JPH04236064A - Apparatus for transferring hot/warm heat - Google Patents

Apparatus for transferring hot/warm heat

Info

Publication number
JPH04236064A
JPH04236064A JP3002225A JP222591A JPH04236064A JP H04236064 A JPH04236064 A JP H04236064A JP 3002225 A JP3002225 A JP 3002225A JP 222591 A JP222591 A JP 222591A JP H04236064 A JPH04236064 A JP H04236064A
Authority
JP
Japan
Prior art keywords
load
heat
heat source
heat pump
condenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3002225A
Other languages
Japanese (ja)
Inventor
Shigeru Mizushima
茂 水島
Koichi Kodera
小寺 弘一
Masaru Nakazawa
賢 中澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanki Engineering Co Ltd
Original Assignee
Sanki Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanki Engineering Co Ltd filed Critical Sanki Engineering Co Ltd
Priority to JP3002225A priority Critical patent/JPH04236064A/en
Publication of JPH04236064A publication Critical patent/JPH04236064A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To drastically reduce from the conventional requirement the energy expended on the transfer of hot/warm heat source from a heat pump to a load such as an air conditioner in a system for supplying hot/warm heat source from the heat pump to the load through a hot/warm heat source transfer channel. CONSTITUTION:On the side of a load a load-side condenser 55 for exchange of heat with the cold heat of a load is placed. To this load-side condenser 55 a heat pump-side condenser 43 is connected by a hot/warm heat source transfer channel 61 which forms a circulation channel composed of a supply line 63 and a return line 65. On the side of the load in the return line 65, a liquid- receiving tank 67 which holds refrigerant in a liquid state (converts to both gaseous and liquid phases) is placed.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、ヒートポンプ装置から
の温熱源を、温熱源搬送路を介して、空調装置等の負荷
側に供給するための温熱搬送装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat transfer device for supplying a heat source from a heat pump device to a load such as an air conditioner via a heat source transfer path.

【0002】0002

【従来の技術】従来、ヒートポンプ装置からの温熱源を
、空調装置等の負荷側に供給するための温熱搬送装置と
しては、例えば、図2に示すようなものが知られている
。すなわち、図において、符号11は、ヒートポンプ装
置を示しており、このヒートポンプ装置11は、凝縮器
13と、圧縮機15と、蒸発器17とを有している。
2. Description of the Related Art Conventionally, as a heat transfer device for supplying a heat source from a heat pump device to a load side such as an air conditioner, a device as shown in FIG. 2, for example, is known. That is, in the figure, reference numeral 11 indicates a heat pump device, and this heat pump device 11 includes a condenser 13, a compressor 15, and an evaporator 17.

【0003】蒸発器17には、外気を導入するためのフ
ァン19が配置されており、また、蒸発器17と凝縮器
13との間には、膨張弁21が配置されている。凝縮器
13には、供給管路23と戻り管路25からなる温熱源
搬送路27が接続されており、この温熱源搬送路27は
、例えば、空調装置からなる負荷29に直接接続されて
いる。
A fan 19 for introducing outside air is arranged in the evaporator 17, and an expansion valve 21 is arranged between the evaporator 17 and the condenser 13. The condenser 13 is connected to a heat source conveyance path 27 consisting of a supply conduit 23 and a return conduit 25, and this heat source conveyance path 27 is directly connected to a load 29 consisting of, for example, an air conditioner. .

【0004】温熱源搬送路27には、温水が収容されて
おり、戻り管路25には、温水ポンプ31が介装されて
いる。以上のような温熱搬送装置では、ヒートポンプ装
置11の蒸発器17内で外気と熱交換したガス状のフロ
ン系冷媒等の冷媒は、圧縮機15において圧縮され、こ
の後、凝縮器13内において温熱源搬送路27の戻り管
路25の比較的温度の低い温水と熱交換し、凝縮した後
、蒸発器17に再循環する。
[0004] Hot water is stored in the heat source conveyance path 27, and a hot water pump 31 is interposed in the return pipe 25. In the heat transfer device as described above, a refrigerant such as a gaseous fluorocarbon refrigerant that has exchanged heat with the outside air in the evaporator 17 of the heat pump device 11 is compressed in the compressor 15, and then heated in the condenser 13. It exchanges heat with relatively low-temperature hot water in the return line 25 of the source conveyance line 27 and, after being condensed, is recirculated to the evaporator 17.

【0005】一方、凝縮器13内において、熱交換され
た温熱源搬送路27の供給管路23内の高温の温水は、
空調装置等の負荷29において、室内空気と熱交換され
、低温になり、温水ポンプ31の働きにより、凝縮器1
3内に再循環される。
On the other hand, in the condenser 13, the high-temperature hot water in the supply pipe line 23 of the heat source conveyance line 27, which has undergone heat exchange, is
In a load 29 such as an air conditioner, heat is exchanged with indoor air and the temperature becomes low, and by the action of the hot water pump 31, the condenser 1
Recirculated within 3.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、このよ
うな従来の温熱搬送装置では、負荷29に温熱源を供給
するための冷媒として温水を使用していたため、以下に
述べるような問題があった。すなわち、一般に、温熱源
搬送路27の冷媒に温水を使用する場合には、供給管路
23と戻り管路25との間の温度差を利用して、温熱を
搬送するため、通常用いられる温度差5〜7℃では、1
000kcalあたり200〜140kg程度の温水を
搬送する必要があり、特に、温熱源搬送路27の距離が
、100〜200mと長い時には、多大な搬送エネルギ
が必要になり、ランニングコストが増大するという問題
があった。
However, since such a conventional heat transfer device uses hot water as a refrigerant for supplying a heat source to the load 29, there are problems as described below. That is, in general, when hot water is used as the refrigerant in the heat source conveyance path 27, the temperature difference between the supply conduit 23 and the return conduit 25 is used to convey the heat, so that the temperature normally used is At a difference of 5-7℃, 1
It is necessary to transport about 200 to 140 kg of hot water per 1,000 kcal, and especially when the distance of the heat source transport path 27 is as long as 100 to 200 m, a large amount of transport energy is required and there is a problem that running costs increase. there were.

【0007】また、温熱源搬送路27の配管径を大きく
して、圧力損失を低減する必要があり、イニシャルコス
トが増大するという問題があった。さらに、温熱源搬送
路27が、屋外に配置されている時には、冬季の凍結防
止策が必要になるという問題があった。本発明は、上記
のような問題を解決したもので、温熱源をヒートポンプ
装置から負荷まで搬送するに必要な搬送エネルギを従来
より大幅に低減することのできる温熱搬送装置を提供す
ることを目的とする。
[0007] Furthermore, it is necessary to increase the pipe diameter of the heat source conveyance path 27 to reduce pressure loss, which poses a problem of increased initial cost. Furthermore, when the heat source conveyance path 27 is placed outdoors, there is a problem in that measures to prevent freezing in winter are required. The present invention solves the above-mentioned problems, and aims to provide a heat transfer device that can significantly reduce the transfer energy required to transfer a heat source from a heat pump device to a load compared to conventional methods. do.

【0008】[0008]

【課題を解決するための手段】本発明の温熱搬送装置は
、ヒートポンプ装置に配置されるヒートポンプ装置側凝
縮器からの温熱源を、温熱源搬送路を介して負荷側に供
給するための温熱搬送装置において、前記負荷側に、負
荷の冷熱と熱交換する負荷側凝縮器を配置するとともに
、この負荷側凝縮器と前記ヒートポンプ装置側凝縮器と
を、供給管路と戻り管路とからなる循環路を有する温熱
源搬送路により接続し、前記戻り管路の負荷側に、気液
相変化する冷媒を液体状態で収容する受液タンクを配置
してなるものである。
[Means for Solving the Problems] The heat transfer device of the present invention provides a heat transfer device for supplying a heat source from a heat pump device-side condenser disposed in a heat pump device to a load side via a heat source transfer path. In the device, a load-side condenser that exchanges heat with the cold heat of the load is arranged on the load side, and the load-side condenser and the heat pump device-side condenser are connected to each other by a circulation system consisting of a supply pipe line and a return pipe line. The refrigerant is connected by a heat source conveyance path having a flow path, and a liquid receiving tank is arranged on the load side of the return path to store a refrigerant in a liquid state that undergoes a gas-liquid phase change.

【0009】[0009]

【作用】本発明の温熱搬送装置では、温熱源搬送路の戻
り管路内においては気液相変化する冷媒は、液体状態と
されており、この冷媒は、ヒートポンプ装置のヒートポ
ンプ装置側凝縮器内の高温の冷媒と熱交換されガス状に
なり、供給管路を通り負荷側凝縮器内に流入され、負荷
側の比較的低温の冷媒と熱交換され、液体状態になり、
受液タンクに収容された後、ヒートポンプ装置側蒸発器
に再循環される。
[Operation] In the heat transfer device of the present invention, the refrigerant that undergoes a gas-liquid phase change in the return pipe of the heat source transfer path is in a liquid state, and this refrigerant is in the condenser on the heat pump device side of the heat pump device. It exchanges heat with the high-temperature refrigerant on the load side, becomes a gas, flows into the load-side condenser through the supply pipe, and exchanges heat with the relatively low-temperature refrigerant on the load side, becoming a liquid state.
After being stored in the liquid receiving tank, it is recirculated to the evaporator on the heat pump device side.

【0010】0010

【実施例】以下、本発明の詳細を図面に示す一実施例に
ついて説明する。図1は、本発明の温熱搬送装置の一実
施例を示すもので、図において符号41は、ヒートポン
プ装置を示しており、このヒートポンプ装置41は、ヒ
ートポンプ装置側凝縮器43と、圧縮機45と、蒸発器
47とを有している。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, details of the present invention will be described with reference to an embodiment shown in the drawings. FIG. 1 shows an embodiment of the heat transfer device of the present invention. In the figure, reference numeral 41 indicates a heat pump device, and this heat pump device 41 includes a heat pump device side condenser 43, a compressor 45, , and an evaporator 47.

【0011】蒸発器47には、外気を導入するためのフ
ァン49が配置されており、また、蒸発器47とヒート
ポンプ装置側凝縮器43との間には、膨張弁51が配置
されている。しかして、この実施例では、空調装置等の
負荷53側には、負荷53の冷熱と熱交換する負荷側凝
縮器55が配置され、この負荷側凝縮器55には、負荷
53に温水を循環する温水配管57が挿通されている。
A fan 49 for introducing outside air is arranged in the evaporator 47, and an expansion valve 51 is arranged between the evaporator 47 and the condenser 43 on the heat pump device side. In this embodiment, a load-side condenser 55 that exchanges heat with the cold heat of the load 53 is disposed on the load 53 side such as an air conditioner, and this load-side condenser 55 circulates hot water to the load 53. A hot water pipe 57 is inserted therethrough.

【0012】この温水配管57には、温水を循環する温
水ポンプ59が配置されている。負荷側凝縮器55とヒ
ートポンプ装置側凝縮器43とを接続して温熱源搬送路
61が配置されている。この温熱源搬送路61は、供給
管路63と戻り管路65とからなる循環路により形成さ
れている。
A hot water pump 59 for circulating hot water is disposed in the hot water pipe 57. A heat source conveyance path 61 is arranged to connect the load side condenser 55 and the heat pump device side condenser 43. This heat source conveyance path 61 is formed by a circulation path consisting of a supply pipe line 63 and a return pipe line 65.

【0013】戻り管路65の負荷側凝縮器55側には、
例えば、フロン系冷媒のように気液相変化する冷媒を液
体状態で収容する受液タンク67が配置されている。受
液タンク67の下流側には、液ポンプ69が配置されて
いる。この液ポンプ69は、受液タンク67内に配置さ
れる液面センサ71からの信号によりオン,オフされる
ように構成されている。
On the load side condenser 55 side of the return line 65,
For example, a liquid receiving tank 67 is arranged to accommodate a refrigerant that changes gas-liquid phase, such as a fluorocarbon-based refrigerant, in a liquid state. A liquid pump 69 is arranged downstream of the liquid receiving tank 67. The liquid pump 69 is configured to be turned on and off by a signal from a liquid level sensor 71 disposed within the liquid receiving tank 67.

【0014】すなわち、この実施例では、受液タンク6
7内の液面が、所定の液位に達すると、液ポンプ69が
自動起動されるように構成されている。以上のように構
成された温熱搬送装置では、ヒートポンプ装置41の蒸
発器47内で外気と熱交換しガス状となった、例えば、
フロン系冷媒等の冷媒は、圧縮機45により圧縮され、
この後、ヒートポンプ装置側凝縮器43内において温熱
源搬送路61の戻り管路65の比較的温度の低い液体状
の冷媒と熱交換し、凝縮した後、蒸発器47に再循環さ
れる。
That is, in this embodiment, the liquid receiving tank 6
When the liquid level in 7 reaches a predetermined liquid level, the liquid pump 69 is configured to be automatically started. In the heat transfer device configured as described above, heat is exchanged with the outside air in the evaporator 47 of the heat pump device 41 and becomes gaseous, for example.
A refrigerant such as a fluorocarbon refrigerant is compressed by a compressor 45,
Thereafter, the refrigerant exchanges heat with the relatively low temperature liquid refrigerant in the return pipe 65 of the heat source transfer path 61 in the heat pump apparatus side condenser 43, is condensed, and is then recirculated to the evaporator 47.

【0015】一方、温熱源搬送路61の戻り管路65内
においては気液相変化する冷媒は、液体状とされており
、この冷媒は、ヒートポンプ装置41のヒートポンプ装
置側凝縮器43内の高温の冷媒と熱交換されガス状にな
り、供給管路63を通り負荷側凝縮器55内に流入され
、負荷53側の温水配管57の比較的低温の温水と熱交
換され、液体状態になり、受液タンク67内に収容され
、戻り管路65からヒートポンプ装置側凝縮器43に再
循環される。
On the other hand, the refrigerant that undergoes a gas-liquid phase change in the return pipe 65 of the heat source conveyance path 61 is in a liquid state, and this refrigerant is heated to a high temperature in the condenser 43 on the heat pump device side of the heat pump device 41. It exchanges heat with the refrigerant, becomes a gas, flows into the load-side condenser 55 through the supply pipe 63, exchanges heat with the relatively low-temperature hot water in the hot water pipe 57 on the load 53 side, and becomes a liquid. The liquid is stored in the liquid receiving tank 67 and recirculated to the heat pump device side condenser 43 through the return pipe line 65.

【0016】しかして、以上のように構成された温熱搬
送装置では、負荷53側に、負荷53の冷熱と熱交換す
る負荷側凝縮器55を配置するとともに、この負荷側凝
縮器55とヒートポンプ装置側凝縮器43とを、供給管
路63と戻り管路65とからなる循環路を有する温熱源
搬送路61により接続し、戻り管路65の負荷側凝縮器
55側に、気液相変化する冷媒を液体状態で収容する受
液タンク67を配置したので、温熱源をヒートポンプ装
置41から負荷まで搬送するに必要な搬送エネルギを従
来より大幅に低減することが可能となる。
In the heat transfer device configured as described above, a load-side condenser 55 for exchanging heat with the cold heat of the load 53 is disposed on the load 53 side, and the load-side condenser 55 and the heat pump device The side condenser 43 is connected by a heat source transfer path 61 having a circulation path consisting of a supply pipe line 63 and a return pipe line 65, and a gas-liquid phase change occurs on the load side condenser 55 side of the return pipe line 65. Since the liquid receiving tank 67 that accommodates the refrigerant in a liquid state is provided, it is possible to significantly reduce the transport energy required to transport the heat source from the heat pump device 41 to the load compared to the conventional method.

【0017】すなわち、以上のように構成された温熱搬
送装置では、温熱源搬送路61の冷媒に気液相変化する
冷媒を使用し、この冷媒の潜熱によりエネルギを搬送す
るようにしたので、1000kcalのエネルギを搬送
するのに、例えば、従来の10分の1程度の約20kg
程度の冷媒の搬送で良くなり、温熱源をヒートポンプ装
置41から負荷53まで搬送するに必要な搬送エネルギ
を従来より大幅に低減することができ、ランニングコス
トを従来より大幅に削減することが可能となる。
That is, in the heat transfer device configured as described above, a refrigerant that undergoes a gas-liquid phase change is used as the refrigerant in the heat source transfer path 61, and energy is transferred by the latent heat of this refrigerant. For example, it takes about 20 kg, which is about one-tenth of the conventional energy, to transport
This makes it possible to significantly reduce the transport energy required to transport the heat source from the heat pump device 41 to the load 53 compared to the conventional method, and to significantly reduce running costs compared to the conventional method. Become.

【0018】また、搬送エネルギが小さくなるため、特
別に、温熱源搬送路61の配管径を大きくして、圧力損
失を低減する必要がなくなり、イニシャルコストを低減
することができる。さらに、温熱源搬送路61が、屋外
に配置されている時にも、凍結する虞れがないため、冬
季の凍結防止策が不要になる。
Furthermore, since the transport energy is reduced, there is no need to specially increase the piping diameter of the heat source transport path 61 to reduce pressure loss, and the initial cost can be reduced. Furthermore, even when the heat source conveyance path 61 is placed outdoors, there is no risk of freezing, so there is no need to take measures to prevent freezing in winter.

【0019】なお、以上述べた実施例では、戻り管路6
5に液ポンプ69を介装した例について説明したが、本
発明はかかる実施例に限定されるものではなく、例えば
、負荷側凝縮器55が、ヒートポンプ装置側凝縮器43
より充分に上方にある時には、液ポンプを配置しなくて
も良いことは勿論である。
Note that in the embodiment described above, the return pipe 6
Although an example has been described in which a liquid pump 69 is installed in the heat pump device side condenser 43, the present invention is not limited to such an example.
Of course, when it is located sufficiently above, it is not necessary to arrange the liquid pump.

【0020】[0020]

【発明の効果】以上述べたように、本発明の温熱搬送装
置では、負荷側に、負荷の冷熱と熱交換する負荷側凝縮
器を配置するとともに、この負荷側凝縮器とヒートポン
プ装置側凝縮器とを、供給管路と戻り管路とからなる循
環路を有する温熱源搬送路により接続し、戻り管路の負
荷側に、気液相変化する冷媒を液体状態で収容する受液
タンクを配置したので、温熱源をヒートポンプ装置から
負荷まで搬送するに必要な搬送エネルギを従来より大幅
に低減することができるという利点がある。
As described above, in the heat transfer device of the present invention, a load side condenser that exchanges heat with cold heat of the load is arranged on the load side, and the load side condenser and the heat pump device side condenser are arranged on the load side. are connected by a heat source conveyance path having a circulation path consisting of a supply pipe and a return pipe, and a liquid receiving tank containing a refrigerant that changes gas-liquid phase in a liquid state is arranged on the load side of the return pipe. Therefore, there is an advantage that the transport energy required to transport the heat source from the heat pump device to the load can be significantly reduced compared to the conventional method.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の温熱搬送装置の一実施例を示す配管系
統図である。
FIG. 1 is a piping system diagram showing an embodiment of a thermal transfer device of the present invention.

【図2】従来の温熱搬送装置を示す配管系統図である。FIG. 2 is a piping system diagram showing a conventional heat transfer device.

【符号の説明】[Explanation of symbols]

41  ヒートポンプ装置 43  ヒートポンプ装置側凝縮器 53  負荷 55  負荷側凝縮器 61  温熱源搬送路 63  供給管路 65  戻り管路 67  受液タンク 41 Heat pump device 43 Heat pump equipment side condenser 53 Load 55 Load side condenser 61 Heat source conveyance path 63 Supply pipeline 65 Return pipe 67 Liquid receiving tank

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  ヒートポンプ装置に配置されるヒート
ポンプ装置側凝縮器からの温熱源を、温熱源搬送路を介
して負荷側に供給するための温熱搬送装置において、前
記負荷側に、負荷の冷熱と熱交換する負荷側凝縮器を配
置するとともに、この負荷側凝縮器と前記ヒートポンプ
装置側凝縮器とを、供給管路と戻り管路とからなる循環
路を有する温熱源搬送路により接続し、前記戻り管路の
負荷側に、気液相変化する冷媒を液体状態で収容する受
液タンクを配置してなることを特徴とする温熱搬送装置
1. A heat transfer device for supplying a heat source from a heat pump device-side condenser disposed in a heat pump device to a load side via a heat source transfer path, wherein the load side is provided with cold heat and heat from the load. A load-side condenser for heat exchange is arranged, and the load-side condenser and the heat pump device side condenser are connected by a heat source conveyance path having a circulation path consisting of a supply pipe line and a return pipe line, A heat transfer device characterized in that a liquid receiving tank is disposed on the load side of a return pipe line to accommodate a refrigerant that undergoes a gas-liquid phase change in a liquid state.
JP3002225A 1991-01-11 1991-01-11 Apparatus for transferring hot/warm heat Pending JPH04236064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3002225A JPH04236064A (en) 1991-01-11 1991-01-11 Apparatus for transferring hot/warm heat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3002225A JPH04236064A (en) 1991-01-11 1991-01-11 Apparatus for transferring hot/warm heat

Publications (1)

Publication Number Publication Date
JPH04236064A true JPH04236064A (en) 1992-08-25

Family

ID=11523416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3002225A Pending JPH04236064A (en) 1991-01-11 1991-01-11 Apparatus for transferring hot/warm heat

Country Status (1)

Country Link
JP (1) JPH04236064A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008304148A (en) * 2007-06-08 2008-12-18 Toyo Eng Works Ltd Cooling system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62129632A (en) * 1985-11-29 1987-06-11 Osaka Gas Co Ltd Heat transfer device
JPH0242384A (en) * 1988-08-03 1990-02-13 Nec Corp Cooling device for electronic equipment
JPH02213625A (en) * 1989-02-13 1990-08-24 Matsushita Refrig Co Ltd Multiroom cooling heating device
JPH03195839A (en) * 1989-12-26 1991-08-27 Matsushita Refrig Co Ltd Air-conditioner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62129632A (en) * 1985-11-29 1987-06-11 Osaka Gas Co Ltd Heat transfer device
JPH0242384A (en) * 1988-08-03 1990-02-13 Nec Corp Cooling device for electronic equipment
JPH02213625A (en) * 1989-02-13 1990-08-24 Matsushita Refrig Co Ltd Multiroom cooling heating device
JPH03195839A (en) * 1989-12-26 1991-08-27 Matsushita Refrig Co Ltd Air-conditioner

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008304148A (en) * 2007-06-08 2008-12-18 Toyo Eng Works Ltd Cooling system

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