JPH0423332Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a hybrid integrated circuit device in which mounted components are removably attached without making holes or damaging the substrate.

[Prior art]

In conventional hybrid integrated circuit devices, the lead terminals of components mounted on the motherboard are fixed with solder or the like, and the mounted components cannot be replaced unless the solder or the like is removed.

By the way, the current needs of OEMs are for higher integration and miniaturization of mounted components as systems become smaller. You will need to do what you can. It will be difficult to meet these future needs with conventional devices, and it will naturally be necessary to change their configuration.

[Object of the invention] An object of the invention is to provide a hybrid integrated circuit device in which mounted components can be attached and detached using spring force.

[Structure of the idea]

According to the present invention, a positioning frame for the mounted component is mounted on a board having lead terminals, the mounted component is mounted within the positioning frame on the board, and a presser spring is provided on the positioning frame and the mounted component, A hybrid integrated circuit device is obtained in which the presser spring is hooked to the positioning frame, the mounted component is pressed against the board by the presser spring, and the mounted component is electrically connected to the board.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, a positioning frame 3 having a through hole 3a that matches the outer shape of the mounted component 2 to be attached or removed is attached to the upper surface of the substrate 1 having lead terminals 1a, and the mounted component 2 is attached to the substrate 1 in the frame 3. Presser spring 4 to press
will be established. This presser spring 4 is curved on both sides to form hook parts 4a, 4a, while the frame 3 has protrusions 3b, 3b protruding from both side edges. To attach the mounting component 2, use the hooks 4a, 4a of the spring 4.
are hooked onto the protrusions 3b, 3b of the frame 3, respectively, and the both sides of the spring 4 are bent upward, so that the central portion 4
A downward spring force is generated at b, and the spring force is used to press the head of the mounted component 2 positioned on the frame 3 to fix the component 2 to the board 1. To electrically connect the component 5 fixed to the bottom surface of the board 1 and the mounted component 2, a conductive rubber 6 is interposed between the conductor portion formed on the top surface of the board 1 and the mounted component 2. Then, using the spring force of the spring 4, the conductor portion of the substrate 1 and the lead portion of the mounted component 2 are brought into contact with both sides of the conductive rubber 6, respectively. Note that the parts 2 and 5 may be electrically connected using something other than the conductive rubber 6. On the other hand, remove the presser spring 4 from the frame 3 and
Remove the spring force applied to and replace the mounted part 2.

FIG. 2 shows another embodiment of the present invention. In the embodiment shown in FIG. 1, the presser spring 4 is completely removed from the frame 3, but in the embodiment shown in FIG. 2, the presser spring 4 is pinned to the frame 3. That is, hinges 7a and 7b are provided on the presser spring 4 and the frame 3, respectively, and both hinges 7a and 7b are connected by a pin 8, so that the presser spring 4 is pivotally supported on the frame 3 so as to be openable and closable. This one has a presser spring 4 and a frame 3
It is tilted to the side and the hooking part 4a is hooked on the hooking part 3b of the frame 3, and the mounted component 2 is pressed and fixed to the board 1 by the presser foot 4c of the spring 4. On the other hand, both hooking parts 4a,
By releasing the engagement between the parts 3b, the presser spring 4 is opened and the parts can be replaced. In this embodiment, the presser spring 4
Since it is pinned to the frame 3, the presser spring 4 will not be lost when replacing mounted parts.

FIG. 3 shows another embodiment of the present invention. In the previous embodiment shown in FIGS. 1 and 2, the mounted component 2 was housed in the through hole 3a of the frame 3 and its position was determined. Due to this gap, the component 4 may be biased to one side within the frame 3, resulting in misalignment between the lead portion of the component 4 and the conductor portion of the board 1. Therefore, in FIG. 3, leaf springs 9, 9 are installed in the through hole 3a of the frame
... are provided, and the spring force of the plate springs 9, 9 presses the mounted component 2 evenly from all sides to eliminate misalignment between the lead portion of the component 4 and the conductor portion of the board 1.

In addition, in the previous embodiment, the opposing two parts of the presser spring 4
Spring force is applied to the mounted component 2 by hooking the sides to the frame 3, but in the embodiment shown in Fig. 3, the four sides of the presser spring 4 are hooked to the frame 3 to stably fix the mounted component 2. It was designed to do so. That is, in addition to the latching parts 3b, 3b provided at the front and rear ends of the frame 3, latching parts 3c, 3c (however, the latching part on one side is not shown) are provided on both sides of the frame 3, and the front and rear ends of the presser spring 4 are The hooks 4a, 4a are connected to the hooks 3 at the front and rear ends of the frame 3.
b, 3b, and hooks the claws 10, 10 provided on both sides of the presser spring 4 into the hooks 3 on both sides of the frame 3.
A spring force is generated in the center portion 4b of the presser spring 4 by hooking it on the springs c and 3c. Therefore, since the presser spring 4 is bent from all sides, the center portion 4
The spring force acts evenly on the mounting component 2 due to b, and the mounting component 2 can be stably fixed.

Note that the shapes of the frame 3 and the presser spring 4 are not limited to those shown in the drawings.

[Effect of idea]

As explained above, according to the present invention, the mounted components are positioned by the frame and mounted on the board by being pressed by the presser spring, so that the mounted components can be easily moved by simply removing the spring force. It has the effect of being able to be replaced, and by providing various circuit functions by replacing mounted parts, the range of use thereof can be expanded.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram showing one embodiment of the present invention;
FIG. 3 is an exploded perspective view showing an example of a combination of a presser spring and a frame. 1... Board, 1a... Lead terminal of board, 2...
...mounted parts, 3...frame, 4...presser spring.

Claims (1)

[Scope of utility model registration request] A frame for positioning the mounted component is mounted on a board having lead terminals, the mounted component is mounted within the positioning frame on the board, a presser spring is provided on the positioning frame and the mounted component, and the presser spring is mounted on the positioning frame and the mounted component. is hung on the positioning frame, the mounted component is pressed against the substrate by the presser spring, and the mounted component is electrically connected to the substrate.