JPH0422174U - - Google Patents
Info
- Publication number
- JPH0422174U JPH0422174U JP6198890U JP6198890U JPH0422174U JP H0422174 U JPH0422174 U JP H0422174U JP 6198890 U JP6198890 U JP 6198890U JP 6198890 U JP6198890 U JP 6198890U JP H0422174 U JPH0422174 U JP H0422174U
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- section
- soldering
- pressure
- sealed chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 4
- 238000009529 body temperature measurement Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Measuring Fluid Pressure (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示すブロツク図、
第２図は従来の一例を示すブロツク図である。
１……密閉チヤンバー、２……温度測定部、３
……加圧部、４……加圧温度設定部、５……温度
比較部、６……加圧タイマー部、ａ……温度入力
信号、ｂ……設定信号、ｃ……加圧信号。
FIG. 1 is a block diagram showing an embodiment of the present invention.
FIG. 2 is a block diagram showing a conventional example. 1... Sealed chamber, 2... Temperature measuring section, 3
... Pressure unit, 4... Pressure temperature setting section, 5... Temperature comparison section, 6... Pressure timer section, a... Temperature input signal, b... Setting signal, c... Pressure signal.
Claims (1)
る密閉チヤンバーと、前記の密閉チヤンバー内の
はんだ付け部を測定する温度測定部と、前記の密
閉チヤンバー内を加圧する加圧部と、前述の加圧
を行ない始めるときのはんだ付け部の温度を設定
する加圧温度設定部と、前記の温度測定部にて測
定された温度と前記の加圧温度設定部の設定温度
とが一致したときに前記の加圧部に加圧開始の信
号を送る温度比較部とを含むことを特徴とするは
んだ付け装置。 a sealed chamber that has a soldering mechanism therein and can be brought into a sealed state; a temperature measuring section that measures the soldered portion within the sealed chamber; a pressurizing section that pressurizes the inside of the sealed chamber; The pressure temperature setting section sets the temperature of the soldering part when starting soldering, and the temperature measured by the temperature measurement section matches the temperature set in the pressure temperature setting section. A soldering device comprising: a temperature comparison section that sends a signal to start pressurization to the pressure section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6198890U JPH0422174U (en) | 1990-06-12 | 1990-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6198890U JPH0422174U (en) | 1990-06-12 | 1990-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0422174U true JPH0422174U (en) | 1992-02-24 |
Family
ID=31590732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6198890U Pending JPH0422174U (en) | 1990-06-12 | 1990-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0422174U (en) |
-
1990
- 1990-06-12 JP JP6198890U patent/JPH0422174U/ja active Pending