is necessary to use an electron beam. Furthermore, if the roll intaglio plate is made of a material transparent to 1-isolated radiation, such as glass, it becomes possible to irradiate the IIA+ radiation with an irradiation device installed inside the intaglio plate. When using an electron beam, the irradiation amount is usually preferably about 2 to 20 Mrad, although it depends on the thickness and material of the film base material.

The film base material 3 should be a suitable material that can support the resist layer 6 when creating the transfer sheet, has release properties to the extent that the resist layer 6 can be easily transferred during transfer, and can also pass through rolls etc. smoothly. Any material may be used as long as it has flexibility. Examples include polyester film, polyethylene film, polypropylene film, polyvinyl chloride film, polyvinylidene chloride film, polycarbonate film, polyamide (nylon) film, polystyrene film, Ethylene-vinyl acetate copolymer films, etc. can be used, and polyester films such as polyethylene terephthalate are particularly desirable when considering processability, strength, cost, etc., on the side of these films where the resist layer is formed. If necessary, corona discharge treatment or easy-adhesion brimer treatment such as polyester resin can be applied.

Next, the method of the present invention is applied to the transfer sheet 7 obtained as described above.
Then, as shown in FIG. 3, the resist layer 6 is transferred onto the transfer material IO.

That is, as shown in the figure, the transfer sheet 7 is superimposed on the transfer material 10 so that the resist layer forming surface is in contact with the transfer material 10, and after heating is applied further as necessary, the film base material 3 is peeled off and removed. , a desired resist layer 6 is formed on the transfer material 10. When superimposing the above, it is necessary to perform precise positioning, and suitable transfer methods include hot roll transfer, wrapping, adhesive transfer, and vacuum transfer.

Can be used. In addition, when using an incompletely cured type of ionizing radiation curable resin as the resin material for the resist layer 6, it is possible to transfer the resin by heating, pressurizing, etc., and at the same time, after the transfer,
When the uncured portion is cured by irradiation with EH radiation, the mold releasability during transfer or the adhesion between the resist layer and the transferred material 10 become better.

As the transfer target material 10, one that is patterned itself, or one that has a patterned layer provided on the surface of another member and only the core layer is patterned is applicable. Its shape is a flat plate, a cylinder, etc., and other shapes are also possible. Specific examples include bar materials for aluminum sash, building materials such as door panels, iron plates for shadow masks, base materials such as copper-clad phenolic resin laminates for printed circuit boards, copper and iron for printing plates or embossing, etc. Examples include plates and cylinders.

The workpiece on which the resist pattern has been formed according to the present invention as described above is patterned by etching using a known etching method. 1! p
First, a known etching solution is applied to the workpiece using an appropriate method (for example, immersion in the etching solution, spraying with cough liquid, etc.), and the part of the workpiece where the resist layer is not formed is melted and removed, and then the resist is removed. Patterning is achieved by removing layers. As a method for removing the resist layer, various known methods such as brushing, polishing, dissolution with an organic solvent, etc. can be employed.

Next, the present invention will be explained in more detail by giving specific examples.

Example 1 A resist layer was formed on one side of a 25 μm thick two-wheel stretched polyester film (T-60 manufactured by Toshi) using the manufacturing method shown in FIG. 1 and using the following constituent materials and conditions. , a transfer sheet was obtained.

- Intaglio plate: A roll intaglio plate was used in which a negative pattern of a copper pattern of a printed circuit was formed with a concave width of 011 to 5 ml and a plate depth (concave depth) of 100 μm.

・Ionizing radiation curable resin: Uses polyester acrylate UV curable paint.

- Irradiation conditions: UV rays emitted from a high-pressure mercury lamp with an output of 80 W/C1 m were irradiated to completely crosslink the remaining solid content after the cured product was immersed in acetone for 24 hours and dried.

Using the above transfer sheet, a resist layer pattern was thermally transferred onto the copper surface of a copper-coated phenolic resin laminate using a real stamp (using a silicone rubber roll at 200° C. and a pressure of 1 kg/d).

Next, the same ultraviolet rays as above are irradiated onto the polyester film again to crosslink and harden the uncrosslinked portions, completely adhering the copper and resist layer, and then peeling off the polyester film to form the desired circuit on the copper surface. A resist pattern for pattern formation was formed.

〔Effect of the invention〕

As explained above, according to the method of the present invention, the resist layer formed on the transfer sheet is formed on the workpiece for etching processing by a transfer method, so that the resist pattern can be formed extremely easily and quickly compared to the conventional method. It is possible.

Furthermore, in the present invention, the resist layer in the transfer sheet is obtained by curing and forming the ionizing radiation-curable resist resin while it is in the plate recesses of the roll intaglio plate, as described above. Already at this stage, the resist layer is extremely faithful to the molding and clearly reproduced as desired. Then, such an excellent resist layer is transferred from the transfer sheet to the workpiece while maintaining its shape. Therefore, according to the present invention, a precise and desired resist pattern can be formed accurately and stably.

Further, in the present invention, since the resist layer to be transferred is formed by the above-described method, even extremely fine and complicated resist patterns can be easily formed. In addition, since the resist layer once formed on the transfer sheet is transferred, the method of the present invention is not limited to workpieces with smooth surfaces, but can also be applied to workpieces with uneven or curved surfaces that the transfer sheet can follow. Applicable.

Further, in the present invention, the process of manufacturing the transfer sheet and the process of transferring the transfer sheet are extremely simple, and there is no need to use expensive and complicated equipment such as those used in photolithography.

Such a method of the present invention is particularly effective when applied to the fields of electronic component materials, building materials, metal processing, and the like.

[Brief explanation of the drawing]

Fig. 1 is a process diagram showing an example of a method for manufacturing a transfer sheet used in the method of the present invention, Fig. 2 is a cross-sectional view showing an example of a transfer sheet, and Fig. 3 is a cross-sectional view showing an example of a transfer process in the method of the present invention. It is a diagram. 1... Plate recess 2... Roll intaglio 3...
- Film base material 4... Resin for ionizing radiation curable resist 6... Resist layer 7... Transfer sheet 10... Workpiece material Fig. 1, 5 4... Resin for tlII radiation curable resist 6°−′
7X) layer Fig. 2 7...Transfer sheet 10...Work material

Claims (1)

[Claims] A method for forming a resist pattern for etching processing on a workpiece by a transfer method, which first uses a roll intaglio plate in which a plate concave portion consisting of a resist pattern is formed, and the roll intaglio plate is Filling the depressions of the plate with an ionizing radiation-curable resist resin and contacting a film base material having mold releasability, and while the base material is in contact with the intaglio, ionizing radiation is irradiated to fill the depressions of the plate. After curing the resin and bringing the resin into close contact with the base material, the base material is peeled off from the intaglio plate to prepare a transfer sheet with a patterned resist layer provided on the base material. A method for forming a resist pattern, which comprises stacking and closely adhering a transfer sheet to a workpiece so that the resist layer formation side is in contact with the workpiece, and then peeling off the film base material to transfer the resist layer to the workpiece.