JPH0423254U - - Google Patents
Info
- Publication number
- JPH0423254U JPH0423254U JP6266890U JP6266890U JPH0423254U JP H0423254 U JPH0423254 U JP H0423254U JP 6266890 U JP6266890 U JP 6266890U JP 6266890 U JP6266890 U JP 6266890U JP H0423254 U JPH0423254 U JP H0423254U
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- water supply
- diameter
- back side
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000004575 stone Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
第１図は、この考案に係る艶出し研磨盤の平面
図、第２図は、第１図の背面図、第３図は、第１
図の１１１−１１１線縦断面図、第４図は、第３
図の艶出し研磨盤を被研磨石材の被研磨面に接触
させて鏡面研磨を実施した状態を示す部分縦断面
図である。
１０……艶出し研磨盤、１０ａ……表面、１０
ｂ……裏面、１２……浅い凹部、１４……円錐形
給水部、１６……小径給水孔、２０……研磨砥石
、２２……空間部、ｗ……被研磨石材。
FIG. 1 is a plan view of the polishing polishing machine according to this invention, FIG. 2 is a rear view of FIG. 1, and FIG.
The vertical sectional view taken along the line 111-111 in the figure, Figure 4 is
FIG. 2 is a partial longitudinal cross-sectional view showing a state in which mirror polishing is performed by bringing the polishing polishing disk shown in the figure into contact with the surface to be polished of the stone to be polished. 10... Polishing polishing board, 10a... Surface, 10
b... Back surface, 12... Shallow recess, 14... Conical water supply portion, 16... Small diameter water supply hole, 20... Polishing whetstone, 22... Space, w... Stone material to be polished.
Claims (1)
、該基盤の表面中心に所要の直径と浅い凹部を形
成し、該浅い凹部の中心に円錐形給水部を形成し
、該円錐形給水部の中心底に小径の給水孔を形成
して裏面側に導き、該給水孔の出口と該裏面側と
を傾斜面とし、該裏面側の円周縁から中心方向に
一定の幅と厚みとを有する研磨砥石を設け、該裏
面側で該研磨砥石の内周囲に空間部を形成した事
を特徴とする艶出し研磨盤。 (2) 所要に応じ、該円錐形給水部の容積と該小
径の給水孔の直径とを選択自在し、給水量を調節
自在とする事を特徴とする実用新案登録請求の範
囲第(1)請求項記載の艶出し研磨盤。[Claims for Utility Model Registration] (1) In a base having a required diameter and thickness, a shallow recess with the required diameter is formed at the center of the surface of the base, and a conical water supply section is formed at the center of the shallow recess. A small-diameter water supply hole is formed at the center bottom of the conical water supply portion to lead it to the back side, and the exit of the water supply hole and the back side are sloped surfaces, and from the circumferential edge of the back side toward the center. 1. A polishing and polishing disc characterized in that a polishing wheel having a certain width and thickness is provided on the surface of the polishing wheel, and a space is formed around the inner circumference of the polishing wheel on the back side of the polishing wheel. (2) Utility model registration claim No. (1) characterized in that the volume of the conical water supply portion and the diameter of the small diameter water supply hole can be freely selected and the amount of water supplied can be adjusted as required. A polishing polishing machine according to the claims.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6266890U JPH0423254U (en) | 1990-06-15 | 1990-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6266890U JPH0423254U (en) | 1990-06-15 | 1990-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0423254U true JPH0423254U (en) | 1992-02-26 |
Family
ID=31592031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6266890U Pending JPH0423254U (en) | 1990-06-15 | 1990-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423254U (en) |
-
1990
- 1990-06-15 JP JP6266890U patent/JPH0423254U/ja active Pending
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