JPH042073U - - Google Patents

Info

Publication number
JPH042073U
JPH042073U JP4185490U JP4185490U JPH042073U JP H042073 U JPH042073 U JP H042073U JP 4185490 U JP4185490 U JP 4185490U JP 4185490 U JP4185490 U JP 4185490U JP H042073 U JPH042073 U JP H042073U
Authority
JP
Japan
Prior art keywords
laminate
conductive
layer
molded product
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4185490U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4185490U priority Critical patent/JPH042073U/ja
Publication of JPH042073U publication Critical patent/JPH042073U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の斜視図、第2図は
そのX−Y断面図、第3図は本考案の他の一実施
例のX−Y断面図、第4図は本考案の別の実施例
のX−Y断面図、第5図は一従来例の斜視図をそ
れぞれ示す。 1……プリント配線体、2……積層板、3……
絶縁層、4……導電パターン、5……成形品、6
……導電路、7……スルホール導電路。
Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is an X-Y sectional view thereof, Fig. 3 is an X-Y sectional view of another embodiment of the invention, and Fig. 4 is a sectional view of the invention. FIG. 5 shows an X-Y sectional view of another embodiment, and FIG. 5 shows a perspective view of a conventional example. 1...Printed wiring body, 2...Laminated board, 3...
Insulating layer, 4... Conductive pattern, 5... Molded product, 6
...Conductive path, 7...Through hole conductive path.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁層の表面周縁部まで導電パターンが展設さ
れてなる積層板と、この積層板の各層の導電パタ
ーンの間を接続する導電路が配設された成形品と
を有することを特徴とするプリント配線体。
A print characterized by having a laminate in which a conductive pattern is extended to the surface periphery of an insulating layer, and a molded product in which a conductive path is provided to connect between the conductive patterns in each layer of the laminate. wiring body.
JP4185490U 1990-04-19 1990-04-19 Pending JPH042073U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4185490U JPH042073U (en) 1990-04-19 1990-04-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4185490U JPH042073U (en) 1990-04-19 1990-04-19

Publications (1)

Publication Number Publication Date
JPH042073U true JPH042073U (en) 1992-01-09

Family

ID=31552880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4185490U Pending JPH042073U (en) 1990-04-19 1990-04-19

Country Status (1)

Country Link
JP (1) JPH042073U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01151769U (en) * 1988-04-01 1989-10-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01151769U (en) * 1988-04-01 1989-10-19

Similar Documents

Publication Publication Date Title
JPH042073U (en)
JPS63157906U (en)
JPH0371571U (en)
JPS6380881U (en)
JPS62162875U (en)
JPS6247119U (en)
JPS6351478U (en)
JPH02137009U (en)
JPS62193758U (en)
JPH02118987U (en)
JPH04774U (en)
JPS61205169U (en)
JPH0178067U (en)
JPS62190375U (en)
JPH0477275U (en)
JPH044775U (en)
JPH0276849U (en)
JPS62188182U (en)
JPS61205175U (en)
JPS63149569U (en)
JPH0351872U (en)
JPH02106855U (en)
JPS61125076U (en)
JPH0189780U (en)
JPS63159873U (en)