JPH04223363A - Lead correcting device and method of semiconductor device - Google Patents

Abstract

PURPOSE:To enable leads to be corrected by a method wherein a meandering guide groove is provided in a lead correction device which moves vertically corresponding to each of outer leads, the outer lead is inserted into the guide groove, and the lead correction device is made to move up and down to bend the outer lead more than its spring back. CONSTITUTION:Outer leads 31 and 32 led out of both the sides of a semiconductor device are corrected by a semiconductor device lead correction device 10, where an upper terminal wall 12 and a lower terminal wall 20, rectilinear guide grooves 15 connected to each of the terminal walls 12 and 20, and a meandering guide groove 18 connected between the guide grooves 15 are provided to the lead correction device 10 concerned. A lead correction jig which is provided with symmetrical slopes along which the outer leads 31 and 32 led out from the sides of a semiconductor device are bent is used in combination with the lead correction device 10.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead repair apparatus (jig) for semiconductor devices and a lead repair method using the same.

0002

[Prior Art] Conventionally, technologies in this field include:
For example, JP-A No. 61-12052, Utility Model Application No. 1-760
There was something described in No. 60. As shown in FIGS. 7 to 10, the electronic component 1 is a DIP (dual in-line package) in which a plurality of connection pins 1b that protrude from both sides of the package 1a and are bent downward are arranged in the horizontal direction.
It is of type.

In the middle of the guide rail 2 that supports the bottom surface of the package of the electronic component 1, bend correction devices 3, 3 for the connecting pins 1b of the left and right rows of the electronic component 1 are arranged symmetrically with the guide rail 2 as a border. It is located. Each connection pin bend correction device 3 includes a substrate 5 that is driven in the vertical direction (direction of arrow S in FIG. 9) by a first drive source 4,
This board 5 has a horizontally long correction member 6a divided into upper, middle and lower parts.
, 6b, 6c are provided, and each correction member 6a, 6
Second drive sources 7a, 7b, and 7c are attached to drive the components b and 6c in the horizontal direction (in the direction of arrow T in FIG. 8). Furthermore, the front surface of each of the upper, middle, and lower correction members 6a, 6b, and 6c has comb teeth that engage with both sides in the arrangement direction of each connecting pin 1b of one side row of the electronic component 1 when they are lowered together. A shaped engagement piece 8 is provided. Reference numeral 9 denotes a holding member, which presses and fixes the package 1a of the electronic component 1 at the bend correction position.

A bend in the arrangement direction of the connecting pins 1b of the electronic component 1 can be straightened by considering the following points. Since the connecting pin 1b has springback due to elasticity, it is necessary to bend it slightly over the bending direction in the opposite direction. In addition, as described above, the bending in the arrangement direction of the connecting pins 1b is as follows.
1(a) and the bending of the wide part P of the shoulder part as shown in FIG. 11(a).
There are two types of curves, such as the curve of the narrow part Q that is narrow and constricted as shown in b), so to correct the curve of the wide part P,
A force F1 must be applied to the lower end 1f of the wide portion P while keeping the upper end 1d fixed. Further, in order to correct the bending of the narrow portion Q, it is necessary to apply force F2 to the lower end 1g of the narrow portion Q while the lower end 1f of the wide portion P is fixed. 1e is a constriction part.

[0005] Taking the above points into consideration, such a connection pin bending correction device is designed to correct bending of only the wide part P as shown in FIG. 11(a) or narrow part Q as shown in FIG. 11(b). Not only can the bends of the chisel be corrected individually, but also it is possible to correct the bending of the connecting pin in which both the wide part P and the narrow part Q are bent, as shown in Fig. 12. .

Next, the specific operation of this device is shown in FIGS.
This will be explained using FIG. 18. Incidentally, since the operations of the respective bend correction devices 3, 3 arranged on the left and right sides with respect to each connection pin 1b are the same, only the operation of the correction device on one side will be described here. (1) As shown in FIG. 13, the electronic component 1 is placed on the guide rail 2, sent to the position where the correction device is placed, and is pressed and fixed by the holding member 9. Each of the connection pins 1b of the electronic component 1 is (a) bent to the right from the shoulder, (b) bent to the left from a narrow neck, (c) bent to the left from the shoulder, ( (d) One that curves to the right from the narrow neck, (e) One that curves in two places, one at the shoulder and one from the narrow neck, (f) One that is straight. (2) Next, the substrate 5 is lowered by the first drive source 4, and as shown in FIGS. 10 and 14, the correction members 6a, 6b, 6
The engaging pieces 8, 8 of c are respectively fitted between the connecting pins 1b. That is, the correction members 6a, 6b, 6c are connected to the connecting pin 1b.
Since the connecting pins descend from above, even if the connecting pins are largely bent, the engaging pieces 8 of each of the correcting members 6a, 6b, 6c will enter from the base of the connecting pin 1b. As a result, the upper end 1d of the wide portion P of each connecting pin 1b is fixed (positioned) by the engagement piece 8 of the upper correction member 6a. (3) Next, as shown in FIG. 15, the upper correction member 6
While fixing a, the second drive source 7b drives the middle correction member 6b, for example, to the left, and the drive source 7c drives the lower correction member 6c, for example, to the right in opposite directions. As a result, the engaging piece 8 of the middle correction member 6b allows
As the lower end 1f of the wide part P is pushed and bent to the left,
The lower end 1 of the narrow part Q is fixed by the engaging piece 8 of the lower correction member 6c.
g is pushed and bent to the right. At this time, since the bending force acts in the direction in which the connecting pins are arranged, no scratches are caused on the outer surface of the pins. (4) Next, as shown in FIGS. 16 and 17, the middle correction member 6b and the lower correction member 6c are driven in opposite directions, and the engagement pieces 8 cause each connection pin 1
b is pressed and bent in the opposite direction to that in FIG. and,
As shown in FIG. 18, the correction members 6b and 6c are returned, and as shown in FIG.
This completes a series of reciprocating movements that began with.

As a result, first, the first return position shown in FIG. 16 was bent to the right from the shoulder (A);
The one that was bent to the left from the narrow constriction (b) was corrected to be straight, and then, as shown in Figure 18, the one that was bent to the left from the shoulder (c) and the one that was bent to the right from the narrow constriction were corrected. The crooked thing (d) is now straightened. Note that even in this case, since the bending force acts in the direction in which the connecting pins are arranged, no scratches will be caused on the outer surfaces of the pins. (5) Finally, as shown in FIG.
b and 6c are raised to complete the predetermined correction work.

[0008]

However, in the above-mentioned semiconductor device lead repair device, there are two driving sources for one side of the semiconductor device, and the mechanism is such that it applies minute movements to the left and right to the leads. There were problems with the device's control, mechanical design, lifespan, etc. In particular, there were difficulties in controlling the system and maintaining and managing the equipment in order to adapt it to mass production.

In order to simplify the mechanical complexity described above, the present invention forms meandering guide grooves corresponding to each external lead in the lead correction device that moves up and down, and in the guide grooves. To provide a lead repair device for a semiconductor device and a lead repair method thereof, which performs lead repair by bending each external lead more than springback by simply inserting an external lead and sliding the lead repair device up and down. purpose.

0010

Means for Solving the Problems In order to achieve the above object, the present invention provides a lead repair device for a semiconductor device for repairing external leads led out from both side surfaces of a semiconductor device. a linear guide groove connected to the
A meandering guide groove is provided which is connected to the linear guide groove.

[0011] Furthermore, a lead repair jig having symmetrical inclined surfaces for bending external leads led out from both sides of the semiconductor device outward is combined. Furthermore,
A lead repair method for a semiconductor device in which external leads led out from both sides of the semiconductor device are repaired includes a step of expanding the external leads of the semiconductor device outward in advance, and a step of expanding one of the external leads of the semiconductor device to the outside of the lead repair device. a step of pressing the external lead against the end wall of the semiconductor device and bending the external lead inward to correct the external lead; and a step of moving both external leads of the semiconductor device through a meandering guide groove to correct the external lead in the lateral direction. and a step of pressing the other of the external leads of the semiconductor device against a second end wall of the lead repairing device and bending the external leads inward to perform the repair.

[0012] Furthermore, in a lead repair method for a semiconductor device in which external leads led out from both sides of the semiconductor device are repaired, one of the external leads of the semiconductor device is pressed against the first end wall of the lead repair device. a step of bending the lead inward; a step of moving both of the external leads of the semiconductor device through a meandering guide groove to correct the external lead in the lateral direction; and a step of correcting the other external lead of the semiconductor device in the lateral direction. and a step of bending the external leads of the semiconductor device outward to make corrections.

[0013]

[Operation] According to the present invention, as described above, by simply inserting the guide wall in the lead correction device for a semiconductor device between each external lead and moving it up and down, the guide wall can be deformed in the vertical direction.
It is also possible to perform deformation and correction in the left and right directions. Therefore, the external leads led out from both sides of the semiconductor device can be reliably repaired using a simple lead repair device.

[0014]

Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view of a main part of a semiconductor device lead repair apparatus showing an embodiment of the present invention, FIG. 2 is a perspective view of a semiconductor device to be subjected to lead repair, and FIG. 3 is a diagram of FIG.
FIG. 2 is a sectional view taken along line A-A'.

First, the lead repair apparatus for a semiconductor device according to the present invention will be explained in detail. Here, as shown in FIG. 2, a case will be described in which the external leads of a DIP type semiconductor device 30 having external leads 31 and 32 led out from both sides of the semiconductor device (package) are modified. As shown in FIG. 1, the lead repair apparatus 10 for a semiconductor device has an upper end wall 12 formed at its upper end 11 for repairing leads, and a lower end wall 20 at its lower end 19 for repairing leads. Also,
A linear guide wall 13 capable of accommodating external leads 31 and 32 and a linear bottom surface 14 are provided at locations connected to the lead correction upper end 11 and the lead correction lower end 19, and a linear guide groove 15 is formed. . Furthermore, this linear guide groove 1
5, a meandering guide wall 16 and a meandering bottom surface 17 are provided, and a meandering guide groove 18 is formed.

Next, a detailed description will be given of an outline of a lead repair method for a semiconductor device according to a first embodiment of the present invention with reference to FIG. First, as shown in FIG. 4A, a semiconductor device lead repair jig 40 having inclined surfaces 41 and 42 on both sides is prepared, and the external leads 31 and 42 of the semiconductor device 30 are
32 is brought into contact with the inclined surfaces 41, 42 of the lead correction jig 40, and the external leads 31, 32 are bent to the outside of the external leads 31, 32. As a result, all the external leads 31 and 32 are bent beyond the springback. In other words, it is uniformly bent outward from a specified angle.

Next, as shown in FIG. 4(b), by pressing the external lead 31 against the upper end wall of the lead repair device of the semiconductor device, the external lead 31 which is bent outward in FIG. The leads 31 are bent inward to correct all the external leads 31 to the specified angles. Next, Figure 4(c)
As shown in the figure, by moving the external leads 31, 32 along the meandering guide groove of the semiconductor device lead repair device, the external leads 31, 32 are moved as shown by the arrows.
Bend it to the left and then return it to its original position.

Next, as shown in FIG. 4(d), by further moving the external leads 31 and 32 along the meandering guide groove of the semiconductor device lead correction device, as shown by the arrow, Bend it to the right, then return it to its original position. lastly,
As shown in FIG. 4(e), by pressing the external lead 32 against the lower end wall of the lead repair device of the semiconductor device,
The external leads 32 bent outward in FIG. 4(a) are bent inward to correct all the external leads 32 to a specified angle.

Next, a detailed description will be given of an outline of a lead repair method for a semiconductor device according to a second embodiment of the present invention with reference to FIG. First, as shown in FIG. 6(a), an external lead 31 is attached to the upper end wall of a lead repair device of a semiconductor device.
By pressing the external lead 31, the external lead 31 is bent inward beyond the springback.

Next, as shown in FIG. 6(b), by moving the external leads 31, 32 along the meandering guide groove of the lead repair device for the semiconductor device, the external leads 31, 32 are aligned with the arrows. As in, bend it to the left and then return it to its original position. Next, as shown in FIG. 6(c), the external leads 31 and 32 are further moved along the meandering guide groove of the semiconductor device lead correction device to the right as shown by the arrow. After bending it, return it to its original position.

Next, as shown in FIG. 6(d), the external lead 32 is bent beyond the springback by pressing the external lead 32 against the lower end wall of the lead correction device for the semiconductor device. Finally, as shown in FIG. 6E, a semiconductor device lead repair jig 40 having inclined surfaces 41 and 42 on both sides is prepared, and the external leads 31 and 3 of the semiconductor device 30 are
2 is brought into contact with the inclined surfaces 41 and 42 of the lead correction jig 40, and as shown in FIGS. 6(a) and 6(d),
Semiconductor device 3 bent inward by more than springback
0 external leads 31 and 32 are bent outward to correct all external leads 31 and 32 to a specified angle.

Hereinafter, a lead repair method for a semiconductor device according to a first embodiment of the present invention will be explained in detail with reference to FIGS. 1 to 5. First, as shown in Figure 4(a),
All external leads 31 and 32 are bent beyond springback. In other words, it is uniformly bent outward from a specified angle. Next, the tips of the external leads 31 of the semiconductor device 30 are inserted into the linear guide grooves 15 of the lead correction device 10, and first,
The lead correction device 10 is moved in the -Y-axis direction to bend the external lead 31, which is bent outward in FIG.

Next, the lead correction device 10 is moved in the Y-axis direction, the semiconductor device 30 is returned to the linear guide groove 15 of the lead correction device 10 (see position ① in FIG. 5), and the lead correction is performed again from there. By moving the device 10 in the Y-axis direction, the semiconductor device 30 is moved along the meandering guide groove 18. Then, at position (3) in FIG.
The bending angles match even if there are variations in the bending angles in the -X axis direction. Then, the angle is corrected to a prescribed angle between position ■ and position ■.

Furthermore, by moving the lead correction device 10 in the Y-axis direction from there, the semiconductor device 30 is moved along the meandering guide groove 18. Then, the position in Figure 5 ■
In this case, the external leads 31 and 32 of the semiconductor device 30 are bent in the X-axis direction by more than the springback, and even if the bending angles of all the external leads 31 and 32 vary in the X-axis direction, the bending angles are the same. do. Then, the angle is corrected to a specified value between position ① and position ② in FIG.

This step is repeated once again (see positions ■ and ■ in FIG. 5), and the external leads 31 and 3 of the semiconductor device 30 are
32 reaches the linear guide groove 15 (see position ■ in Figure 5)
. Finally, connect the tips of the external leads 32 of the semiconductor device 30 to
The lead correction device 10 is moved in the Y-axis direction through the linear guide groove 15 of the lead correction device 10, and as shown in FIG.
The external lead 32, which has been bent outward at , is bent inward to correct it to a specified angle (see position 3 in FIG. 5).

Next, a lead repair method for a semiconductor device according to a second embodiment of the present invention will be explained in detail with reference to FIGS. 1 to 3, 5, and 6. First, the tips of the external leads 31 of the semiconductor device 30 are inserted into the linear guide grooves 15 of the lead correction device 10, and the lead correction device 10 is -
Move in the Y-axis direction to bend the external lead 31 inward beyond the springback (see position 3 in FIG. 5).

Next, the lead correction device 10 is moved in the Y-axis direction to return the semiconductor device 30 to the linear guide groove 15 of the lead correction device 10 (see position ① in FIG. 5), and the lead correction device 10 is moved from there. By moving 10 in the Y-axis direction,
The semiconductor device 30 is moved along the meandering guide groove 18. Then, at position (3) in FIG. 5, the semiconductor device 30
The external leads 31 and 32 are bent more than springback in the -X axis direction, and all the external leads 31 and 32 are
Even if there are variations in the bending angles in the X-axis direction, the bending angles match. Then, the angle is corrected to a prescribed angle between position ■ and position ■.

Furthermore, by moving the lead correction device 10 in the Y-axis direction from there, the semiconductor device 30 is moved along the meandering guided groove 18. Then, the position in Figure 5 ■
In this case, the external leads 31 and 32 of the semiconductor device 30 are bent in the X-axis direction by more than the springback, and even if the bending angles of all the external leads 31 and 32 vary in the X-axis direction, the bending angles are the same. do. Then, the angle is corrected to a specified value between position ① and position ② in FIG.

This step is repeated once again (see positions ■ and ■ in FIG. 5), and the external leads 31 and 3 of the semiconductor device 30 are
32 reaches the linear guide groove 15 (see position ■ in Figure 5)
. Next, the tip of the external lead 32 of the semiconductor device 30 is passed through the linear guide groove 15 of the lead correction device 10, and the lead correction device 10 is moved in the Y-axis direction, as shown in FIG. 6(d). Bend the lead 32 inward beyond the springback (see position ■ in Figure 5).

Finally, as shown in FIG. 6E, a semiconductor device lead repair jig 40 having sloped surfaces 41 and 42 on both sides is prepared, and the external leads 31 and 32 of the semiconductor device 30 are
is brought into contact with the inclined surfaces 41 and 42 of the lead correction jig 40, and as shown in FIGS. 6(a) and 6(d), the semiconductor device 30 is bent inward by more than springback.
Bend the external leads 31 and 32 outward to correct to the specified angle.

As described above, in the lead correction device 10, guide grooves for performing lead correction corresponding to the set number of leads of the semiconductor device 30 are arranged at a predetermined pitch (see FIG. 5).
. In this way, the external lead inserted into the guide groove for lead correction starts from the lead correction upper end 11 and moves from side to side inside the guide groove as the lead correction device moves, and then moves to the lead correction lower end 19. . Here, in order for the external lead to move smoothly within the guide groove, it is desirable to process the guide groove to have a width that is slightly larger than the width of the external lead.

Furthermore, since the guide wall is relatively thin due to the gap between the external leads, the bottom of the guide groove is formed integrally with the guide wall, but if there is no problem with the strength of the guide wall, the bottom may be It may be removed and formed into a so-called slit. Furthermore, the height of the guide wall can be appropriately set depending on the shape of the lead, etc. Further, the lead correction device is driven by a general motor or mechanical control such as air pressure.

Note that the present invention is not limited to the above-mentioned embodiments, and various modifications can be made based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

[0034]

As described above in detail, according to the present invention, the guide wall in the lead repair device for a semiconductor device is simply inserted between each external lead and moved up and down.
Vertical deformation and horizontal deformation/correction can be reliably performed with a single lead correction device.

[0035] Therefore, control of lead modification of a semiconductor device,
Mechanical design etc. are simplified, improving workability and reducing costs.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of main parts of a lead repair apparatus for a semiconductor device showing an embodiment of the present invention.

FIG. 2 is a perspective view of a semiconductor device that is subject to lead correction according to the present invention.

FIG. 3 is a sectional view taken along line AA' in FIG. 1;

FIG. 4 is a schematic process diagram for repairing leads of a semiconductor device, showing a first embodiment of the present invention.

FIG. 5 is a plan view of a lead repair device for a semiconductor device showing an embodiment of the present invention.

FIG. 6 is a schematic process diagram for repairing leads of a semiconductor device according to a second embodiment of the present invention.

FIG. 7 is a plan view of a conventional lead repair device for a semiconductor device.

FIG. 8 is a configuration diagram of a conventional lead repair device for a semiconductor device.

FIG. 9 is a front view of a conventional lead correction device for a semiconductor device.

FIG. 10 is a front view showing a lead correction state of a conventional semiconductor device.

FIG. 11 is a side view showing a bent state of a lead of a conventional semiconductor device.

FIG. 12 is an explanatory diagram for correcting bending of leads in a conventional semiconductor device.

FIG. 13 is a configuration diagram of main parts of a conventional lead repair device for a semiconductor device.

FIG. 14 is a side view showing a lead correction set state of a conventional semiconductor device.

FIG. 15 is a side view showing a first lead correction state of a conventional semiconductor device.

FIG. 16 is a side view showing a state of a conventional semiconductor device in a restored state after the first lead correction.

FIG. 17 is a side view showing a state of secondary lead correction of a conventional semiconductor device.

FIG. 18 is a side view showing a state in which lead correction of a conventional semiconductor device is completed.

[Explanation of symbols]

10 Lead correction device 11 Lead correction upper end 12 Upper end wall 13 Straight guide wall 14 Straight bottom surface 15 Straight guide groove 16 Meandering guide wall 17 serpentine bottom 18 Meandering guide groove 19 Lead correction lower end 20 Lower end wall 30 Semiconductor device 31, 32 External lead 40 Lead correction jig 41,42　　　　　　　　　　Slope

Claims (4)

[Claims] 1. A semiconductor device lead repair device for repairing external leads led out from both side surfaces of a semiconductor device, comprising: (a) both end walls; (b) a linear guide groove continuous to the both end walls; ,(c)
A lead correction device for a semiconductor device, comprising a meandering guide groove connected to the linear guide groove. 2. The lead repair apparatus for a semiconductor device according to claim 1, further comprising a lead repair jig having symmetrical inclined surfaces for bending external leads led out from both sides of the semiconductor device outward. 3. A semiconductor device lead repair method for repairing external leads led out from both side surfaces of a semiconductor device, comprising: (a) spreading the external leads of the semiconductor device outward in advance; (b) said semiconductor device; pressing one of the external leads of the semiconductor device against a first end wall of the lead correction device and bending the external lead inward to correct the external lead; (c) cutting both of the external leads of the semiconductor device into a meandering guide groove; (d) pressing the other of the external leads of the semiconductor device against a second end wall of the lead modification device and bending the external leads inward; A lead repair method for a semiconductor device, which includes a step of repairing leads. 4. A semiconductor device lead repair method for repairing external leads led out from both sides of the semiconductor device, comprising: (a) pressing one of the external leads of the semiconductor device against a first end wall of a lead repair device; (b) moving both of the external leads of the semiconductor device through a meandering guide groove to correct the external leads in the lateral direction; (c) correcting the external leads in the lateral direction; pressing the other external lead of the semiconductor device against a second end wall of the lead correction device to bend the external lead inward; and (d) bending the external lead of the semiconductor device outward to perform correction. How to repair leads in semiconductor devices.