JPH04207202A - Hybrid integrated circuit - Google Patents
Hybrid integrated circuitInfo
- Publication number
- JPH04207202A JPH04207202A JP2335325A JP33532590A JPH04207202A JP H04207202 A JPH04207202 A JP H04207202A JP 2335325 A JP2335325 A JP 2335325A JP 33532590 A JP33532590 A JP 33532590A JP H04207202 A JPH04207202 A JP H04207202A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- integrated circuit
- circuit
- hybrid integrated
- microstrip line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Waveguides (AREA)
- Non-Adjustable Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Waveguide Connection Structure (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、混成集積回路に係り、特にマイクロストリ
ップ線路の構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit, and particularly to the structure of a microstrip line.
第２図は従来の混成集積回路の一部分を示す斜視図であ
る。この図において、１は接地導体基板、２は誘電体基
板、４はマイクロストリップ線路で、インダクタンス成
分をもち、Ａｇ／Ｐｔ系の導体で形成されている。５は
抵抗器で、ＲｕＯ２系の抵抗体で形成されている。FIG. 2 is a perspective view showing a portion of a conventional hybrid integrated circuit. In this figure, 1 is a ground conductor substrate, 2 is a dielectric substrate, and 4 is a microstrip line, which has an inductance component and is made of an Ag/Pt based conductor. A resistor 5 is made of a RuO2-based resistor.
このような回路は、混成集積回路における高周波増幅回
路等でトランジスタ等の能動素子のバイアス回路あるい
は安定動作補償回路に用いられる。Such a circuit is used as a bias circuit for an active element such as a transistor or a stable operation compensation circuit in a high frequency amplifier circuit or the like in a hybrid integrated circuit.
［発明が解決しようとする課題］
上記のように構成された混成集積回路におけるマイクロ
ストリップ線路は、インダクタンス成分を太き（するた
めには、線路を長（しなければならず、さらに、抵抗器
を直列接続しているので、回路全体の大きさが大きくな
るという問題点があった。[Problems to be Solved by the Invention] In order to increase the thickness of the inductance component of the microstrip line in the hybrid integrated circuit configured as described above, the line must be made long. Since they are connected in series, there is a problem in that the overall size of the circuit increases.
この発明は、上記のような問題点を解消するためになさ
れたもので、混成集積回路を小型化することを目的とす
る。The present invention was made to solve the above-mentioned problems, and an object of the present invention is to miniaturize a hybrid integrated circuit.
［課題を解決するための手段］
この発明に係る混成集積回路は、マイクロストリップ線
路を抵抗体で形成したものである。[Means for Solving the Problems] A hybrid integrated circuit according to the present invention includes a microstrip line formed of a resistor.
〔作用１
この発明におけるマイクロストリップ線路は、抵抗体で
形成されていることにより、マイクロストリップ線路に
抵抗器を直列接続する必要がなくなる。[Operation 1] Since the microstrip line in the present invention is formed of a resistor, there is no need to connect a resistor in series to the microstrip line.
［実施例１ 以下、この発明の一実施例を第１図について説明する。[Example 1 An embodiment of the present invention will be described below with reference to FIG.
第１図において、１は接地導体基板、２は誘電体基板、
３はＲｕＯ２系の抵抗体で形成されたマイクロストリッ
プ線路である。In FIG. 1, 1 is a ground conductor substrate, 2 is a dielectric substrate,
3 is a microstrip line formed of a RuO2-based resistor.
上記実施例かられかるように、この構造においては、マ
イクロストリップ線路３がＲｕＯ２系の抵抗体で形成さ
れているため、従来のようなマイクロストリップ線路に
抵抗器を直列接続する必要がなくなる。ここで、抵抗値
は、抵抗体の比抵抗値を変えることで自由に設定できる
。また、この構造のマイクロストリップ線路３では、抵
抗器が分布定数的に考えられるため、安定動作補償回路
では高周波特性がよくなる。As can be seen from the above embodiment, in this structure, the microstrip line 3 is formed of a RuO2-based resistor, so there is no need to connect a resistor in series with the microstrip line as in the conventional case. Here, the resistance value can be freely set by changing the specific resistance value of the resistor. Further, in the microstrip line 3 having this structure, since the resistor is considered as a distributed constant, the stable operation compensation circuit has good high frequency characteristics.
なお、上記実施例では、導体にＡｇ／Ｐｔ系、抵抗体に
Ｒｕ ＯＺ系を用いる場合について示したが、導体にＣ
ｕ、抵抗体にＬ ａ Ｂ ｓ系、ＳｎＯ２系を用いたり
、他の材料を用いた場合にも適用できる。In addition, in the above example, the case where Ag/Pt system is used for the conductor and Ru OZ system is used for the resistor is shown, but C
The present invention can also be applied to cases where L a B s type, SnO2 type, or other materials are used for the resistor.
〔発明の効果〕
以上のように、この発明によれば、マイクロストリップ
線路が抵抗体で形成されているため、抵抗器の作用も兼
ねるので、抵抗器の接続が不要になり、回路の小型化が
計れる。また、部品点数の減少からも信頼性が向上し、
さらに、抵抗器が分布定数となり、高周波特性が向上す
る効果がある。[Effects of the Invention] As described above, according to the present invention, since the microstrip line is formed of a resistor, it also functions as a resistor, so there is no need to connect a resistor, and the circuit can be miniaturized. can be measured. Reliability is also improved due to a reduction in the number of parts.
Furthermore, the resistor becomes a distributed constant, which has the effect of improving high frequency characteristics.
第１図はこの発明の一実施例による混成集積回路の一部
分を示す斜視図、第２図は従来の混成集積回路の一部分
を示す斜視図である。
図において、１は接地導体基板、２は誘電体基板、３は
抵抗体で形成されたマイクロストリップ線路である。
なお、各図中の同一符号は同一または相当部分を示す。FIG. 1 is a perspective view showing a portion of a hybrid integrated circuit according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a portion of a conventional hybrid integrated circuit. In the figure, 1 is a grounded conductor substrate, 2 is a dielectric substrate, and 3 is a microstrip line formed of a resistor. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
、抵抗体で形成したことを特徴とする混成集積回路。A hybrid integrated circuit characterized in that a microstrip line formed on a dielectric substrate is formed of a resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2335325A JPH04207202A (en) | 1990-11-28 | 1990-11-28 | Hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2335325A JPH04207202A (en) | 1990-11-28 | 1990-11-28 | Hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04207202A true JPH04207202A (en) | 1992-07-29 |
Family
ID=18287261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2335325A Pending JPH04207202A (en) | 1990-11-28 | 1990-11-28 | Hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04207202A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8385805B2 (en) | 2010-02-25 | 2013-02-26 | Fuji Xerox Co., Ltd. | Fixing member, fixing apparatus and image forming apparatus |
-
1990
- 1990-11-28 JP JP2335325A patent/JPH04207202A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8385805B2 (en) | 2010-02-25 | 2013-02-26 | Fuji Xerox Co., Ltd. | Fixing member, fixing apparatus and image forming apparatus |
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