JPH0423145U - - Google Patents
Info
- Publication number
- JPH0423145U JPH0423145U JP6435890U JP6435890U JPH0423145U JP H0423145 U JPH0423145 U JP H0423145U JP 6435890 U JP6435890 U JP 6435890U JP 6435890 U JP6435890 U JP 6435890U JP H0423145 U JPH0423145 U JP H0423145U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminals
- external lead
- rectangular annular
- frame
- annular frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案に係るリードフレームの一実
施例を示す平面図、第１図ｂは第１図ａに示すリ
ードフレームのＹ−Ｙ線拡大断面図、第２図ａ，
ｂ，ｃ，ｄは第１図ａ，ｂに示すリードフレーム
の製造方法を説明するための各工程毎の拡大断面
図、第３図は第１図ａ，ｂに示すリードフレーム
を用いて半導体素子収納用パツケージを製造する
方法を説明するための断面図、第４図ａは従来の
リードフレームの平面図、第４図ｂは第４図ａに
示すリードフレームのＸ−Ｘ線拡大断面図である
。
１……リードフレーム、２，２ａ……外部リー
ド端子、３……方形環状をなすフレーム、Ｂ……
膨大部。
FIG. 1a is a plan view showing an embodiment of the lead frame according to the present invention, FIG. 1b is an enlarged sectional view taken along Y-Y line of the lead frame shown in FIG. 1a, FIG.
b, c, and d are enlarged cross-sectional views for each step to explain the manufacturing method of the lead frame shown in Fig. 1 a, b, and Fig. 3 is a semiconductor manufacturing method using the lead frame shown in Fig. 1 a, b. A sectional view for explaining a method of manufacturing a package for housing an element, FIG. 4a is a plan view of a conventional lead frame, and FIG. 4b is an enlarged sectional view taken along line X-X of the lead frame shown in FIG. 4a. It is. 1... Lead frame, 2, 2a... External lead terminal, 3... Rectangular ring-shaped frame, B...
Ampulla.
Claims (1)
つて方形環状フレームの内周各辺に連結されて成
るリードフレームにおいて、前記方形環状フレー
ムの各角部に膨大部を設け、且つ該膨大部の外周
辺が方形環状フレームの各辺最外部に位置する外
部リード端子の外側に各外部リード端子間の間隔
に対し０．８乃至１．２倍の間隔をもつて近接配
置されていることを特徴とするリードフレーム。 In a lead frame in which one ends of a plurality of external lead terminals are connected to each side of the inner circumference of a rectangular annular frame at regular intervals, an enlarged portion is provided at each corner of the rectangular annular frame; The external lead terminals are arranged close to each other at a distance of 0.8 to 1.2 times the distance between the external lead terminals on the outside of the external lead terminals located at the outermost edge of each side of the rectangular annular frame. lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990064358U JP2525853Y2 (en) | 1990-06-18 | 1990-06-18 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990064358U JP2525853Y2 (en) | 1990-06-18 | 1990-06-18 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0423145U true JPH0423145U (en) | 1992-02-26 |
| JP2525853Y2 JP2525853Y2 (en) | 1997-02-12 |
Family
ID=31595231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990064358U Expired - Lifetime JP2525853Y2 (en) | 1990-06-18 | 1990-06-18 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2525853Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258359A (en) * | 1988-08-24 | 1990-02-27 | Ibiden Co Ltd | Lead frame |
-
1990
- 1990-06-18 JP JP1990064358U patent/JP2525853Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258359A (en) * | 1988-08-24 | 1990-02-27 | Ibiden Co Ltd | Lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2525853Y2 (en) | 1997-02-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |