JPH0420587U - - Google Patents
Info
- Publication number
- JPH0420587U JPH0420587U JP6083090U JP6083090U JPH0420587U JP H0420587 U JPH0420587 U JP H0420587U JP 6083090 U JP6083090 U JP 6083090U JP 6083090 U JP6083090 U JP 6083090U JP H0420587 U JPH0420587 U JP H0420587U
- Authority
- JP
- Japan
- Prior art keywords
- hinge
- width
- door
- fittings
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Specific Sealing Or Ventilating Devices For Doors And Windows (AREA)
- Hinges (AREA)
- Securing Of Glass Panes Or The Like (AREA)
Description
第１図は斜視図である。
１……蝶番、２……側板、３……側板、４……
ドア、５，５′……樋端、６……呑み込み穴、７
……ナツクル部、８……辺、９……一方の稜線、
１０……他方の稜線、ｔ……見込み幅。
ドア、５，５′……樋端、６……呑み込み穴、７
……ナツクル部、８……辺、９……一方の稜線、
１０……他方の稜線、ｔ……見込み幅。
Claims (1)
- 隠蔽色で塗装した蝶番を設け、該蝶番の二葉の
側板の幅を、それぞれ、ドアの見込み幅と同一と
したことを特徴とする建具用蝶番。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6083090U JPH0420587U (ja) | 1990-06-08 | 1990-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6083090U JPH0420587U (ja) | 1990-06-08 | 1990-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420587U true JPH0420587U (ja) | 1992-02-20 |
Family
ID=31588540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6083090U Pending JPH0420587U (ja) | 1990-06-08 | 1990-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420587U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148354A (ja) * | 1995-11-22 | 1997-06-06 | Nec Corp | 半導体樹脂封止用金型 |
-
1990
- 1990-06-08 JP JP6083090U patent/JPH0420587U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148354A (ja) * | 1995-11-22 | 1997-06-06 | Nec Corp | 半導体樹脂封止用金型 |