JPH04209621A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH04209621A JPH04209621A JP34044590A JP34044590A JPH04209621A JP H04209621 A JPH04209621 A JP H04209621A JP 34044590 A JP34044590 A JP 34044590A JP 34044590 A JP34044590 A JP 34044590A JP H04209621 A JPH04209621 A JP H04209621A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- epoxy
- resin composition
- modified
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 32
- 239000000203 mixture Substances 0.000 title claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 229920005573 silicon-containing polymer Polymers 0.000 claims abstract description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 229920003986 novolac Polymers 0.000 abstract description 6
- 238000002156 mixing Methods 0.000 abstract description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000945 filler Substances 0.000 abstract description 4
- 239000003063 flame retardant Substances 0.000 abstract description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 239000005062 Polybutadiene Substances 0.000 abstract 2
- 229920002857 polybutadiene Polymers 0.000 abstract 2
- 230000002787 reinforcement Effects 0.000 abstract 1
- 239000003607 modifier Substances 0.000 description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 210000000988 bone and bone Anatomy 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 238000007586 pull-out test Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- QNRMTGGDHLBXQZ-UHFFFAOYSA-N buta-1,2-diene Chemical class CC=C=C QNRMTGGDHLBXQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- -1 laminates Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
この発明は、たとえば半導体素子の樹脂封止等に用いら
れるエポキシ樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an epoxy resin composition used, for example, for resin encapsulation of semiconductor elements.
エポキシ樹脂組成物は、電子機器や電子部品などを構成
するために、接着剤、積層板、半導体素子封止材料など
として、従来から使用されてきている。特に最近では、
エレクトロニクスの分野におけるＩＣ用、さらにはＬＳ
Ｉ用封止材料としての需要が拡大している。Epoxy resin compositions have conventionally been used as adhesives, laminates, semiconductor element sealing materials, and the like in order to construct electronic devices, electronic components, and the like. Especially recently,
For IC in the field of electronics, and even for LS
Demand as a sealing material for I is expanding.
今日の半導体素子では、配線の高密度化とともに、チッ
プサイズの大型化が進んでいるが、この大型のチップを
エポキシ樹脂組成物で封止した場合、その硬化物の内部
応力により、アルミ配線のずれ（スライド）、パッシベ
ーション層におけるクランク発生等の問題が起こってい
る。このために、現在、エポキシ樹脂組成物の硬化物の
低応力化が大きな課題の一つになっている。In today's semiconductor devices, the wiring density is increasing and the chip size is increasing, but when these large chips are encapsulated with an epoxy resin composition, the internal stress of the cured product causes the aluminum wiring to become larger. Problems such as shifting (sliding) and cranking in the passivation layer are occurring. For this reason, reducing stress in cured products of epoxy resin compositions is currently one of the major challenges.
そこで、エポキシ樹脂組成物に通常のシリコー１弾性体
を添加することにより、その硬化物に可撓性を付与して
弾性率を低下させ、内部応力を緩和することが試みられ
てきた。Therefore, attempts have been made to add flexibility to the cured product by adding a regular silicone 1 elastic body to the epoxy resin composition, thereby lowering the elastic modulus and relieving the internal stress.
しかし、通常のシリコーン弾性体を含有するエポキシ樹
脂組成物は、低応力に効果はあるが、半導体チップやリ
ードフレーム等金属との密着性を低下させる傾向にある
。そのため、吸湿後ノ＼ンダ浸漬耐熱試験を行なうとリ
ードフレームとの界面から吸湿した水の７発による内部
応力の発生によりパッケージのクラックを生ずるという
問題がある。However, although epoxy resin compositions containing ordinary silicone elastomers are effective in reducing stress, they tend to reduce adhesion to metals such as semiconductor chips and lead frames. Therefore, when a heat resistance test is performed by dipping the package after absorbing moisture, there is a problem in that the package cracks due to the generation of internal stress due to the water absorbed from the interface with the lead frame.
この発明の課題は、低応力特性を損なわずに半導体チッ
プやリードフレーム等金属との密着性向上を図ることが
できるエポキシ樹脂組成物を提供する点にある。An object of the present invention is to provide an epoxy resin composition that can improve adhesion to metals such as semiconductor chips and lead frames without impairing low stress characteristics.
上記課題を解決するため、この発明にかかるエポキシ樹
脂組成物は、硬化物の低応力化を図る改質剤として下記
一般式（Ａ）で表される両末端カルボキシル変性ポリプ
タジエンと下記一般式（Ｂ）で表わされるエポキシ変性
シリコーンポリマとを含む点を特徴とするものである。In order to solve the above problems, the epoxy resin composition according to the present invention combines a polyptadiene modified with carboxyl at both ends represented by the following general formula (A) and the following general formula (B) as a modifier for reducing the stress of the cured product. ) is characterized in that it contains an epoxy-modified silicone polymer represented by:
ＨＯＯＣ（、、Ｕ ’） ｃ ｏ ＯＨ・・・・・・
（Ａ）（ここでＵは−ＣＨ２−ＣＨ−又はＣＨｚＣＨ＝
ＣＨ２
−ＣＨ＝ＣＨ−ＣＨ２−で、ｎは２０〜２０００）ＣＨ
，ＣＨ：ｌ
Ｉ
（ｍは２０〜２０００）
以下、この発明の詳細な説明する。HOOC(,,U') c o OH...
(A) (where U is -CH2-CH- or CHzCH=
CH2 -CH=CH-CH2-, n is 20 to 2000) CH
, CH:l I (m is 20 to 2000) The present invention will be described in detail below.
この発明のエポキシ樹脂組成ものは、エポキシ樹脂硬化
剤及び上記（Ａ）、（Ｂ）の一般式で示された改質剤を
含む。ここでエポキシ樹脂としては、たとえばビイフェ
ノールＡ系エポキシ樹脂、ビスフェノールＦ系エポキシ
樹脂、ノボラック系エポキシ樹脂、脂環式エポキシ樹脂
等が挙げられ、特に限定はされない。これらのエポキシ
樹脂は単独で、あるいは複数種を併せて使用できる。半
導体素子等を封止する成形材料として、この発明のエポ
キシ樹脂組成物を用いる場合には、硬化物のＴｇ、耐湿
性等の物性に鑑みて、ノボラック系エポキシ樹脂が好ま
しい。The epoxy resin composition of the present invention contains an epoxy resin curing agent and a modifier represented by the general formulas (A) and (B) above. Examples of the epoxy resin include biphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, alicyclic epoxy resin, and are not particularly limited. These epoxy resins can be used alone or in combination. When using the epoxy resin composition of the present invention as a molding material for encapsulating semiconductor elements and the like, novolac-based epoxy resins are preferred in view of physical properties such as Tg and moisture resistance of the cured product.
硬化剤としては、たとえば、フェノールノボラック樹脂
、酸無水物、アミン類などを、単独であるいは複数種を
併せて使用できる。上記エポキシ樹脂の場合と同様の理
由から硬化剤としてはフェノールノボラック樹脂等のフ
ェノール樹脂を用いることが好ましいが、これに限定さ
れることはない。また硬化剤の配合割合には特に制限は
なく、必要量を適宜設定すればよい。As the curing agent, for example, phenol novolac resin, acid anhydride, amines, etc. can be used alone or in combination. For the same reason as in the case of the epoxy resin described above, it is preferable to use a phenol resin such as a phenol novolak resin as the curing agent, but the curing agent is not limited thereto. Further, there is no particular restriction on the blending ratio of the curing agent, and the necessary amount may be set as appropriate.
改質剤として添加される上記の両末端カルボキシル変性
ポリプタジエンは１．２−ポリプタジエン又は、２．３
−ポリプタジエンでもよい。そしてこの両末端カルボキ
シル変性ポリプタジエンに上記のエポキシ変性シリコン
ポリマーを併用すると、これらの改質剤をそれぞれ単独
で用いた場合と比べて曲げ弾性率が小さく、かつ金属と
の密着力の高い硬化物を得ることができるのである。そ
して、両末端カルボキシル変性ポリプタジエン中のブタ
ジェン骨核の繰り返し数ｎならびにエポキシ変性シリコ
ンポリマー中のシロキ酸骨核の繰り返えし数ｍは２０乃
至２０００に限定される。これは、この範囲をはずれる
とエポキシ樹脂組成物の成形性が悪く、又硬化物の物性
も低下するからである。The above-mentioned polyptadiene modified with carboxyl at both ends added as a modifier is 1.2-polyptadiene or 2.3-polyptadiene.
-Polyptadiene may be used. When the above-mentioned epoxy-modified silicone polymer is used in combination with this double-terminated carboxyl-modified polyptadiene, a cured product with a lower flexural modulus and higher adhesion to metal can be created compared to when each of these modifiers is used alone. You can get it. The repeating number n of butadiene bone cores in the polyptadiene modified with carboxyl at both ends and the repeating number m of siloxic acid bone cores in the epoxy modified silicone polymer are limited to 20 to 2000. This is because, if it is outside this range, the moldability of the epoxy resin composition will be poor and the physical properties of the cured product will also deteriorate.
以上述べてきた必須成分を含むこの発明のエポキシ樹脂
組成物は、さらに必要に応じて、下記のその他の成分を
１種以上含んでいてもよい。同成分としては、たとえば
、硬化助剤または硬化促進剤（第３級アミン、イミダゾ
ール類、有機リン化合物等）、充填剤または補強剤（シ
リカ粉末、アルミナ粉末、炭酸カルシウム粉末、ガラス
繊維、炭素繊維等）、難燃化剤（三酸化アンチモン、臭
素化エポキシ樹脂、水和アルミナ等）、離型剤（ワック
ス、ステアリン酸、ステアリン酸塩等）、着色剤（カー
ボンブラック、金属酸化物等の顔料）などが挙げられる
が、これらの種類および配合割合等は、特に限定される
ものではない。なお、充填剤を用いる場合には、エポキ
シ樹脂組成物全体１００重量部（以下、単に「部」と記
す）に対して１０〜８０部となるように設定するのが好
ましい。１０部以上の充填剤を加えることにより、線膨
張係数を小さくして熱放散性を良好に保つことができる
が、８０部を越えると、キャビティーに完全に充填され
なくなり、成形性が悪くなる恐れがある。The epoxy resin composition of the present invention containing the essential components described above may further contain one or more of the following other components, if necessary. The same components include, for example, curing aids or curing accelerators (tertiary amines, imidazoles, organic phosphorus compounds, etc.), fillers or reinforcing agents (silica powder, alumina powder, calcium carbonate powder, glass fiber, carbon fiber, etc.). ), flame retardants (antimony trioxide, brominated epoxy resin, hydrated alumina, etc.), mold release agents (wax, stearic acid, stearate, etc.), colorants (carbon black, pigments such as metal oxides) ), but the types and blending ratios thereof are not particularly limited. In addition, when using a filler, it is preferable to set it so that it may become 10-80 parts with respect to 100 parts by weight (hereinafter simply referred to as "parts") of the entire epoxy resin composition. By adding 10 parts or more of filler, it is possible to reduce the linear expansion coefficient and maintain good heat dissipation, but if it exceeds 80 parts, the cavity will not be completely filled and moldability will deteriorate. There is a fear.
上記構成成分（必須成分および必要に応してはその他の
成分を含む）を、たとえばミキサ、ブレンダーなどで混
合し、ニーダ、ロールなどを使用して混練することによ
り、成形材料としてのエポキシ樹脂組成物を得ることが
できる。混練後に、必要に応じて冷却固化し、紛糾して
粒状等としてもよい。By mixing the above components (including essential components and other components as necessary) using a mixer, blender, etc., and kneading them using a kneader, roll, etc., the epoxy resin composition as a molding material is prepared. can get things. After kneading, if necessary, the mixture may be cooled to solidify and stirred to form granules.
以下に、この発明のさらに詳しい実施例を、比較例と併
せて示すが、この発明は、下記実施例に限定されるもの
ではない。More detailed examples of the present invention will be shown below together with comparative examples, but the invention is not limited to the following examples.
以下にこの発明の実施例及び比較例を挙げる。 Examples and comparative examples of this invention are listed below.
エポキシ樹脂：クレゾールノボラック型エポキシ樹脂
・・・・・・１７．０
（ＷＰＥ＝２００、平均重合度４）
硬化剤：フェノールノボラソク樹脂・・・・・・８．０
硬化助剤：２−エチルイミダゾール・・・・・・０．４
離型剤：天然カルナバワックス ・・・・・・０．５
充填荊ニジリカ粉末 ・・・・・・６８．６
顔 料：カーボンブラソフ ・・・・・・０．５
難燃剤：三酸化アンチモン ・・・・・・１．５
臭素化エポキシ樹脂 ・・・・・・１．５上記配合
（単位は重量部）を基本配合とし、これに下表の如く改
質剤の添加、無添加の組成物を調整し、これらの組成物
を成形材料として、リードフレームを一体に有するイン
サート成形を圧力５０ ｋｇ／ｍｍ２、温度１７０°Ｃ
で３分間行い、１７０°Ｃで５時間アフタキュアさせて
硬化物を得た。Epoxy resin: Cresol novolac type epoxy resin
...17.0 (WPE=200, average degree of polymerization 4) Curing agent: Phenol novorasoc resin ...8.0
Curing aid: 2-ethylimidazole...0.4
Mold release agent: Natural carnauba wax ・・・・・・0.5
Filled Nijirika powder ・・・・・・68.6
Pigment: Carbon Brasov...0.5
Flame retardant: antimony trioxide 1.5
Brominated epoxy resin...1.5 The above formulation (unit: parts by weight) is used as the basic formulation, and compositions with and without modifiers are prepared as shown in the table below, and these compositions are Insert molding with an integral lead frame is performed at a pressure of 50 kg/mm2 and a temperature of 170°C.
After curing for 3 minutes at 170°C for 5 hours, a cured product was obtained.
なお、ここで用いた改質剤である（Ａ）で表される両末
端カルボキシル変成ポリプタジエンは、ブタジェン骨格
が１．２−ブタジェンで、ｎは２００のポリマーを、（
Ｂ）で表されるエポキシ変成シリコンポリマはｍが４０
０のポリマを使用した。The modifier used here, the carboxyl-modified polyptadiene at both ends represented by (A), has a butadiene skeleton of 1,2-butadiene, and n is 200.
The epoxy modified silicone polymer represented by B) has m of 40
0 polymer was used.
得られたリードフレームを一体に有する効果物からリー
ドフレームを引き抜くテスト、線膨張係数（α１）２曲
弾性率（Ｅ）曲強度（σｆ）、ガラス転移温度（Ｔｇ）
の測定結果は、表に示す通り、曲弾性率と引き抜きテス
トに改善が認められた。なお、引抜きテストは引張り試
験で行い、１５Ｋｇ以下で破断したものを△で、１５Ｋ
ｇでも破断しなかったものを○で示した。そして線膨張
係数及びガラス転移温度は、ＴＭＡ法により求め、曲弾
性率と曲強度は、曲げ強度試験機を用いて行った。Test of pulling out the lead frame from the resultant effect product integrally containing the lead frame, linear expansion coefficient (α1), 2-flexural modulus (E), flexural strength (σf), glass transition temperature (Tg)
As shown in the table, improvements were observed in the flexural modulus and pull-out test. In addition, the pull-out test was performed using a tensile test, and those that broke at 15K or less were marked △, and 15K
Those that did not break even at The linear expansion coefficient and glass transition temperature were determined by the TMA method, and the flexural modulus and flexural strength were determined using a flexural strength tester.
この発明によるエポキシ樹脂組成物によると、曲げ弾性
率が小さい低応力の硬化物であって、かつ金属との密着
性の高い硬化物を得ることができるのである。According to the epoxy resin composition according to the present invention, it is possible to obtain a cured product with a low bending modulus, low stress, and high adhesion to metals.
Claims (1)
両末端カルボキシル変性ポリプタジエンと下記一般式（
Ｂ）で表わされるエポキシ変性シリコンポリマとを含む
エポキシ樹脂組成物。▲数式、化学式、表等があります
▼……（Ａ） （ここでＵは▲数式、化学式、表等があります▼又は ▲数式、化学式、表等があります▼で、ｎは２０〜２０
００） ▲数式、化学式、表等があります▼……（Ｂ） （ｍは２０〜２０００）[Scope of Claims] An epoxy resin, a curing agent, and a polyptadiene modified with carboxyl at both ends represented by the following general formula (A) and the following general formula (
An epoxy resin composition comprising an epoxy-modified silicone polymer represented by B). ▲There are mathematical formulas, chemical formulas, tables, etc.▼……(A) (Here, U is ▲There are mathematical formulas, chemical formulas, tables, etc.▼ or ▲There are mathematical formulas, chemical formulas, tables, etc.▼, and n is 20 to 20
00) ▲There are mathematical formulas, chemical formulas, tables, etc.▼……(B) (m is 20-2000)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34044590A JPH04209621A (en) | 1990-11-30 | 1990-11-30 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34044590A JPH04209621A (en) | 1990-11-30 | 1990-11-30 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04209621A true JPH04209621A (en) | 1992-07-31 |
Family
ID=18337033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34044590A Pending JPH04209621A (en) | 1990-11-30 | 1990-11-30 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04209621A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100346455C (en) * | 2004-05-17 | 2007-10-31 | 西安交通大学 | Sealing method for protecting metal connecting wire of micro-mechanical device in corrosion process |
| JP2020113605A (en) * | 2019-01-09 | 2020-07-27 | 株式会社東京精密 | Electronic component potting method and electronic device using the same |
-
1990
- 1990-11-30 JP JP34044590A patent/JPH04209621A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100346455C (en) * | 2004-05-17 | 2007-10-31 | 西安交通大学 | Sealing method for protecting metal connecting wire of micro-mechanical device in corrosion process |
| JP2020113605A (en) * | 2019-01-09 | 2020-07-27 | 株式会社東京精密 | Electronic component potting method and electronic device using the same |
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