JPH0423846A - Styrene-based resin composition - Google Patents

Styrene-based resin composition

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Publication number
JPH0423846A
JPH0423846A JP12630290A JP12630290A JPH0423846A JP H0423846 A JPH0423846 A JP H0423846A JP 12630290 A JP12630290 A JP 12630290A JP 12630290 A JP12630290 A JP 12630290A JP H0423846 A JPH0423846 A JP H0423846A
Authority
JP
Japan
Prior art keywords
parts
resin
styrene
pts
polyethylene glycol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12630290A
Other languages
Japanese (ja)
Inventor
Michio Yasuda
安田 道生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries Ltd filed Critical Daicel Chemical Industries Ltd
Priority to JP12630290A priority Critical patent/JPH0423846A/en
Publication of JPH0423846A publication Critical patent/JPH0423846A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To obtain a resin composition, excellent in flame retardancy, antistatic properties and scuff resistance and suitable as electronic and electrical equipment parts or automotive parts, etc., by blending a styrene-based resin with a halogen-based flame retardant, polyethylene glycol and a sodium soulfonate. CONSTITUTION:A resin composition is obtained by blending (A) 100 pts.wt. styrene-based resin (e.g. ABS resin or AS resin) with (B) 3-50 pts.wt., preferably 6-35 pts.wt. halogen-based flame retardant, (C), 0.1-10 pts.wt. polyethylene glycol having >=5000, preferably >=6000 molecular weight and (D) 0.1-8 pts.wt. sodium sulfonate (preferably sodium laurylsulfonate and sodium dodecylbenzenesulfonate) expressed by the formula (R is alkyl or aromatic residue which may have a substituent group) and, as necessary, adding a plasticizer, a heat stabilizer, a reinforcing agent, etc., thereto.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、スチレン系樹脂組成物に関し、詳しくは、難
燃性に優れると共に帯電防止性に優れたスチレン系樹脂
組成物に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a styrenic resin composition, and more particularly, to a styrenic resin composition that has excellent flame retardancy and antistatic properties.

(従来の技術及び発明が解決しようとする課題)スチレ
ン系樹脂は加工性、物理的特性が優れていることから各
種の用途に用いられているが、近年に至って、電気機器
部品、自動車部品等の用途において難燃化及び帯電防止
性、更には耐傷性の要求が高まっている。
(Prior art and problems to be solved by the invention) Styrenic resins are used for various purposes due to their excellent processability and physical properties. There is an increasing demand for flame retardancy, antistatic properties, and scratch resistance in applications such as:

従来スチレン系樹脂に難燃性と帯電防止性を単独で付与
する方法は数多く報告されている。しかし、この二つの
性質を同時に付与することは、特に難燃性の低下をひき
おこすなどの問題を有している。
Many methods have been reported for independently imparting flame retardancy and antistatic properties to styrenic resins. However, imparting these two properties at the same time poses problems such as a decrease in flame retardancy.

(課題を解決するための手段) 難燃性、帯電防止性及び耐優性を得るべく鋭意検討した
結果、スチレン系樹脂に特定の添加剤系を配合すること
により上と目的が効果的に達成されることを見出し本発
明に到達した。
(Means for solving the problem) As a result of intensive studies to obtain flame retardancy, antistatic properties, and superior resistance, we found that the above objectives were effectively achieved by blending a specific additive system with styrene resin. The present invention was achieved based on this discovery.

すなわち本発明は (^)スチレン系樹脂100部に (B)ハロゲン系難燃剤 3〜50部、(C)分子量5
,000辺上のポリエチレングリコール   0.1〜
10部、 (D)一般式R−8O”Na (ただし式中Rはアルキル基又は、置換基を有するか有
しない芳香族残基である。)で表されるスルホン酸ナト
リウム0.1〜8部、よりなることを特徴とするスチレ
ン系樹脂組成物を提供するものである。
That is, the present invention includes (^) 100 parts of styrene resin, (B) 3 to 50 parts of halogen flame retardant, and (C) molecular weight 5.
,000 sides of polyethylene glycol 0.1~
10 parts, (D) 0.1-8 sodium sulfonate represented by the general formula R-8O"Na (wherein R is an alkyl group or an aromatic residue with or without a substituent) The object of the present invention is to provide a styrenic resin composition comprising:

本発明におけるスチレン系樹脂とは、ポリスチレン、ポ
リメチルスチレン等のスチレン系ホモポリマー、スチレ
ン−メチルスチレン、スチレン−ジビニルベンゼン、ス
チレン−ゴム質(Hlポリスチレン樹脂と称される。)
、スチレン−アクリロニトリル(AS樹脂と称される。
In the present invention, styrene resins include polystyrene, styrene homopolymers such as polymethylstyrene, styrene-methylstyrene, styrene-divinylbenzene, and styrene-rubber (referred to as Hl polystyrene resin).
, styrene-acrylonitrile (referred to as AS resin).

)、スチレン−ゴム質−アクリロニトリル(ABS樹脂
、AC8樹脂、AAS樹脂、AES樹脂と称される。)
等の共重合物又はこれらの配合物又はこれらの樹脂と他
の樹脂の配合物である。
), styrene-rubber-acrylonitrile (referred to as ABS resin, AC8 resin, AAS resin, AES resin).
or blends of these resins and other resins.

本発明に用いるハロゲン系難燃剤は臭素系、塩素系の難
燃剤であり例えばテトラブロモビスフェノールA (T
BA) 、TBAカーボネートオリゴマー、臭素化ビス
フェノールA型エポキシ重合体、デカブロモジフェニル
エーテル、ビス(トリブロモフェノキシ)エタン、パー
クロロシクロペンタデカン、トリス(トリブロモネオペ
ンチル)フォスフェート、及び塩素化パラフィンなどで
ありスチレン系樹脂100部に対してこれらのうち1種
又は、2種辺上の混合物を3〜50部、特に6〜35部
添加することが好ましい。この添加量が3部未満では充
分な難燃性が得られず、又50部を越えると耐衝撃性等
の機械的物性の低下が大きくて好ましくない。
The halogen-based flame retardant used in the present invention is a bromine-based or chlorine-based flame retardant, such as tetrabromobisphenol A (T
BA), TBA carbonate oligomer, brominated bisphenol A type epoxy polymer, decabromodiphenyl ether, bis(tribromophenoxy)ethane, perchlorocyclopentadecane, tris(tribromoneopentyl)phosphate, and chlorinated paraffin. It is preferable to add 3 to 50 parts, particularly 6 to 35 parts of a mixture of one or two of these to 100 parts of styrenic resin. If the amount added is less than 3 parts, sufficient flame retardancy will not be obtained, and if it exceeds 50 parts, mechanical properties such as impact resistance will be greatly reduced, which is not preferable.

本発明に用いるポリエチレングリコールは分子量が5,
000辺上、特にe、ooo辺上のものが好ましい。分
子量が5,000未満では得られたABS樹脂の荷重た
わみ温度が著しく低下すると共にアイゾツト衝撃強さを
低下させる。ポリエチレングリコールの添加量は0.1
部〜10部添加することが必要である。ポリエチレング
リコールの添加量が0.1部未満であると帯電防止性が
充分でないうえに耐傷性が低下する。又、ポリエチレン
グリコールの添加量が10部を越えるとスチレン系樹脂
への溶解が困難となり層状剥離現象が生じ好ましくない
The polyethylene glycol used in the present invention has a molecular weight of 5,
Those on the 000 side, particularly on the e and ooo sides, are preferable. When the molecular weight is less than 5,000, the deflection temperature under load of the resulting ABS resin is significantly lowered, and the Izot impact strength is also lowered. The amount of polyethylene glycol added is 0.1
It is necessary to add 1 part to 10 parts. If the amount of polyethylene glycol added is less than 0.1 part, the antistatic property will not be sufficient and the scratch resistance will decrease. Moreover, if the amount of polyethylene glycol added exceeds 10 parts, it becomes difficult to dissolve in the styrene resin, resulting in delamination phenomenon, which is not preferable.

本発明に用いるスルホン酸ナトリウムは一般式%式% (ただし式中Rはアルキル基又は、置換基を有するか有
しない芳香族残基である。)で表されるスルホン酸ナト
リウムであり、Rは炭素数8〜22の直鎖もしくは分岐
鎖アルキル基または炭素数8〜22の直鎖もしくは分岐
鎖アルキル基を有するか有しない芳香族残基が好ましく
なかでもラウリルスルホン酸ナトリウム及びドデシルベ
ンゼンスルホン酸ナトリウムの使用が好ましい。
The sodium sulfonate used in the present invention is a sodium sulfonate represented by the general formula % (wherein R is an alkyl group or an aromatic residue with or without a substituent), where R is Straight-chain or branched alkyl groups having 8 to 22 carbon atoms or aromatic residues with or without straight-chain or branched alkyl groups having 8 to 22 carbon atoms are preferred, especially sodium lauryl sulfonate and sodium dodecylbenzenesulfonate. It is preferable to use

これらスルホン酸ナトリウム塩の添加量は011〜8部
が適当であり、0.1部未満では充分な帯電防止性が得
られず、8部を越えるとスチレン系樹脂の機械的性質の
低下が大きくなるため好ましくない。
The appropriate amount of these sodium sulfonic acid salts to be added is between 0.1 and 8 parts; if it is less than 0.1 part, sufficient antistatic properties cannot be obtained, and if it exceeds 8 parts, the mechanical properties of the styrene resin will deteriorate significantly. This is not desirable.

スチレン系樹脂に対して難燃剤とスルホン酸ナトリウム
塩を添加する事により難燃性と帯電防止性を付与するこ
とができるが、成形品同士が衝突する際に生じる傷が付
き易いという問題を有している。そこで、ポリエチレン
グリコールを添加することにより耐優性を付与し、更に
難燃性を低下させることなく帯電防止性を飛躍的に向上
させることができる。すなわち、これら3種類を組み合
わせて始めて、難燃性、帯電防止性及び耐傷性の優れた
スチレン系樹脂を与えるものである。
Flame retardancy and antistatic properties can be imparted to styrene resin by adding flame retardants and sodium sulfonate salts, but this poses the problem of easy scratches that occur when molded products collide with each other. are doing. Therefore, by adding polyethylene glycol, it is possible to impart superiority and dramatically improve antistatic properties without reducing flame retardancy. That is, only by combining these three types can a styrenic resin with excellent flame retardancy, antistatic properties, and scratch resistance be obtained.

又、本発明組成物に対して、本発明の目的を損なわない
範囲で可塑剤、熱安定剤、紫外線吸収剤、顔料、染料等
あるいはガラス繊維、ガラスピーズ、アスベスト等の強
化剤、更に難燃助剤として三酸化アンチモンを含有する
ことができる。
In addition, the composition of the present invention may be added with plasticizers, heat stabilizers, ultraviolet absorbers, pigments, dyes, etc., reinforcing agents such as glass fibers, glass beads, asbestos, etc., and flame retardants to the extent that does not impair the purpose of the present invention. Antimony trioxide can be included as an auxiliary agent.

本発明の組成物の製造法は特に限定されるものではない
が、スチレン系樹脂、ハロゲン系難燃剤、ポリエチレン
グリコール及びスルホン酸ナトリウムを同時に予備混合
したものを一軸混練押出機、二軸混練押出機、バンバリ
ーミキサ−、ニーダ−などの通常の溶融混線加工装置に
供給し、加熱溶融混練することにより容易に製造できる
。さらに、射出成形、圧縮成形、押出成形などによって
各種用途の成形品に加工することができる。
The method for producing the composition of the present invention is not particularly limited, but a styrene resin, a halogen flame retardant, polyethylene glycol, and sodium sulfonate are simultaneously premixed and mixed using a single-screw kneading extruder or a twin-screw kneading extruder. , a Banbury mixer, a kneader, etc., and heat, melt, and knead the mixture. Furthermore, it can be processed into molded products for various uses by injection molding, compression molding, extrusion molding, etc.

(実施例) 以下、本発明を実施例により更に具体的に説明するが、
本発明はこれら実施例に限定されるものではない。
(Example) Hereinafter, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited to these examples.

実施例中に説明する成形品の性能テストは下記の方法に
従って行った。
Performance tests of the molded products described in the examples were performed according to the following method.

[難燃性] アンダーライターズ・ラボラトリ−(アメリカ)UL規
格。
[Flame retardant] Underwriters Laboratory (USA) UL standard.

UL−94(1985年9月3日付第3版)に基づく燃
焼試験。
Flammability test based on UL-94 (3rd edition dated September 3, 1985).

[帯電防止性コ 200℃で射出成形した50■■X 50 n+ X 
3 mar(厚み)角板成形品の表面固有抵抗を超絶縁
抵抗器を用いて測定した。(23℃、65%RH雰囲気
下) [耐傷性] 成形品同士の衝突により生じる傷は、成形品の硬度が高
い程傷が付きにくいことから、ASTM試験法D 78
5に基づいてロックウェル硬さを測定した。
[Antistatic properties] Injection molded at 200°C 50 x 50 n+
The surface resistivity of a 3 mar (thickness) square plate molded product was measured using a superinsulation resistor. (23°C, 65% RH atmosphere) [Scratch resistance] The higher the hardness of the molded products, the less likely they will be damaged by collisions between molded products, so ASTM test method D 78
Rockwell hardness was measured based on 5.

[アイゾツト衝撃強さ] ASTM試験法D256に基づいて測定した。[Izotsu impact strength] Measured based on ASTM test method D256.

[荷重たわみ温度] ASTM試験法D648に基づいて測定した。[Load deflection temperature] Measured based on ASTM test method D648.

実施例1 ポリブタジェン40%、アクリロニトリル15%、スチ
レン45%のABS樹脂とアクリロニトリル30%、ス
チレン70%のAS樹脂を1対1の割合で配合した混合
樹脂100部に対してテトラブロモビスフェノールAを
20部、三酸化アンチモンを7部、分子量20,000
のポリエチレングリコール6部、ラウリルスルホン酸ナ
トリウム2部を添加し、200℃に設定し40wΦ押出
機(ベント付き)で溶融混合して、チップ化した。つい
で、200℃で射出成形して成形品とし、性能テストを
行った。結果を表−1に示す。
Example 1 20% of tetrabromobisphenol A was added to 100 parts of a mixed resin in which an ABS resin containing 40% polybutadiene, 15% acrylonitrile, and 45% styrene was blended with an AS resin containing 30% acrylonitrile and 70% styrene in a 1:1 ratio. parts, antimony trioxide 7 parts, molecular weight 20,000
6 parts of polyethylene glycol and 2 parts of sodium lauryl sulfonate were added thereto, and the mixture was melted and mixed in a 40wΦ extruder (with a vent) at 200°C to form chips. Then, injection molding was performed at 200° C. to obtain a molded product, and a performance test was conducted. The results are shown in Table-1.

実施例2 実施例1のテトラブロモビスフェノールAの代わりにT
BAカーボネートオリゴマーを25部用いた以外は実施
例1と同様に行った。結果を表=1に示す。
Example 2 T instead of tetrabromobisphenol A in Example 1
The same procedure as in Example 1 was carried out except that 25 parts of BA carbonate oligomer was used. The results are shown in Table 1.

実施例3 実施例1のテトラブロモビスフェノールAの代わりに臭
素化ビスフェノールAエポキシ重合体をを25部用いた
以外は実施例1と同様に行った。
Example 3 The same procedure as in Example 1 was carried out except that 25 parts of brominated bisphenol A epoxy polymer was used instead of tetrabromobisphenol A in Example 1.

結果を表−1に示す。The results are shown in Table-1.

実施例4 実施例1のテトラブロモビスフェノールAの代わりにデ
カブロモヂフェニルエーテルをを20部用いた以外は実
施例1と同様に行った。結果を表−1に示す。
Example 4 The same procedure as in Example 1 was carried out except that 20 parts of decabromodiphenyl ether was used instead of tetrabromobisphenol A in Example 1. The results are shown in Table-1.

実施例5 実施例1のテトラブロモビスフェノールAの代わりにビ
ス(トリブロモフェノキシ)エタンを25部用いた以外
は実施例1と同様に行った。結果を表−1に示す。
Example 5 The same procedure as in Example 1 was carried out except that 25 parts of bis(tribromophenoxy)ethane was used instead of tetrabromobisphenol A in Example 1. The results are shown in Table-1.

実施例6 実施例1のテトラブロモビスフェノールAの代わりにパ
ークロロシクロペンタデカンを20部と臭素化ビスフェ
ノールAエポキシ重合体を15部用いた以外は実施例1
と同様に行った。結果を表1に示す。
Example 6 Example 1 except that 20 parts of perchlorocyclopentadecane and 15 parts of brominated bisphenol A epoxy polymer were used instead of tetrabromobisphenol A in Example 1.
I did the same thing. The results are shown in Table 1.

実施例7 実施例1のテトラブロモビスフェノールAの代わりにト
リス(トリブロモネオペンチル)フォスフェートを10
部と臭素化ビスフェノールAエポキシ重合体を15部用
いた以外は実施例1と同様に行った。結果を表−1に示
す。
Example 7 Tris (tribromoneopentyl) phosphate was used in place of tetrabromobisphenol A in Example 1.
Example 1 was repeated except that 15 parts of brominated bisphenol A epoxy polymer and 15 parts of brominated bisphenol A epoxy polymer were used. The results are shown in Table-1.

比較例1 ポリブタジェン40%、アクリロニトリル15%、スチ
レン55%のABS樹脂とアクリロニトリル45%、ス
チレン55%のAS樹脂を1対1の割合で配合したAB
S樹脂を220”Cで射出成形して成形品とし、性能テ
ストを行った。結果は表−2に示す如く、難燃性、帯電
防止性、耐傷性いずれも不良であった。
Comparative Example 1 AB containing ABS resin containing 40% polybutadiene, 15% acrylonitrile, and 55% styrene and AS resin containing 45% acrylonitrile and 55% styrene in a 1:1 ratio.
A molded article was made by injection molding S resin at 220"C, and a performance test was conducted. As shown in Table 2, the flame retardancy, antistatic property, and scratch resistance were all poor.

比較例2 比較例1のABS、AS混合樹脂100部に対してテト
ラブロモビスフェノールAを20部、三酸化アンチモン
7部を添加した以外は比較例1と同様に行った。結果を
表−2に示す如く、帯電防止性及び耐傷性いずれも不良
であった。
Comparative Example 2 The same procedure as Comparative Example 1 was carried out except that 20 parts of tetrabromobisphenol A and 7 parts of antimony trioxide were added to 100 parts of the ABS/AS mixed resin of Comparative Example 1. As shown in Table 2, both antistatic properties and scratch resistance were poor.

比較例3 比較例2に脂肪酸ペンタエリスリット(帯電防止剤)を
3部添加した以外は比較例2と同様に行った。結果を表
−2に示す如く、燃焼性及び耐傷性いずれも不良であっ
た。
Comparative Example 3 The same procedure as Comparative Example 2 was carried out except that 3 parts of fatty acid pentaerythritol (antistatic agent) was added to Comparative Example 2. As shown in Table 2, both flammability and scratch resistance were poor.

比較例4 比較例2にラウリルトリメチルアンモニウムクロライド
(帯電防止剤)を2部添加した以外は比較例2と同様に
行った。結果を表−2に示す如く、燃焼性及び耐傷性い
ずれも不良であった。
Comparative Example 4 The same procedure as Comparative Example 2 was carried out except that 2 parts of lauryltrimethylammonium chloride (antistatic agent) was added to Comparative Example 2. As shown in Table 2, both flammability and scratch resistance were poor.

比較例5 比較例2にラウリルスルホン酸ナトリウムを2部配合し
た以外は比較例2と同様に行った。結果を表−2に示す
如く、耐傷性が不良であった。
Comparative Example 5 The same procedure as Comparative Example 2 was carried out except that 2 parts of sodium lauryl sulfonate was added to Comparative Example 2. As shown in Table 2, the scratch resistance was poor.

実施例8 実施例1の分子量20,0(toのポリエチレングリコ
ールの代わりに分子量10.000のポリエチレングリ
コールを6部添加した以外は実施例1と同様に行った。
Example 8 The same procedure as in Example 1 was carried out except that 6 parts of polyethylene glycol having a molecular weight of 10.000 was added instead of the polyethylene glycol having a molecular weight of 20.0 (to) in Example 1.

結果を表−3に示す。The results are shown in Table-3.

実施例9 実施例1の分子量20.000のポリエチレングリコー
ルの代わりに分子量e、oooのポリエチレングリコー
ルを6部添加した以外は実施例1と同様に行った。結果
を表−3に示す。
Example 9 The same procedure as in Example 1 was carried out except that 6 parts of polyethylene glycol having a molecular weight of e and ooo was added instead of the polyethylene glycol having a molecular weight of 20.000. The results are shown in Table-3.

実施例10 実施例1の分子量20 、000のポリエチレングリコ
ールの代わりに分子量Loooのポリエチレングリコー
ルを6部添加した以外は実施例1と同様に行った。結果
を表−3に示す。
Example 10 The same procedure as in Example 1 was carried out except that 6 parts of polyethylene glycol having a molecular weight of Looo was added instead of the polyethylene glycol having a molecular weight of 20.000 in Example 1. The results are shown in Table-3.

実施例11 実施例1のラウリルスルホン酸ナトリウムの代わりにド
デシルベンゼンスルホン酸ナトリウムを2部添加した以
外は実施例1と同様に行った。結果を表−3に示す。
Example 11 The same procedure as in Example 1 was carried out except that 2 parts of sodium dodecylbenzenesulfonate was added instead of sodium laurylsulfonate. The results are shown in Table-3.

(発明の効果) 辺上の詳細な説明及び実施例、比較例から明らかなよう
に、本発明の組成物はスチレン系樹脂に難燃性、帯電防
止性、耐傷性などを付与するので、塵などの付与する恐
れのある電子電機部品や自動車部品などに好適な材料を
提供するものである。
(Effects of the Invention) As is clear from the detailed description, Examples, and Comparative Examples above, the composition of the present invention imparts flame retardancy, antistatic property, scratch resistance, etc. to styrenic resin, so it is less susceptible to dust. The present invention provides a material suitable for electronic and electrical equipment parts, automobile parts, etc., which may be contaminated with such substances.

Claims (1)

【特許請求の範囲】 (A)スチレン系樹脂100部に対して (B)ハロゲン系難燃剤3〜50部、 (C)分子量5,000辺上のポリエチレングリコール
0.1〜10部、 (D)一般式R−SO_3^+Na^− (ただし式中Rはアルキル基又は、置換基を有するか有
しない芳香族残基である。)で表されるスルホン酸ナト
リウム0.1〜8部、 よりなることを特徴とするスチレン系樹脂組成物。
Scope of Claims: (A) 100 parts of styrene resin, (B) 3 to 50 parts of halogen flame retardant, (C) 0.1 to 10 parts of polyethylene glycol with a molecular weight of 5,000, (D ) 0.1 to 8 parts of sodium sulfonate represented by the general formula R-SO_3^+Na^- (wherein R is an alkyl group or an aromatic residue with or without a substituent), A styrenic resin composition characterized by:
JP12630290A 1990-05-16 1990-05-16 Styrene-based resin composition Pending JPH0423846A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12630290A JPH0423846A (en) 1990-05-16 1990-05-16 Styrene-based resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12630290A JPH0423846A (en) 1990-05-16 1990-05-16 Styrene-based resin composition

Publications (1)

Publication Number Publication Date
JPH0423846A true JPH0423846A (en) 1992-01-28

Family

ID=14931839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12630290A Pending JPH0423846A (en) 1990-05-16 1990-05-16 Styrene-based resin composition

Country Status (1)

Country Link
JP (1) JPH0423846A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100862273B1 (en) * 2008-06-12 2008-10-09 삼진폴리텍 주식회사 Absorbent Masterbatch Chip Compositions for Polystyrene Foam Trays

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100862273B1 (en) * 2008-06-12 2008-10-09 삼진폴리텍 주식회사 Absorbent Masterbatch Chip Compositions for Polystyrene Foam Trays
WO2009151237A3 (en) * 2008-06-12 2010-03-11 삼진폴리텍 주식회사 Absorbent master batch chip composition for a polystyrene foam tray
RU2472819C2 (en) * 2008-06-12 2013-01-20 Самджин Политеч Ко., Лтд. Absorbent composition of crumbs of mother batch based on polystyrene for tray made from polystyrene foam

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