JPH04250687A - Manufacture of flexible circuit board - Google Patents
Manufacture of flexible circuit boardInfo
- Publication number
- JPH04250687A JPH04250687A JP2525191A JP2525191A JPH04250687A JP H04250687 A JPH04250687 A JP H04250687A JP 2525191 A JP2525191 A JP 2525191A JP 2525191 A JP2525191 A JP 2525191A JP H04250687 A JPH04250687 A JP H04250687A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- excimer laser
- mask
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000011241 protective layer Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 20
- 238000000926 separation method Methods 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 7
- 238000002679 ablation Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 229920001721 polyimide Polymers 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract description 3
- 238000005096 rolling process Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、ロ−ル・ツ−・ロ−ル
で製作可能なエキシマレ−ザ光を用いた製品の外形加工
処理を含む可撓性回路基板の製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flexible circuit board, which includes processing the external shape of a product using excimer laser light, which can be manufactured roll-to-roll.
【０００２】0002
【従来の技術】この種の可撓性回路基板は、導電性イン
クやスクリ−ン印刷レジストインクを使用するスクリ−
ン印刷法等を除き、一般にはフォトリソグラフィ−方式
を採用するのが通常であって、この場合には露光・現像
工程、回路配線のパタ−ニングの為のエッチング工程、
表面保護層形成の為の被着工程を順次施した後、最後に
金型等を用いて打ち抜き工程を行って可撓性回路基板を
得るものであった。[Prior Art] This type of flexible circuit board is manufactured using a screen printing method using conductive ink or screen printing resist ink.
Except for printing methods, photolithography is generally used, and in this case, it involves exposure and development processes, etching processes for patterning circuit wiring,
After successive adhesion steps for forming a surface protective layer, a punching step is finally performed using a mold or the like to obtain a flexible circuit board.
【０００３】0003
【発明が解決しようとする課題】しかし、近年の部品実
装密度の高密度化により回路配線パタ−ンのみならず、
外形寸法及び最外形パタ−ンと回路基板外形との距離に
関しても、微細化、高精度化が求められてきた。また、
このような可撓性回路基板はその材料厚みが薄くその形
成工程に於いては搬送が極めて困難になり、しわ、打痕
などの欠陥発生の原因になっている。[Problem to be solved by the invention] However, due to the recent increase in component mounting density, not only circuit wiring patterns but also
There has also been a demand for miniaturization and higher precision in terms of external dimensions and the distance between the outermost pattern and the circuit board outline. Also,
Such flexible circuit boards have thin materials and are extremely difficult to transport during the forming process, causing defects such as wrinkles and dents.
【０００４】0004
【課題を解決するための手段】本発明は、可撓性回路基
板のエキシマレ−ザ加工又はエッチング工程等の製造工
程に於いても個々の可撓性回路基板を離脱させずに保持
しながら可撓性回路基板の製造に最適であって且つロ−
ル・ツ−・ロ−ル加工工程を採用可能なエキシマレ−ザ
手段を用いた可撓性回路基板の製造法を提供するもので
ある。[Means for Solving the Problems] The present invention enables flexible circuit boards to be held without being separated even during manufacturing processes such as excimer laser processing or etching of flexible circuit boards. Ideal for manufacturing flexible circuit boards and low
The present invention provides a method for manufacturing a flexible circuit board using excimer laser means that can employ a roll-to-roll processing process.
【０００５】その為に本発明の可撓性回路基板の製造法
によれば、外形分離用溝形成を一方の面からのみのエキ
シマレ−ザ照射によっておこなわず、少なくとも二度以
上の工程に分けて両面から照射し、これらエキシマレ−
ザ照射工程間にメッキ処理及びメタルマスクのエッチン
グ除去等の処理を行い、外形分離用溝の最終形成を残し
て全ての工程を終了した後、エキシマレ−ザによる製品
の最終的な外形分離用溝形成を処理するので、個々の可
撓性回路基板を離脱乃至は脱落させる虞なく、微細な構
造を有する可撓性回路基板を好適に製造できる。Therefore, according to the method of manufacturing a flexible circuit board of the present invention, the grooves for outer shape separation are not formed by excimer laser irradiation from only one side, but are performed in at least two or more steps. Irradiate from both sides, and these excimer
During the excimer laser irradiation process, processes such as plating and etching removal of the metal mask are performed, and after all processes are completed except for the final formation of the external separation groove, the final external separation groove of the product is formed using the excimer laser. Since the formation is processed, flexible circuit boards having fine structures can be suitably manufactured without the risk of individual flexible circuit boards being separated or falling off.
【０００６】上記工程に於いて、製品の最終外形分離用
溝を形成する為のアブレ−ションを回路部品の搭載後に
行うことも可能である。また、最終外形分離用溝を形成
するアブレ−ションの際、エキシマレ−ザを照射しない
他の一方の面に、少なくとも粘着材層を形成した可撓性
絶縁シ−トからなるキャリアテ−プを貼合わせて行うこ
とも可能である。[0006] In the above process, it is also possible to perform ablation to form grooves for final external separation of the product after mounting the circuit components. In addition, during ablation to form the final external separation groove, a carrier tape made of a flexible insulating sheet with at least an adhesive layer formed on the other side that is not irradiated with the excimer laser is applied. It is also possible to bond them together.
【０００７】[0007]
【実施例】以下、図示の実施例を参照しながら本発明を
更に詳述する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained in more detail below with reference to the illustrated embodiments.
【０００８】図１の（１）から（５）は本発明の好まし
い実施例に従った可撓性回路基板の製造工程を示す。先
ず、図１の（１）の如く例えば接着層のあるもの又は無
接着材型の可撓性両面導張積層板等の材料を用意し、こ
れにフォトエッチング処理を施して可撓性絶縁ベ−ス材
１の一方の面に対しては所要の回路配線パタ−ン２を形
成し、またその他方面にはメタルマスク３を形成する。
このメタルマスク３は図の如く回路基板の外形に沿って
形成した分離用溝４を有するようにエッチング形成され
ている。更に、回路配線パタ−ン２側には接着剤５を用
いてポリイミドフィルム等の保護フィルム６を貼着して
表面保護層７を形成してある。この表面保護層７は、ワ
ニス状ポリイミドを印刷塗布する手段等を利用して形成
することもできる。FIGS. 1-5 illustrate the process of manufacturing a flexible circuit board according to a preferred embodiment of the present invention. First, as shown in Figure 1 (1), a material such as a flexible double-sided conductive laminate with or without an adhesive layer is prepared, and a flexible insulating board is formed by photo-etching the material. - A required circuit wiring pattern 2 is formed on one side of the base material 1, and a metal mask 3 is formed on the other side. The metal mask 3 is etched to have a separation groove 4 formed along the outline of the circuit board as shown in the figure. Furthermore, a protective film 6 such as a polyimide film is adhered to the circuit wiring pattern 2 side using an adhesive 5 to form a surface protective layer 7. This surface protective layer 7 can also be formed by printing and applying varnish-like polyimide.
【０００９】次に、同図（２）に示す如く、エキシマレ
−ザ光Ａ１をメタルマスク３側から照射し、外形分離用
溝８をアブレ−ションにより形成するが、その際には外
形分離用溝８の底部には未アブレ−ション層９を残すよ
うに処理している。この段階で同図（３）の如くメタル
マスク３をエッチング処理で除去した後、同図（４）の
とおりメタルマスク３を除去した面に粘着層を設けるよ
うに予め構成した可撓性絶縁シ−トからなるキャリアテ
−プ１１をその粘着層が絶縁べ−ス材１の外面に貼着さ
れるように貼合わせる。Next, as shown in FIG. 2(2), the excimer laser beam A1 is irradiated from the metal mask 3 side to form the outer shape separation groove 8 by ablation. The process is performed so that an unablated layer 9 is left at the bottom of the groove 8. At this stage, the metal mask 3 is removed by etching as shown in (3) of the same figure, and then the flexible insulating film, which has been prepared in advance so as to provide an adhesive layer on the surface from which the metal mask 3 has been removed, is shown in (4) of the same figure. A carrier tape 11 made of a sheet is pasted so that its adhesive layer is adhered to the outer surface of the insulating base material 1.
【００１０】そこで、同図（５）の如く未アブレ−ショ
ン層９を残した側からこの回路基板とは別体のメタルマ
スク１０により外形分離用溝の周辺部を除いて遮光し、
メタルマスク１０の下方からエキシマレ−ザ光Ａ２を照
射して未アブレ−ション層９をアブレ−ション除去して
可撓性回路基板の製品外形加工を完了させるものである
。従って、上記の如く製品の外形加工を施して個々に分
離した可撓性回路基板はその状態で離脱することなくキ
ャリアテ−プ１１に好適に保持される。Therefore, as shown in FIG. 5 (5), from the side where the unablated layer 9 remains, a metal mask 10 separate from the circuit board is used to block light except for the periphery of the outer separation groove.
The excimer laser beam A2 is irradiated from below the metal mask 10 to ablate and remove the unablated layer 9, thereby completing the product outline processing of the flexible circuit board. Therefore, the flexible circuit boards that have been individually separated after the external shape processing of the product as described above are suitably held by the carrier tape 11 without being separated.
【００１１】[0011]
【発明の効果】本発明の可撓性回路基板の製造法によれ
ば、メッキ処理、メタルマスクのエッチング除去処理及
び洗浄処理等の各種処理工程終了後にキャリアテ−プを
貼着した状態で製品の外形を完全に分離するので、最終
工程までロ−ル・ツ−・ロ−ルでの製作を可能とするこ
とから、各種工程の搬送を好適に処理できる為、しわ、
打根等の欠陥発生を大幅に抑えることができる。[Effects of the Invention] According to the method for manufacturing a flexible circuit board of the present invention, the product can be manufactured with carrier tape attached after completing various processing steps such as plating, metal mask etching removal, and cleaning. Since the outer shape of the product is completely separated, it is possible to manufacture roll-to-roll up to the final process, which makes it possible to suitably handle transportation in various processes, eliminating wrinkles and
The occurrence of defects such as roots can be significantly suppressed.
【００１２】また、キャリアテ−プを貼着した状態で製
品の外形分離処理を最終的に施すので、個々の製品は脱
落することなくキャリアテ−プに確実に保持され、その
為、ＩＣ等の回路部品の自動搭載時の位置合わせも容易
且つ確実に処理できる。[0012] Furthermore, since the outer shape of the product is finally separated with the carrier tape attached, the individual products are securely held on the carrier tape without falling off, and as a result, ICs, etc. Positioning during automatic mounting of circuit components can be easily and reliably processed.
【００１３】従って、本発明を採用する場合には微細な
構造を有する可撓性回路基板の製品でも安定的に提供す
ることができる。Accordingly, when the present invention is adopted, even flexible circuit board products having a fine structure can be stably provided.
【図１】図１の（１）から（５）は本発明による可撓性
回路基板の製造法を説明する為の製造工程図である。FIG. 1 (1) to (5) of FIG. 1 are manufacturing process diagrams for explaining a method of manufacturing a flexible circuit board according to the present invention.
１ 可撓性絶縁べ−ス材
２ 回路配線パタ−ン
３ メタルマスク
４ メタルマスクの外形分離用溝５ 接着
剤
６ 保護フィルム
７ 表面保護層
８ 外形分離用溝
９ 未アブレ−ション層
１０ 別体のメタルマスク
Ａ１ エキシマレ−ザ光
Ａ２ エキシマレ−ザ光
１１ キャリアテ−プ1 Flexible insulating base material 2 Circuit wiring pattern 3 Metal mask 4 Groove for separating the outer shape of the metal mask 5 Adhesive 6 Protective film 7 Surface protection layer 8 Groove for outer shape separation 9 Unablated layer 10 Separate body Metal mask A1 Excimer laser beam A2 Excimer laser beam 11 Carrier tape
Claims (3)
の面に所要の回路配線パタ−ンを形成し、エキシマレ−
ザ光の照射により製品外形に適した外形分離用溝を形成
して製品外形加工を行う片面又は両面型の可撓性回路基
板を製造する為の方法に於いて、上記外形分離用溝の形
成を二度以上の工程で両面からのエキシマレ−ザ光の照
射により行うことを特徴とする可撓性回路基板の製造法
。Claim 1: A desired circuit wiring pattern is formed on at least one surface of a flexible insulating base material, and an excimer
In a method for manufacturing a single-sided or double-sided flexible circuit board in which the outer shape of the product is processed by forming outer shape separating grooves suitable for the product outer shape by irradiation with laser light, the above-mentioned outer shape separating grooves are formed. A method for manufacturing a flexible circuit board, characterized in that the steps are performed by irradiating excimer laser light from both sides in two or more steps.
路基板の外形に適した形状の分離用溝を形成するように
処理されたエキシマレ−ザ遮光用メタルマスクを形成す
る工程を含む請求項１の可撓性回路基板の製造法。2. Forming an excimer laser light-shielding metal mask on one surface of the flexible insulating base material, which is processed to form a separation groove with a shape suitable for the external shape of the circuit board. The method for manufacturing a flexible circuit board according to claim 1, comprising:
を形成する工程を含む請求項１又は２の可撓性回路基板
の製造法。3. The method of manufacturing a flexible circuit board according to claim 1, further comprising the step of forming a surface protective layer on the outer surface of the circuit wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2525191A JP2886697B2 (en) | 1991-01-26 | 1991-01-26 | Method of manufacturing flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2525191A JP2886697B2 (en) | 1991-01-26 | 1991-01-26 | Method of manufacturing flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04250687A true JPH04250687A (en) | 1992-09-07 |
| JP2886697B2 JP2886697B2 (en) | 1999-04-26 |
Family
ID=12160782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2525191A Expired - Fee Related JP2886697B2 (en) | 1991-01-26 | 1991-01-26 | Method of manufacturing flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2886697B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999059761A1 (en) * | 1998-05-21 | 1999-11-25 | Mitsubishi Denki Kabushiki Kaisha | Laser machining method |
| DE10235864A1 (en) * | 2002-08-05 | 2004-02-26 | Carl Freudenberg Kg | Production of a flat circuit support for printed circuit boards comprises applying an electrically insulating foil on a metal layer, removing the metal layer to form a conductor structure, applying a protective layer, and further processing |
| WO2024131173A1 (en) * | 2022-12-20 | 2024-06-27 | 深圳市锐尔觅移动通信有限公司 | Flexible screen and foldable electronic device |
-
1991
- 1991-01-26 JP JP2525191A patent/JP2886697B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999059761A1 (en) * | 1998-05-21 | 1999-11-25 | Mitsubishi Denki Kabushiki Kaisha | Laser machining method |
| DE10235864A1 (en) * | 2002-08-05 | 2004-02-26 | Carl Freudenberg Kg | Production of a flat circuit support for printed circuit boards comprises applying an electrically insulating foil on a metal layer, removing the metal layer to form a conductor structure, applying a protective layer, and further processing |
| WO2024131173A1 (en) * | 2022-12-20 | 2024-06-27 | 深圳市锐尔觅移动通信有限公司 | Flexible screen and foldable electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2886697B2 (en) | 1999-04-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |