JPH042058U - - Google Patents

Info

Publication number
JPH042058U
JPH042058U JP1990042929U JP4292990U JPH042058U JP H042058 U JPH042058 U JP H042058U JP 1990042929 U JP1990042929 U JP 1990042929U JP 4292990 U JP4292990 U JP 4292990U JP H042058 U JPH042058 U JP H042058U
Authority
JP
Japan
Prior art keywords
emitting diode
light
wire
conductor
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990042929U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990042929U priority Critical patent/JPH042058U/ja
Publication of JPH042058U publication Critical patent/JPH042058U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図と第２図と第３図は本考案の１実施例の
それぞれ平面図と右側面図と正面図であり第４図
は従来の装置の平面図である。 １……発光ダイオード、５……導体、７……金
属細線、８……立上り部、９……透光性樹脂。 1, 2, and 3 are a plan view, a right side view, and a front view, respectively, of an embodiment of the present invention, and FIG. 4 is a plan view of a conventional device. DESCRIPTION OF SYMBOLS 1...Light emitting diode, 5...Conductor, 7...Metal thin wire, 8...Rising part, 9...Translucent resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 略直方体状の発光ダイオードに１端をワイヤボ
ンドされ該発光ダイオードの略平面対角線上に延
在し、かつ他端を導体にワイヤボンドされ該他端
への立上り部が該導体に対して傾いて設けられた
金属細線と、前記発光ダイオードと前記金属細線
のそれぞれの周辺を覆う様に設けられた透光性樹
脂とを具備した事を特徴とする発光ダイオード表
示装置。 One end is wire-bonded to a substantially rectangular parallelepiped light-emitting diode and extends substantially diagonally on the plane of the light-emitting diode, and the other end is wire-bonded to a conductor so that the rising part to the other end is inclined with respect to the conductor. A light emitting diode display device comprising: a thin metal wire; and a light-transmitting resin provided to cover the respective peripheries of the light emitting diode and the thin metal wire.
JP1990042929U 1990-04-20 1990-04-20 Pending JPH042058U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990042929U JPH042058U (en) 1990-04-20 1990-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990042929U JPH042058U (en) 1990-04-20 1990-04-20

Publications (1)

Publication Number Publication Date
JPH042058U true JPH042058U (en) 1992-01-09

Family

ID=31554905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990042929U Pending JPH042058U (en) 1990-04-20 1990-04-20

Country Status (1)

Country Link
JP (1) JPH042058U (en)

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